Results 161 to 170 of about 11,784 (256)
Entropy comparison of benzothiadiazole-based covalent-organic frameworks. [PDF]
Kurian S +3 more
europepmc +1 more source
xx xx. ABSTRACT Diabetic foot ulcer (DFU) is a chronic complication of diabetes, primarily caused by hyperglycemia, peripheral vascular disease, and neuropathy. Characterized by persistent hyperglycemia, impaired perfusion, inflammation, and infection, DFUs pose significant challenges to healing and are associated with high morbidity and amputation ...
Tang Yuqing +5 more
wiley +1 more source
In Silico Approach for Early Antimalarial Drug Discovery: De Novo Design of Virtual Multi-Strain Antiplasmodial Inhibitors. [PDF]
Kleandrova VV +2 more
europepmc +1 more source
An intentionally added, chemically formed LixAlSy coating stabilizes the lithium–electrolyte interface in solid‐state Li–S batteries. The layer suppresses side reactions, preserves smooth charge transfer, and improves ion transport from the start. This approach offers a practical route to more durable solid‐state batteries and a clearer understanding ...
Xinyi Wang +4 more
wiley +1 more source
Analysis of Bis(trifluoromethylsulfonyl)imide Interactions with Metal Cations Through a Chemical Informatics Approach. [PDF]
Gumaste T, Cooper FL, Blakemore JD.
europepmc +1 more source
Aqueous directional ice templating (DIT) is developed for making NMC811 cathodes containing vertically aligned pore arrays through electrode thickness. The effects of calendering are studied for the DIT electrodes to find optimal calendering and simultaneously achieve high gravimetric and volumetric energy densities and rate capability for lithium ion ...
Guanting Li +3 more
wiley +1 more source
Synthesis, characterization, and hydrogen bonding analysis of copper complexes with acetate bridging: insights into interactions in crystal networks. [PDF]
Mirtamizdoust B +4 more
europepmc +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Mathematical Modeling of H1-Antihistamines: A QSPR Approach Using Topological Indices. [PDF]
Manuel M, Angamuthu P.
europepmc +1 more source
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source

