Results 151 to 160 of about 1,648,000 (303)
ZnS‐MXene‐TiO2 nanocomposite heterojunction for photocatalytic decomposition of this methylene blue dye (MB) greatly improves light absorption, charge separation, and active site area. Two‐dimensional MXene forms nanocomposites by easily combining them with 0D (quantum dots), 1D (tube and wire), 2D (plane and sheet), and 3D (particle and lamellar ...
Latiful Kabir +7 more
wiley +1 more source
Assessing Altered Coating Adhesion on Plasma‐Deoxidized Surfaces Under Oxygen‐Free Conditions
This study demonstrates the effectiveness of atmospheric pressure plasma pretreatment in modifying silicon and stainless steel surfaces to improve adhesion. Argon‐hydrogen plasma increases surface roughness and improves adhesion strength, whereas pure argon results in smoother surfaces and structural changes.
Selina Raumel +6 more
wiley +1 more source
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu +8 more
wiley +1 more source
Scattering HCl Molecules from Au(111) and Ag(111) Surfaces
In this thesis, I present an experimental molecular beam surface scattering study of dynamical processes involved when HCl molecules are scattered from Au(111) and Ag(111) surfaces. I investigated vibrational excitation, translational inelasticity and dissociative adsorption in combination with associative desorption.
openaire +2 more sources
Low‐Angle Grain Boundaries and Re‐Segregation in Single‐Crystalline Ni‐Base Superalloys
This work demonstrates that Re‐segregation at low‐angle grain boundaries (LAGBs) in Ni‐base superalloys is influenced by misorientation angle. Advanced microscopy and atom probe tomography reveal that higher misorientation angles increases Re‐segregation.
Alireza B. Parsa +9 more
wiley +1 more source
Numerical Modeling of Tank Cars Carrying Hazardous Materials With and Without Composite Metal Foam
Large‐scale puncture models consisting of hazardous materials (HAZMATs) tank car with protective steel–steel composite metal foam (S–S CMF) are solved numerically. Tank car plate with added 10.91–13.33 mm thick S–S CMF layer does not puncture. Protective S–S CMF absorbs impact energy, reduces plate deformation, and prevents shear bands formation ...
Aman Kaushik, Afsaneh Rabiei
wiley +1 more source
Phase‐field simulations coupled with dislocation‐density‐based crystal plasticity modeling reproduce γ′ rafting behavior in single‐crystal Ni‐based superalloys under varied loading conditions. The model captures both macroscopic creep and microscopic morphology evolution, with results matching high‐temperature creep experiments.
Micheal Younan +5 more
wiley +1 more source
Phase Field Failure Modeling: Brittle‐Ductile Dual‐Phase Microstructures under Compressive Loading
The approach by Amor and the approach by Miehe and Zhang for asymmetric damage behavior in the phase field method for fracture are compared regarding their fitness for microcrack‐based failure modeling. The comparison is performed for the case of a dual‐phase microstructure with a brittle and a ductile constituent.
Jakob Huber, Jan Torgersen, Ewald Werner
wiley +1 more source
Robust Spot Melting by 3D Spot Arrangements in Electron Beam Powder Bed Fusion
This work proposes an approach to replace separately melted contours for spot melting in electron beam powder fusion. Adapting the spot arrangements close to the contour combined with stacking yields a comparable surface quality without the inherent challenges of separate contours, as demonstrated, by electron optical images and roughness measurements.
Tobias Kupfer +4 more
wiley +1 more source
Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad +6 more
wiley +1 more source

