Advanced Electronic Materials, EarlyView.The impact of Cu microstructure on the thermomechanical residual stress of TSVs with a diameter of 3 μm$\umu{\rm m}$ is investigated by comparing Raman stress imaging and EBSD grain characterization. By correlating Raman‐imaged TSV stress with Cu grain structure, direct experimental evidence is provided to highlight the direct correlation between ...
Shuhang Lyu, Thomas Beechem, Tiwei Wei
wiley +1 more source
A Batteryless Wireless Microphone Using RF Backscatter. [PDF]
Proc ACM Interact Mob Wearable Ubiquitous TechnolWang Q, Qian C, Yan P, Zhang S, Zeng H.
europepmc +1 more source
Assessment of the backscattered skin dose from the beam stopper on Halcyon and Ethos radiotherapy systems. [PDF]
J Appl Clin Med PhysLankinen L +4 more
europepmc +1 more source
On the performance of uplink D2D-assisted backscatter employing short packet communication. [PDF]
PLoS OneLe SP, Minh BV, Sy VQ, Voznak M.
europepmc +1 more source
Estimating Endmember Backscattering Coefficients Within the Mixed Pixels Based on the Microwave Backscattering Contribution Decomposition Model. [PDF]
Sensors (Basel)Song Y +6 more
europepmc +1 more source
Europe-wide maps of biomass density based on satellite remote sensing data for 2017, 2020, 2021 and 2023. [PDF]
Data BriefSantoro M +8 more
europepmc +1 more source
Related searches:
Backscatter Communication Assisted by Reconfigurable Intelligent Surfaces
Proceedings of the IEEE, 2022Gang Yang, Qianqian Zhang, Ruizhe Long
exaly
A survey on ambient backscatter communications: Principles, systems, applications, and challenges
Computer Networks, 2022Ammar Hawbani, Weiqi Wu, Xingfu Wang
exaly
Is Backscatter Link Stronger than Direct Link in Reconfigurable Intelligent Surface-Assisted System?
IEEE Communications Letters, 2020Gongpu Wang +2 more
exaly