Results 251 to 260 of about 737,702 (284)
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Direct procedure for connecting a mandibular implant-retained overdenture with ball attachments

The Journal of Prosthetic Dentistry, 2004
Implant-supported overdentures retained by attachments are now an established treatment method. The mandible is well suited for implant-retained overdentures, particularly when the implants can be placed in the canine regions. Among available retention systems, ball attachments have been proven to be reliable.
Corinne, Taddei   +3 more
openaire   +2 more sources

Implant-Retained Removable Prosthesis with Ball Attachments in Partially Edentulous Maxilla

Implant Dentistry, 2001
This clinical report presents a restorative option for the partially edentulous maxilla utilizing an implant-retained removable partial denture without retentive clasps. This approach required (1) fewer patient visits and laboratory procedures; (2) the use of minimal number of implants; (3) lower financial obligations; and (4) no sinus elevation ...
W R, de Carvalho   +2 more
openaire   +2 more sources

Plastic Ball Grid Array Attachment: Assembly and Reliability Performance

Microelectronics International, 1997
As plastic ball grid array (PBGA) components proliferate, card assembly questions arise about the robustness of the module to card attachment process. A designed experiment was performed to measure the sensitivity of card assembly yields to normal assembly process variation.
L. Anderson, A.A. Primavera
openaire   +1 more source

Chip size packages with wafer-level ball attach and their reliability

The Fourth International Conference on Advanced Semiconductor Devices and Microsystem, 2003
A new wafer level package has been designed and fabricated in which the entire package can be constructed at the wafer level using batch processing. Peripheral bondpads are redistributed from the die periphery to an area array using a redistribution metal of sputtered aluminum or electroplated copper and a redistribution dielectric.
L. Cergel, L. Wetz, B. Keser, J. White
openaire   +1 more source

BGA Coplanarity Reduction During the Ball Attach Process

Pan Pacific Symposium, 2008
ABSTRACT Since the implementation of BGA packages in the early 1990's, coplanarity of the solder ball array due to package warpage in most cases has been greater than the leaded devices they have replaced. In level 2 assembly this coplanarity can translate into open or intermittent solder connections known as “head-in-pillow”, “ball ...
openaire   +1 more source

[First clinical experiences with ceramic ball attachments for overdentures].

Schweizer Monatsschrift fur Zahnmedizin = Revue mensuelle suisse d'odonto-stomatologie = Rivista mensile svizzera di odontologia e stomatologia, 2008
In this prospective clinical study on 40 patients with similar clinical conditions (edentulous jaw with 2 interforaminal implants) commercially available ceramic ball attachments (ruby) were compared to commercial titanium ball attachments. The primary aim of the study was to measure the wear of the ball attachments after being 1 year in function ...
Büttel, A. E.   +3 more
openaire   +1 more source

Overdenture retention and stabilization with ball-and-socket attachments: principles and technique.

Journal of dental technology : the peer-reviewed publication of the National Association of Dental Laboratories, 1998
Implant attachments of various designs are used to retain, stabilize and sometimes support overdentures. Tissue supported overdentures stabilized and retained by two to four implants are often the restorations of choice due to patient preference, limitations in finances, insufficient available bone to accommodate a greater number of implants, or needed
B, Banton, M D, Henry
openaire   +1 more source

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