Results 241 to 250 of about 737,702 (284)

Investigation of solder ball attachment processes

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003., 2004
There is a great deal of interest in methods to attach solder balls to substrates for various applications. In this work, different ball attachment methods are evaluated. In particular, two methods are evaluated in detail, including the paste printing and reflow method, and the ball placement method.
D.A. Geiger, D. Shangguan, D. Rooney
openaire   +1 more source

Evaluation of laser solder ball jetting for solder ball attachment process

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012
Due to the perpetual push in microelectronic industry for miniaturization and better performance, the density of input/output counts on the electronic packages is multiplying within a given area. Conventional flux-based solder ball attachment process is fast reaching its bottleneck in satisfying the more restrictive pitch tolerances, and assembling ...
null Mian Zhi Ding, null Leong Ching Wai, null Shiyun Zhang, V. S. Rao   +3 more
openaire   +1 more source

Clinical Application of Stress-Breaking Ball Attachment for Implant Overdenture

Journal of Prosthodontic Research, 2013
The patient was a 62-year-old partially edentulous woman with missing bilateral premolars and molars in the mandibular jaw. The patient selected implant supported-removable partial denture rehabilitation. Implants were placed bilaterally at the distal extension of the denture base in order to minimize denture displacement. The stress-breaking ball (SBB)
Chikahiro Ohkubo, Kenneth S Kurtz
exaly   +3 more sources

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

IEEE Transactions on Components and Packaging Technologies, 2009
The ban of lead in consumer-based electronics by many countries has resulted in a dramatic reduction in the availability of electronic components with tin-lead terminations. With the uncertainty associated with lead-free reliability and the issues associated with mixing lead-free solder with tin-lead solder, medical, defense, and aerospace equipment ...
Nie, Lei, Osterman, Michael, Song, Fubin, Lo, Jeffery, Lee, S. W. Ricky, Pecht, Michael   +5 more
openaire   +2 more sources

The Effects of Water Soluble Paste Formulation on the Ball Attach and Ball Shear Failure

Soldering and Reliability Conferences, 2014
ABSTRACT The solder balls attach of two water-soluble solder pastes, a novel zero halogen material and a halogenated material, was compared in nitrogen and air atmospheres after reflow in a Malcom Reflow Simulator. Videos of the reflow process showed that both pastes reflowed well in nitrogen.
Li Tianpeng, Jorcelyn Tan Ying Ru, C. D. Breach, A. Hawkins   +3 more
openaire   +1 more source

The Study of Ball Attach Strength for CBGA Packages

2006 7th International Conference on Electronic Packaging Technology, 2006
Future applications will require higher I/O counts, more densification, and greater performance. CBGA(Ceramic Ball Grid Arry) packages are appropriate to this demand. As it is well known, the distribution of I/O contacts in CBGA is made on the surface of the ceramic substrate, following a matric group geometry. The connections have a ball shape and are
Xiaojun Zhang, Hualiang Fu, Hongyu Zheng, Jinli Zhang   +3 more
openaire   +1 more source

Attachment of Solder Ball Connect (SBC) packages to circuit cards

IBM Journal of Research and Development, 1993
IBM has developed an assembly process to attach a new family of Solder Ball Connect (SBC) integrated circuit packages to glass/epoxy cards using surface mount technology (SMT). The process provides nearly perfect yields for the resulting solder ball joint structures and ensures reliability by controlling wear-out due to metallurgical fatigue.
Michael D. Ries, Donald R. Banks, David P. Watson, Karl G. Hoebener   +3 more
openaire   +2 more sources

Lead-free solder evaluation for ball attache process

4th Electronics Packaging Technology Conference, 2002., 2003
In recent years, increasing awareness of lead-free requirement in electronics industry is driving the need to investigate lead-free solder systems in detail. This paper investigates three types of solder alloys, Sn/3.8Ag/0.7Cu, Sn/3.5Ag and Sn/0.7Cu used in a ball attache process.
A. Anand, Y.C. Mui
openaire   +1 more source

Analysis of retention and wear of ball attachments.

Quintessence international (Berlin, Germany : 1985), 2009
To evaluate the retention and the wear of different prefabricated precision ball attachments consecutively during long-term use.Six commercially available ball attachment systems were selected. The balls were attached to stylized implants fixed in metal casts. The matrices were fixed in a stylized unilaterally removable partial denture (RPD).
Katia, Wolf, Klaus, Ludwig, Heike, Hartfil, Matthias, Kern   +3 more
openaire   +1 more source

Fundamentals of BGA Ball Attach Reflow Process

Pan Pacific Symposium, 2000
ABSTRACT The fundamentals of reflowing solder balls for the BGA ball attach process is discussed. The content is divided into three major sections: modes of heat transfer, convection technologies used in reflow ovens and mechanics of temperature profiles.
openaire   +1 more source