Results 221 to 230 of about 20,056 (249)
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Chip size packages with wafer-level ball attach and their reliability
The Fourth International Conference on Advanced Semiconductor Devices and Microsystem, 2003A new wafer level package has been designed and fabricated in which the entire package can be constructed at the wafer level using batch processing. Peripheral bondpads are redistributed from the die periphery to an area array using a redistribution metal of sputtered aluminum or electroplated copper and a redistribution dielectric.
L. Cergel, L. Wetz, B. Keser, J. White
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BGA Coplanarity Reduction During the Ball Attach Process
Pan Pacific Symposium, 2008ABSTRACT Since the implementation of BGA packages in the early 1990's, coplanarity of the solder ball array due to package warpage in most cases has been greater than the leaded devices they have replaced. In level 2 assembly this coplanarity can translate into open or intermittent solder connections known as “head-in-pillow”, “ball ...
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[Locator or ball attachment: a guide for clinical decision making].
Schweizer Monatsschrift fur Zahnmedizin = Revue mensuelle suisse d'odonto-stomatologie = Rivista mensile svizzera di odontologia e stomatologia, 2009Various attachments are available to retain overdentures on natural roots or implants. Technical aspects, the clinical handling, the capability to adapt or repair and the costs are parameters to be considered when choosing the appropriate attachment. Ball attachments and bars are clinically established and well documented.
Büttel, Adrian E. +2 more
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[First clinical experiences with ceramic ball attachments for overdentures].
Schweizer Monatsschrift fur Zahnmedizin = Revue mensuelle suisse d'odonto-stomatologie = Rivista mensile svizzera di odontologia e stomatologia, 2008In this prospective clinical study on 40 patients with similar clinical conditions (edentulous jaw with 2 interforaminal implants) commercially available ceramic ball attachments (ruby) were compared to commercial titanium ball attachments. The primary aim of the study was to measure the wear of the ball attachments after being 1 year in function ...
Büttel, A. E. +3 more
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Overdenture retention and stabilization with ball-and-socket attachments: principles and technique.
Journal of dental technology : the peer-reviewed publication of the National Association of Dental Laboratories, 1998Implant attachments of various designs are used to retain, stabilize and sometimes support overdentures. Tissue supported overdentures stabilized and retained by two to four implants are often the restorations of choice due to patient preference, limitations in finances, insufficient available bone to accommodate a greater number of implants, or needed
B, Banton, M D, Henry
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Patient satisfaction with ball and bar attachment systems
Dental Abstracts, 2005openaire +1 more source
3D Finite Element Study on Incomplete Osseointegration Locator Attachment or Ball Attachment
Egyptian Dental Journalamal moubarak +6 more
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