Results 211 to 220 of about 20,056 (249)

Evaluation of laser solder ball jetting for solder ball attachment process

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012
Due to the perpetual push in microelectronic industry for miniaturization and better performance, the density of input/output counts on the electronic packages is multiplying within a given area. Conventional flux-based solder ball attachment process is fast reaching its bottleneck in satisfying the more restrictive pitch tolerances, and assembling ...
null Mian Zhi Ding, null Leong Ching Wai, null Shiyun Zhang, V. S. Rao   +3 more
openaire   +1 more source

The Effects of Water Soluble Paste Formulation on the Ball Attach and Ball Shear Failure

Soldering and Reliability Conferences, 2014
ABSTRACT The solder balls attach of two water-soluble solder pastes, a novel zero halogen material and a halogenated material, was compared in nitrogen and air atmospheres after reflow in a Malcom Reflow Simulator. Videos of the reflow process showed that both pastes reflowed well in nitrogen.
Li Tianpeng, Jorcelyn Tan Ying Ru, C. D. Breach, A. Hawkins   +3 more
openaire   +1 more source

The Study of Ball Attach Strength for CBGA Packages

2006 7th International Conference on Electronic Packaging Technology, 2006
Future applications will require higher I/O counts, more densification, and greater performance. CBGA(Ceramic Ball Grid Arry) packages are appropriate to this demand. As it is well known, the distribution of I/O contacts in CBGA is made on the surface of the ceramic substrate, following a matric group geometry. The connections have a ball shape and are
Xiaojun Zhang, Hualiang Fu, Hongyu Zheng, Jinli Zhang   +3 more
openaire   +1 more source

Attachment of Solder Ball Connect (SBC) packages to circuit cards

IBM Journal of Research and Development, 1993
IBM has developed an assembly process to attach a new family of Solder Ball Connect (SBC) integrated circuit packages to glass/epoxy cards using surface mount technology (SMT). The process provides nearly perfect yields for the resulting solder ball joint structures and ensures reliability by controlling wear-out due to metallurgical fatigue.
Michael D. Ries, Donald R. Banks, David P. Watson, Karl G. Hoebener   +3 more
openaire   +1 more source

Lead-free solder evaluation for ball attache process

4th Electronics Packaging Technology Conference, 2002., 2003
In recent years, increasing awareness of lead-free requirement in electronics industry is driving the need to investigate lead-free solder systems in detail. This paper investigates three types of solder alloys, Sn/3.8Ag/0.7Cu, Sn/3.5Ag and Sn/0.7Cu used in a ball attache process.
A. Anand, Y.C. Mui
openaire   +1 more source

Analysis of retention and wear of ball attachments.

Quintessence international (Berlin, Germany : 1985), 2009
To evaluate the retention and the wear of different prefabricated precision ball attachments consecutively during long-term use.Six commercially available ball attachment systems were selected. The balls were attached to stylized implants fixed in metal casts. The matrices were fixed in a stylized unilaterally removable partial denture (RPD).
Katia, Wolf, Klaus, Ludwig, Heike, Hartfil, Matthias, Kern   +3 more
openaire   +1 more source

Fundamentals of BGA Ball Attach Reflow Process

Pan Pacific Symposium, 2000
ABSTRACT The fundamentals of reflowing solder balls for the BGA ball attach process is discussed. The content is divided into three major sections: modes of heat transfer, convection technologies used in reflow ovens and mechanics of temperature profiles.
openaire   +1 more source

The In Vitro comparison of the retention of an implant-supported stud attachment locator and straumann ball attachment at different angulations

Nigerian Journal of Clinical Practice, 2018
In this study, we investigated the retention of two attachment types, Straumann ball (SB) and Straumann Locator® (SL) attachments, on different implant angulations and identified the most appropriate treatment type or attachment system for each angulation.The attachments placed on angulation of 0°-, 10°-, and 20° implants were subjected to 1440 ...
Gurbulak, Ayşegül, Kurtulus, İKBAL
openaire   +4 more sources

Direct procedure for connecting a mandibular implant-retained overdenture with ball attachments

The Journal of Prosthetic Dentistry, 2004
Implant-supported overdentures retained by attachments are now an established treatment method. The mandible is well suited for implant-retained overdentures, particularly when the implants can be placed in the canine regions. Among available retention systems, ball attachments have been proven to be reliable.
Corinne, Taddei, Michel, Metz, Etienne, Waltman, Oliver, Etienne   +3 more
openaire   +2 more sources

Implant-Retained Removable Prosthesis with Ball Attachments in Partially Edentulous Maxilla

Implant Dentistry, 2001
This clinical report presents a restorative option for the partially edentulous maxilla utilizing an implant-retained removable partial denture without retentive clasps. This approach required (1) fewer patient visits and laboratory procedures; (2) the use of minimal number of implants; (3) lower financial obligations; and (4) no sinus elevation ...
W R, de Carvalho, E P, Barboza, A L, Caúla   +2 more
openaire   +2 more sources