Results 201 to 210 of about 20,056 (249)

A 1.5-year randomized controlled trial comparing standard-sized implants and two diameters of mini-implants immediately loaded by mandibular overdenture: radiographic outcomes, short-term survival, and success rate. [PDF]

BDJ Open
Moftah HM, Al-Saadi MH, Darwich K.
europepmc   +1 more source

Retention and marginal bone loss in attachment systems for implant retained overdentures. [PDF]

Bioinformation
Duggal S, Hassan S, Anwaar K, Garg Y, Jain S.   +4 more
europepmc   +1 more source

Prosthetic Options for Full-Mouth Implant Rehabilitation: A Contemporary Review. [PDF]

Cureus
Surabathula D, Birajdar S, Joshi M, Vaz M, Kadam N.   +4 more
europepmc   +1 more source

Sub-millimeter quantification of alveolar bone loss using automated 40 MHz high-frequency ultrasound: A proof-of-concept ex vivo validation study. [PDF]

PLoS One
Abdelrehim T, Qi B, Tran B, Pandya M, Jokerst JV, Chen C.   +5 more
europepmc   +1 more source

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Clinical application of stress-breaking ball attachment for implant overdenture

Journal of Prosthodontic Research, 2013
The patient was a 62-year-old partially edentulous woman with missing bilateral premolars and molars in the mandibular jaw. The patient selected implant supported-removable partial denture rehabilitation. Implants were placed bilaterally at the distal extension of the denture base in order to minimize denture displacement. The stress-breaking ball (SBB)
Chikahiro Ohkubo
exaly   +3 more sources

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

IEEE Transactions on Components and Packaging Technologies, 2009
The ban of lead in consumer-based electronics by many countries has resulted in a dramatic reduction in the availability of electronic components with tin-lead terminations. With the uncertainty associated with lead-free reliability and the issues associated with mixing lead-free solder with tin-lead solder, medical, defense, and aerospace equipment ...
Michael Osterman, Michael Pecht, Fubin Song   +2 more
exaly   +3 more sources

Plastic Ball Grid Array Attachment: Assembly and Reliability Performance

Microelectronics International, 1997
As plastic ball grid array (PBGA) components proliferate, card assembly questions arise about the robustness of the module to card attachment process. A designed experiment was performed to measure the sensitivity of card assembly yields to normal assembly process variation.
L. Anderson, A.A. Primavera
exaly   +2 more sources

Fabrication of a simple ball-socket attachment

Journal of Prosthetic Dentistry, 1974
exaly   +3 more sources

TAIKO wafer ball attach

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016
Ball attach on ultra-thin 200 mm TAIKO wafers is considered a challenge but it can be mastered. The TAIKO wafer grinding concept is based on the thinning of an inner area of a silicon wafer leaving an outer ring as stiffening frame for wafer handling without an additional carrier [1].
Saskia Schroder, Markus Schroder, Wolfgang Reinert, Karl Heinz Priewasser   +3 more
openaire   +1 more source

Investigation of solder ball attachment processes

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003., 2004
There is a great deal of interest in methods to attach solder balls to substrates for various applications. In this work, different ball attachment methods are evaluated. In particular, two methods are evaluated in detail, including the paste printing and reflow method, and the ball placement method.
D.A. Geiger, D. Shangguan, D. Rooney
openaire   +1 more source