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High‐density wiring technology in multiwire boards
Electronics and Communications in Japan (Part II: Electronics), 1989AbstractThis paper considers the recent requirement for high‐density packaging technology and discusses the high‐density wiring technique for the Multiwire board. A proposal is made for the wiring rule as well as the fundamental manufacturing processes, which can realize twice higher wiring density compared with the traditional method.
Naoki Fukutomi +5 more
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Utilization of wastepaper to manufacture low density boards
Bioresource Technology, 2000Abstract Shredded newspaper, magazine, and office wastepaper, bonded with urea-formaldehyde (UF) and tannin paraformaldehyde (TP) adhesives both at 8% and 12% of resin solid contents, based on oven-dried weight of particles, were used to produce low-density boards in a series of laboratory scale experiments.
Esmeralda Yoshico Arakaki Okino +2 more
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Limitation of the signal pin density on wiring boards
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996A practical limit of the signal pin density on wiring boards is investigated from the wireability point of view. The wireability problem can be expressed as a supply and demand model of two resources, i.e. wiring channels and via-holes. The limit of the signal pin density is assumed to be determined by the shortage of either of these two resources.
T. Chiba, M. Yamada, F. Kobayashi
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High density multilayer printed wiring boards
1979 EIC 14th Electrical/Electronics Insulation Conference, 1979This paper describes an alternative fabrication technique which provides multilayer printed wiring boards having higher interconnection density, lower weight, smaller size and better heat transfer than conventional multilayer boards. These benefits are obtained by laminating thin, interconnected, two-sided circuits to form the multilayer circuit board.
Gerald Boucher, Daniel Holland
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On-board SRAM signal density stress prediction
SPIE Proceedings, 2006Static Random Access Memory (SRAM) chips undergo several types of stress in the field. Existing work has concentrated primarily on humidity and thermal stress; there has been relatively little emphasis on signal density stress prediction. Objectives of this study were to (1) explore the impact of signal density stress on SRAM functionality, (2 ...
Sheng-Jen Hsieh, Kartik Sharma
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Computer aided design of high density printed circuit boards
Proceedings of the June 1970 design automation workshop on Design automation - DAC '70, 1970A design automation system which accepts engineering data in the form of logic diagrams is described. The output is in the form of paper tape to directly create photomasks and/or drilled boards. The key feature of this approach is a highly sophisticated routing subsystem.
R. Campagna, P. R. Fryer
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Optimum design of high–density circuit boards
Electronics and Communications in Japan (Part II: Electronics), 1990AbstractThe method is discussed of determining wire width that minimizes the delay time and crosstalk of the average wiring length of wiring board under the condition that the wiring dimension is scaled down keeping the characteristic impedance of the transmission line constant.
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A calculating board incorporating a linear density transform
Spectrochimica Acta, 1963Abstract A new calculating board facilitates the calculation of line intensities in the spectrographic analysis of geological materials. It employs a linear density transform, derived by a graphical method which may be applicable in other fields of emission spectrography.
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Shear modulus, internal bond and density profile of medium density fibre board (MDF)
Holz als Roh- und Werkstoff, 1996For five different types of Medium Density Fibreboard (MDF) the correlation between in-plane shear properties (interlaminar shear, standard method prEN 789 Appendix B), internal bond and parameters derived from the density profile were determined. There are high correlations between interlaminar shear modulus (G xz, Gyz), shear strength
M. Schulte, A. Frühwald
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Influence of density particle board on the quality of their surface
Известия СПбЛТА, 2016Повышение плотности древесностружечных плит в диапазоне от 500 до 750 кг/м3 приводит к замедлению процесса впитывания жидкостей поверхностью плит. Изменение скорости впитывания объясняется повышением плотности поверхностного слоя плит, однако она имеет величины ниже средней плотности плит.
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