Results 261 to 270 of about 4,351,903 (305)
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Limitation of the signal pin density on wiring boards
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996A practical limit of the signal pin density on wiring boards is investigated from the wireability point of view. The wireability problem can be expressed as a supply and demand model of two resources, i.e. wiring channels and via-holes. The limit of the signal pin density is assumed to be determined by the shortage of either of these two resources.
T. Chiba, M. Yamada, F. Kobayashi
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Utilization of wastepaper to manufacture low density boards
Bioresource Technology, 2000Abstract Shredded newspaper, magazine, and office wastepaper, bonded with urea-formaldehyde (UF) and tannin paraformaldehyde (TP) adhesives both at 8% and 12% of resin solid contents, based on oven-dried weight of particles, were used to produce low-density boards in a series of laboratory scale experiments.
Esmeralda Yoshico Arakaki Okino +2 more
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High‐density wiring technology in multiwire boards
Electronics and Communications in Japan (Part II: Electronics), 1989AbstractThis paper considers the recent requirement for high‐density packaging technology and discusses the high‐density wiring technique for the Multiwire board. A proposal is made for the wiring rule as well as the fundamental manufacturing processes, which can realize twice higher wiring density compared with the traditional method.
Naoki Fukutomi +5 more
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Computer aided design of high density printed circuit boards
Proceedings of the June 1970 design automation workshop on Design automation - DAC '70, 1970A design automation system which accepts engineering data in the form of logic diagrams is described. The output is in the form of paper tape to directly create photomasks and/or drilled boards. The key feature of this approach is a highly sophisticated routing subsystem.
R. Campagna, P. R. Fryer
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Exposure to and Acute Effects of Medium-Density Fiber Board Dust
Journal of Occupational and Environmental Hygiene, 2004The goals of this study were (1) to investigate workers' exposure to medium-density fiber (MDF) dust (inhalable dust, particle size),formaldehyde, and volatile organic compounds; (2) to study the possible inflammatory nasal reactions caused by exposure to MDF board dust; and (3) to determine the occurrence of irritative symptoms among exposed workers ...
Eero, Priha +4 more
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Optimum design of high–density circuit boards
Electronics and Communications in Japan (Part II: Electronics), 1990AbstractThe method is discussed of determining wire width that minimizes the delay time and crosstalk of the average wiring length of wiring board under the condition that the wiring dimension is scaled down keeping the characteristic impedance of the transmission line constant.
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A calculating board incorporating a linear density transform
Spectrochimica Acta, 1963Abstract A new calculating board facilitates the calculation of line intensities in the spectrographic analysis of geological materials. It employs a linear density transform, derived by a graphical method which may be applicable in other fields of emission spectrography.
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Shear modulus, internal bond and density profile of medium density fibre board (MDF)
Holz als Roh- und Werkstoff, 1996For five different types of Medium Density Fibreboard (MDF) the correlation between in-plane shear properties (interlaminar shear, standard method prEN 789 Appendix B), internal bond and parameters derived from the density profile were determined. There are high correlations between interlaminar shear modulus (G xz, Gyz), shear strength
M. Schulte, A. Frühwald
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Reinventing circuit boards with high density optical interconnects
2016 IEEE Photonics Society Summer Topical Meeting Series (SUM), 2016We propose a photonic interconnect platform consisting of silicon photonic optical interposers and multiple layers of optical waveguides in a circuit board form factor which provides unprecedented communications density. With increase interconnect density, large distributed systems can be miniaturized to single board scales.
Andrew Michaels, Eli Yablonovitch
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Solder Bead on High Density Interconnect Printed Circuit Board
2008 IEEE International Test Conference, 2008Solder bead probing is a test technology primarily targeting high-speed/high-density printed circuit boards (PCBs). High Density Interconnect (HDI) PCBs are gaining in popularity to support high speed and smaller form factor requirements. This paper summarizes the requirements for placing solder beads on HDI PCBs.
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