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Reinventing circuit boards with high density optical interconnects
2016 IEEE Photonics Society Summer Topical Meeting Series (SUM), 2016We propose a photonic interconnect platform consisting of silicon photonic optical interposers and multiple layers of optical waveguides in a circuit board form factor which provides unprecedented communications density. With increase interconnect density, large distributed systems can be miniaturized to single board scales.
Andrew Michaels, Eli Yablonovitch
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Acoustic Absorption Performance Research of Coir Density Board
Advanced Materials Research, 2012Coir fiber is one of the tropical fruit fibers, the effective use of coir is not comprehensive now and the phenomenon of resources waste still exists. Full study of the advantage characteristics of coir has important significance for the expansion of the application field of coir resources.
Jia Yao +4 more
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Shear modulus, internal bond and density profile of medium density fibre board (MDF)
Holz als Roh- und Werkstoff, 1996For five different types of Medium Density Fibreboard (MDF) the correlation between in-plane shear properties (interlaminar shear, standard method prEN 789 Appendix B), internal bond and parameters derived from the density profile were determined. There are high correlations between interlaminar shear modulus (G xz, Gyz), shear strength
M. Schulte, A. Frühwald
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A calculating board incorporating a linear density transform
Spectrochimica Acta, 1963Abstract A new calculating board facilitates the calculation of line intensities in the spectrographic analysis of geological materials. It employs a linear density transform, derived by a graphical method which may be applicable in other fields of emission spectrography.
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Limitation of the signal pin density on wiring boards
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996A practical limit of the signal pin density on wiring boards is investigated from the wireability point of view. The wireability problem can be expressed as a supply and demand model of two resources, i.e. wiring channels and via-holes. The limit of the signal pin density is assumed to be determined by the shortage of either of these two resources.
T. Chiba, M. Yamada, F. Kobayashi
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Computer aided design of high density printed circuit boards
Proceedings of the June 1970 design automation workshop on Design automation - DAC '70, 1970A design automation system which accepts engineering data in the form of logic diagrams is described. The output is in the form of paper tape to directly create photomasks and/or drilled boards. The key feature of this approach is a highly sophisticated routing subsystem.
R. Campagna, R. Fryer
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Manufacturing low density boards from waste cardboards containing aluminium
Materials & Design, 2007Abstract We tried to recycle waste Tetra Pak cardboards, which contain aluminium as a step in the prevention of the environmental pollution caused by municipal solid wastes and as methods of achieving economical worth from these. The composite prepared with urea–formaldehyde resin was harder relative to that prepared with polyvinyl acetate based glue.
Balbaşı, Muzaffer +3 more
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High Density Flex‐rigid Circuits — A Solution for Board‐to‐board Transmission Line Interconnects
Circuit World, 1993Flex‐rigid circuits have been used for many years, primarily by the military, as a method to reduce the size and increase the reliability of electronic systems. However, in today's emerging designs where high speed ASICs are often the dominant components, flex‐rigid circuit assemblies are now an attractive solution for providing high density ...
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Solder Bead on High Density Interconnect Printed Circuit Board
2008 IEEE International Test Conference, 2008Solder bead probing is a test technology primarily targeting high-speed/high-density printed circuit boards (PCBs). High Density Interconnect (HDI) PCBs are gaining in popularity to support high speed and smaller form factor requirements. This paper summarizes the requirements for placing solder beads on HDI PCBs.
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