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High Density Metal Core Printed Circuit Boards

Circuit World, 1981
To solve the problems associated with heat generation as packaging density increases, especially with the use of VSLI devices, high density metal core PCBs have been developed. The manufacturing process is evaluated alongside that of conventional G‐10 boards, as are the electrical properties of the two types.
G. Morisaki, T. Sato, H. Kikuchi
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Modular testprocessor for VLSI chips and high-density PC boards

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 1988
A method for the test of VLSI chips and high-density PC boards is proposed. A built-in, microprogrammable test controller, called a testprocessor, applied tests to all separately testable blocks within either a VLSI chip or PC board, hence increasing controllability and observability.
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Solder Bead on High Density Interconnect Printed Circuit Board

2008 IEEE International Test Conference, 2008
Solder bead probing is a test technology primarily targeting high-speed/high-density printed circuit boards (PCBs). High Density Interconnect (HDI) PCBs are gaining in popularity to support high speed and smaller form factor requirements. This paper summarizes the requirements for placing solder beads on HDI PCBs.
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Reinventing circuit boards with high density optical interconnects

2016 IEEE Photonics Society Summer Topical Meeting Series (SUM), 2016
We propose a photonic interconnect platform consisting of silicon photonic optical interposers and multiple layers of optical waveguides in a circuit board form factor which provides unprecedented communications density. With increase interconnect density, large distributed systems can be miniaturized to single board scales.
Andrew Michaels, Eli Yablonovitch
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A Note on the Density of a Calcium Silicate Hydrate Board Material

Journal of Building Physics, 2007
A new analysis of the density of calcium silicate board material is reported. This takes account of revised estimates for the component densities.
Andrea Hamilton, Christopher Hall
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High Density Flex‐rigid Circuits — A Solution for Board‐to‐board Transmission Line Interconnects

Circuit World, 1993
Flex‐rigid circuits have been used for many years, primarily by the military, as a method to reduce the size and increase the reliability of electronic systems. However, in today's emerging designs where high speed ASICs are often the dominant components, flex‐rigid circuit assemblies are now an attractive solution for providing high density ...
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