Results 211 to 220 of about 199,493 (265)

Parenting Stress and Parental Bonding

Behavioral Medicine, 2005
Attachment experiences are thought to be important because of their implications for later development. The authors' aim with the questionnaire-based study was to investigate the differences between recalled parental bonding regarding 4 types of maternal and paternal bonding with respect to experienced parenting stress caused by child characteristics ...
Ulrike, Willinger, Gabriela, Diendorfer-Radner, Ruth, Willnauer, Gudrun, Jörgl, Veronika, Hager   +4 more
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Thermal stress in bonded joints

Microelectronics Reliability, 1979
This paper considers the stress distributions in bonded materials induced by differential expansion or contraction of these materials. The analytical approach is similar to the lap joint theories attributed to Volkersen and expanded by Goland and Reissner.
W. T. Chen, C. W. Nelson
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Contraction Stress in Dentin Adhesives Bonded to Dentin

Journal of Dental Research, 2006
Adhesives cured under constrained conditions develop contraction stresses. We hypothesized that, with dentin as a bonding substrate, the stress would reach a maximum, followed by a continuous decline. Stress development was determined with a tensilometer for two total-etch systems and two systems with self-etching primers.
Hashimoto, M., de Gee, A.J., Kaga, M., Feilzer, A.J.   +3 more
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Stress Analysis for Bonded Layers

Journal of Applied Mechanics, 1974
The problem of a line bond between two layers is solved by techniques appropriate to the plane theory of elasticity. Integral transforms are used to reduce the problem to singular integral equations. Numerical results are obtained for the case of identical layers and the numerical scheme of Erdogan and Gupta proved to be effective for this case. Stress-
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Stresses in a bonded wafer

Experimental Mechanics, 1988
Several theoretical and experimental analyses of the stresses on the bonded interface of a loaded or heated bimaterial structure are reported. The results extend previous studies and illustrate the difficulties and limitations of stress analysis of a bonded interface.
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Stress Distribution in Bonded Joints *

Journal of Composite Materials, 1971
The stress distribution in plates bonded through stepped joints is analyzed. The problem is solved under the assumption of gen eralized plane stress. A series of examples are worked out on specific plate geometries and material combinations. The effect of step ends is separately studied.
F. Erdogan, M. Ratwani
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Stress Singularity in Three-Phase Bonded Structure

Journal of Applied Mechanics, 1996
The plane problem of three-phase materials consisting of three isotropic homogeneous wedges with arbitrary angles, which are with two interfaces and two free surfaces, is analyzed under arbitrary normal and shearing tractions by the theory of elasticity.
Koguchi, Hideo, Inoue, Tadanobu, Yada, Yoshio   +2 more
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Invited: Water Stress Corrosion in Bonded Structures

ECS Meeting Abstracts, 2014
Direct bonding is now a well-known technique to join two flat surfaces without any additional material. This technique is used in many application and especially in SOI (Silicon on insulator) elaboration or in some backside imager manufacturing process which is now almost a mass production process.
Fournel, F., Martin-Cocher, C., Radisson, D., Larrey, V., Beche, E., Morales, C., Delean, P.-A., Rieutord, F., Moriceau, H.   +8 more
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Interfacial thermal stresses in ACF bonding assembly

Microelectronics Reliability, 2015
Abstract The interfacial stresses and chip cracking stress produced because of thermal and mechanical mismatch in layered electronic assembly are one of main reasons for the failure of electronic packages. The analytical model considering the nonlocal deformation of assembly was developed and applied to predict the interfacial stresses produced due ...
Li-Lan Gao, Xu Chen 0039, Hong Gao 0003
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Stress in Bonded Joints

1988
To most, if not almost all, engineers adhesives are unfamiliar materials - hardly surprising given the lack of training in the subject. Similarly, very few adhesive technologists appreciate what an engineer needs to know about their adhesives in order to be able to predict their behaviour.
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