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Stress in Bonded Joints

1988
To most, if not almost all, engineers adhesives are unfamiliar materials - hardly surprising given the lack of training in the subject. Similarly, very few adhesive technologists appreciate what an engineer needs to know about their adhesives in order to be able to predict their behaviour.
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Survival Bonding:

Social Work in Health Care, 1993
There is ample literature describing the ongoing stressors and tremendous emotional impact on health care professionals caring for patients with AIDS. This paper is a report of a research study which explored collegial relationships and staff retention to determine factors that reduced staff burnout. The study explored an observed phenomenon of pairing
K, Wade, E P, Simon
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BOND IN PRE-STRESSED CONCRETE.

Journal of the Institution of Civil Engineers, 1949
Synopsis. Existing literature on pre-stressed concrete failed to provide sufficient information on certain points which, basically, me dependent on the bond in pre-stressed concrete. Experiments were carried out, therefore, to investigate those points by further examination of the subject of the pre-stressed-concrete bond; those experiments are ...
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Effect on bond stresses of partial bond failure of overlapping fibres in a composite material

Composites, 1970
Abstract The distributions of bond stresses are computed for a sheet of matrix material which is reinforced by a repeating pattern of overlapping fibers, the sheet being subjected to tension in the direction of the fibers. In particular, the effects on these stresses of progressive bond failure (debonding) is computed for various bond spacing and ...
H.D. Conway, W.W. Chu, C.I. Chang
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THE BOND STRESS IN BRAZILIAN STANDARD

2005
The good performance of reinforced concrete structures is determined by the phenomenon of the bond between the steel reinforcement and the concrete, that way guaranteeing that the materials working form a solid piece. The study of the bond is presented by the relationship between the bond stress and the slipping of the steel reinforcement.
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Stress dependence of creep in bonded adhesives

Materials Science and Engineering, 1980
Abstract Torsion shear microcreep studies were performed on seven highly filled modified bisphenol-A-type epoxy adhesive systems. The steady state creep rate versus creep stress relationships were similar for all systems and were not monotonic. The results are interpreted in terms of the residual stresses which can exist in adhesive-bonded joints at ...
Edward J. Hughes, John L. Rutherford
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Stress Analysis of Bonded Plates and Joints

Journal of the Engineering Mechanics Division, 1980
The paper presents a general numerical method of solution to the transverse normal stress and longitudinal shear stress distributions in the adhesive layers of bonded stiffener plates, double lap joints, and strap joints, all of dissimilar orthotropic adherends.
Umur Yuceoglu, Dean P. Updike
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Analysis of Interfacial Bond Stress of Bonding Anchors for FRP Tendon

2011
An analytic interfacial bonding stress solution of bonding anchors for FRP tendon, loaded by axial force, is studied in this article. Based on the assumptions and differential equations of force equilibrium, the distribution of shear stress through the thickness of the anchors is derived, the calculating formula of interfacial bonding Stress is ...
Qilin Zhao, Fei Li, Haosen Chen
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Dynamic Stress on a Partially Bonded Fiber

Journal of Applied Mechanics, 1991
The dynamic stress on a partially bonded fiber is analyzed for shear wave incidence, with particular attention given to the stress intensity factor at the neck joining the fiber to the matrix. The problem is formulated in terms of the unknown stress across the neck and the remainder of the fiber-matrix interface is modeled as a curved interfacial crack.
Andrew Norris, Yang Yang
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Water Stress Corrosion in Bonded Structures

ECS Journal of Solid State Science and Technology, 2015
Direct bonding is now a well-known technique to join two flat surfaces without any additional material. This technique is used in many applications and especially in SOI (Silicon-On-Insulator) elaboration or in some backside imager manufacturing processes which are now almost in mass production.
Fournel, F.   +8 more
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