Results 211 to 220 of about 215,222 (264)
Some of the next articles are maybe not open access.

Related searches:

Mechanical bonds and dynamic covalent bonds

Materials Chemistry Frontiers, 2020
Jishan Wu and Fraser Stoddart introduce the Materials Chemistry Frontiers themed collection on mechanical bonds and dynamic covalent bonds.
Jishan Wu, J. Fraser Stoddart
openaire   +1 more source

The Mechanism of Bonding

TAPPI Journal, 2022
Three factors are involved in cellulose bonding--available area, contact, and hydrogen bonding.
openaire   +1 more source

Mechanics of Direct Wafer Bonding

Microelectromechanical Systems, 2003
Direct wafer bonding, also known as fusion bonding, has emerged as a key process in the manufacture of microelectromechanical systems (MEMS). The use of wafer bonding increases design flexibility, allows integration of dissimilar materials, and permits wafer-level packaging.
Turner, Kevin, Spearing, S.M.
openaire   +2 more sources

Wire Bonding: The Ultrasonic Bonding Mechanism

International Symposium on Microelectronics, 2020
Abstract Wire bonding is a welding process. During both ball and wedge bonding, wire and bond pad are massively deformed between the bond tool and the anvil of the bond pad or substrate. The dominant variables affecting deformation are ultrasonic energy, temperature, bond force and bond time. Deformation exposes new surface material that
openaire   +1 more source

Mechanochemistry: The Mechanical Activation of Covalent Bonds

ChemInform, 2005
AbstractFor Abstract see ChemInform Abstract in Full Text.
Martin K, Beyer   +1 more
openaire   +2 more sources

Home - About - Disclaimer - Privacy