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Reflection by defective diffusion bonds
Proceedings., IEEE Ultrasonics Symposium, 2003The reflection of ultrasonic wave motion by planar defect distributions is investigated with a view towards developing a method for detecting and characterizing bond-plane defects and with an ultimate objective of providing information on the bond strength of metal-to-metal bonds.
J.D. Achenbach, Y. Xu
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Study on microstructure and impact toughness of TC4 titanium alloy diffusion bonding joint
Vacuum, 2018TC4 titanium alloy was diffusion bonded under small axial pressure of 0.5 MPa to restrain the deformation. The sample surfaces, prior to bonding, were finely polished to Ra 0.3 μm.
Hao Zhang +4 more
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Diffusion bonding through interlayers
Welding International, 2013Studies of the application of interlayers in diffusion bonding (DB) are reviewed. A method for the classification of these layers for DB of dissimilar materials is proposed. The role of the interlayers and their contribution to the formation of the joint in all stages of bonding are investigated.
G.M. Zeer +4 more
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Diffusion bonding of gold to gold
Review of Scientific Instruments, 1974Diffusion bonding of gold to gold was investigated at low pressures and temperatures. Mercury, indium, and gallium were the diffusing species; tests as a function of several surface finishes were made. Bonds that exceeded the yield point of gold were obtained with mercury.
Donald L. Ornellas, Edward Catalano
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Diffusion bonding of advanced alloys
2013 International Conference on Aerospace Science & Engineering (ICASE), 2013Advanced alloys are being developed for a variety of critical applications in the aerospace and nuclear industries and the joining together of dissimilar metals is also becoming increasingly important. However, for a joining process to be truly effective in the fabrication step of the component, it must be able to produce sound quality joints without ...
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Superplastic Forming and Diffusion Bonding
Aircraft Engineering and Aerospace Technology, 1983A purpose‐built superplastic forming and diffusion bonding manufacturing facility has been commissioned at the Hatfield Division of British Aerospace Dynamics Group.
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