Results 11 to 20 of about 2,907,472 (310)
Non-destructive testing of interfacial stiffness based on spring model for diffusion bonding interface of titanium alloy components with complex surface [PDF]
Ultrasonic testing is an important non-destructive testing method, which is sensitive to the defects in the diffusion bonding interface. Ultrasonic testing of diffusion bonding interfaces in complex-surface components is a challenge due to the geometry ...
Gongpeng Yang +7 more
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Impulse Pressure-Assisted Diffusion Bonding (IPADB): Review and Outlook
Diffusion bonding is a solid-state welding technique used to join similar and dissimilar materials. Relatively long processing times, usually in the order of several hours as well as fine polished surfaces make it challenging to integrate diffusion ...
Abdulaziz AlHazaa +2 more
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Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers
Cu/SiO2 hybrid bonding presents a promising avenue for achieving high-density interconnects by obviating the need for microbumps and underfills. Traditional copper bonding methods often demand temperatures exceeding 400 °C, prompting recent endeavors to ...
Min Seong Jeong +6 more
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Similar and dissimilar material joints of AISI grade 304 (1.4301) and AISI grade 316 (1.4401) austenitic stainless steel by solid state diffusion bonding and transient liquid phase (TLP) bonding are of interest to academia and industry alike. Appropriate
Abdulaziz AlHazaa, Nils Haneklaus
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Dissimilar diffusion bonding behavior of hydrogenated Ti2AlNb-based and Ti-6Al-4V alloys
The effects of hydrogen concentration, heating rate and bonding temperature on dissimilar diffusion bonding of Ti2AlNb-based and Ti-6Al-4V alloys were investigated.
Fuhui Zhu +3 more
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An analysis method for the detectability of defects on the TC4 (Ti-6Al-4V) diffusion bonding interface was proposed in this study. First, a semi-analytical model of the liquid–solid coupling acoustic field with attenuation characteristics was constructed.
Lichen Teng, Zhenggan Zhou
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A kinetic model of copper-to-copper direct bonding under thermal compression
A surface creep model is presented for analyzing Cu-to-Cu direct bonding under thermal compression. The driving force is a pressure gradient, which squeezes layers of atoms to fill voids at the bonding interface.
Kai-Cheng Shie +3 more
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The high uniform magnetic field combined with pre-deformation and vacuum heat treatment processing is designed for improving the diffusion bonding properties of the 1420 Al-Li alloy.
Huang Zhang +3 more
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Vacuum diffusion bonding of Ti2AlNb alloy and TC4 alloy
The Ti2AlNb alloy was joined with TC4 alloy by vacuum diffusion bonding. The relationship between bonding parameters, and joint microstructure and shear strength was investigated.
G. Feng +5 more
semanticscholar +1 more source
Microstructure and failure mechanism of FGH96 solid-state diffusion bonding interface
The microstructure on the solid-state diffusion bonding interfaces of the initially as-forged, as-solution, and sub-aging FGH96 was characterized, the tensile properties of the bonding interfaces were tested, and the failure behavior was studied.
YANG Jie +5 more
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