Results 21 to 30 of about 2,937,719 (310)

Solid State Diffusion Bonding Process-A Review

, 2021
The present paper reports on the various diffusion bonding techniques using atomic diffusion of elements at the interface. The bonding process is used mainly for joining dissimilar metals.
T. Aravinda, H. B. Niranjan, B. Satish Babu, M. Udaya Ravi   +3 more
semanticscholar   +1 more source

Microstructure and failure mechanism of FGH96 solid-state diffusion bonding interface

Fenmo yejin jishu, 2021
The microstructure on the solid-state diffusion bonding interfaces of the initially as-forged, as-solution, and sub-aging FGH96 was characterized, the tensile properties of the bonding interfaces were tested, and the failure behavior was studied.
YANG Jie, LIU Guang-xu, ZHANG Jing, WANG Wen-ying, WANG Xiao-feng, ZOU Jin-wen   +5 more
doaj   +1 more source

Evaluation of electrically-assisted vacuum diffusion bonding of a TiBw/TA15 composite by microstructural analysis and mechanical testing

Journal of Materials Research and Technology, 2023
Electrically-assisted diffusion bonding (EADB) of a TiBw/TA15 composite with a novel network architecture was studied under a vacuum degree of 3 × 10−3 Pa in this work.
Xunhu Xu, Qingxin Kang, Guofeng Wang, Yongkang Liu, Zhenlun Li, Tongxu Zhou   +5 more
doaj   +1 more source

Prediction of Tensile Strength and Deformation of Diffusion Bonding Joint for Inconel 718 Using Deep Neural Network

Metals, 2020
Due to the acceptable high-temperature deformation resistance of Inconel 718, its welding parameters such as bonding temperature and pressure are inevitably higher than those of general metals. As a result of the existing punitive processing environment,
Han Mei, Lihui Lang, Xiaoxing Li, Hasnain Ali Mirza, Xiaoguang Yang   +4 more
doaj   +1 more source

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations

Scientific Reports, 2023
High-density electronics are hindered by the constraints of Sn-based solder joints, necessitating the exploration of Cu–Cu solid-state bonding. However, current bonding methods are expensive and time-consuming; therefore, understanding the Cu–Cu bonding ...
Hiroaki Tatsumi, C. R. Kao, Hiroshi Nishikawa   +2 more
doaj   +1 more source

Ultrasonic-assisted liquid phase diffusion bonding of Al alloys under low temperature and pressure for high-temperature resistance applications

Materials & Design, 2023
A joint obtained at relatively low temperatures and serving under high temperatures has been a longstanding goal for aluminum alloy heat sinks used in extreme environments.
Pu Zhao, Zhengwei Li, Yuanhang Xia, Zhiwu Xu, Xuesong Leng, Jiuchun Yan   +5 more
doaj   +1 more source

Microstructure and Mechanical Properties of Diffusion-Bonded CoCrNi-Based Medium-Entropy Alloy to DD5 Single-Crystal Superalloy Joint

Crystals, 2021
This study focuses on the diffusion bonding of a CoCrNi-based medium-entropy alloy (MEA) to a DD5 single-crystal superalloy. The microstructure and mechanical properties of the joint diffusion-bonded at variable bonding temperatures were investigated ...
Shiwei Li, Xianjun Sun, Yajie Du, Yu Peng, Yipeng Chen, Zhaoxi Li, Jiangtao Xiong, Jinglong Li   +7 more
doaj   +1 more source

Current Trends in Dissimilar Diffusion Bonding of Titanium Alloys to Stainless Steels, Aluminium and Magnesium

Journal of Manufacturing and Materials Processing, 2020
This article provides a comprehensive review of the advancements made in the diffusion bonding of titanium and its alloys to other advanced materials such as aluminium, stainless steel, and magnesium.
Kavian Omar Cooke, A. Atieh
semanticscholar   +1 more source

Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation

Scientific Reports, 2022
In recent years, solid-state bonding has attracted attention for various electronic packaging applications as an alternative to conventional solders. Surface-nanostructured materials enable solid-state bonding without complex surface modifications and ...
Hiroaki Tatsumi, C. R. Kao, Hiroshi Nishikawa   +2 more
doaj   +1 more source

The effect of bonding process parameters on the microstructure and mechanical properties of AA5083 diffusion-bonded joints

International Journal of Lightweight Materials and Manufacture, 2022
Diffusion bonding is a sort of solid-state joining that allows the joining of metals with similar and dissimilar compositions by allowing them to diffuse into one another.
S. Venugopal, M. Seeman, R. Seetharaman, V. Jayaseelan   +3 more
doaj   +1 more source