Results 251 to 260 of about 215,222 (264)
Some of the next articles are maybe not open access.

Interaction mechanism between void and interface grain boundary in diffusion bonding

Science and Technology of Welding and Joining, 2015
M Q Li
exaly  

A bond failure mechanism

Microelectronics Reliability, 1987
openaire   +1 more source

A Review of Mechanism and Technology of Hybrid Bonding

Journal of Electronic Packaging, Transactions of the ASME
Zhao Yi, Yipeng Xu
exaly  

Exploring Bonding Mechanism of SiCN for Hybrid Bonding

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Sodai Ebiko   +5 more
openaire   +1 more source

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