Results 251 to 260 of about 215,222 (264)
Some of the next articles are maybe not open access.
Interaction mechanism between void and interface grain boundary in diffusion bonding
Science and Technology of Welding and Joining, 2015M Q Li
exaly
A Review of Mechanism and Technology of Hybrid Bonding
Journal of Electronic Packaging, Transactions of the ASMEZhao Yi, Yipeng Xu
exaly
Exploring Bonding Mechanism of SiCN for Hybrid Bonding
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)Sodai Ebiko +5 more
openaire +1 more source

