Results 81 to 90 of about 1,677,786 (329)

Multiscale Modeling of Process‐Induced Defects in Fused Filament Fabrication‐Printed Materials

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents a predictive multiscale modeling tool for defect analysis of fused filament fabricated‐printed materials and their performance prediction using a mechanistic data science‐based reduced‐order modeling approach. Process‐induced defects are inherent to additively manufactured parts and significantly influence the performance of printed
Satyajit Mojumder   +3 more
wiley   +1 more source

First-Order Boundary Value Problem with Nonlinear Boundary Condition on Time Scales

open access: yesDiscrete Dynamics in Nature and Society, 2011
This work is concerned with the following first-order dynamic equation on time scale ,  xΔ(t)+p(t)x(σ(t))=f(t,x(t)),  t∈[0,T]𝕋 with the nonlinear boundary condition x(0)=g(x(σ(T))).
Ya-Hong Zhao
doaj   +1 more source

Mechanical Behavior and Microstructural Changes Associated with Tensile Deformation above the Martensite Start Temperature during Quenching and Subsequent Partitioning of a Low‐Alloy 37SiB6 Steel

open access: yesAdvanced Engineering Materials, EarlyView.
A new experimental setup, incorporating digital image correlation and infrared thermography in combination with inductive‐conductive heating for precise temperature control, is used to analyze the mechanical behavior and microstructural changes of sheet metal under complex thermomechanical test conditions that represent quench and partitioning ...
Christian Illgen   +4 more
wiley   +1 more source

Racing Under Uncertainty: A Boundary Value Problem Approach [PDF]

open access: yes
In this paper I formulate a continuous time and continuous space version of Harris and Vickers (1987) Racing Under Uncertainty with potentially asymmetric players.
Dan Cao
core  

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

Second-order neutrosophic boundary-value problem. [PDF]

open access: yesComplex Intell Systems, 2021
Moi S, Biswas S, Pal Sarkar S.
europepmc   +1 more source

W‐Based Thin Film Metallic Glasses Doped with Ni, Zr, and B for Industrial Applications

open access: yesAdvanced Engineering Materials, EarlyView.
This work is the first to deal with a comprehensive comparison of two metallic glass systems, W–Zr–B and W–Ni–B, in terms of their suitability for specific industrial applications. Their mechanical and tribological properties are compared and discussed in combination with structural homogeneity on different types of technically relevant substrates and ...
Zbynek Studeny   +5 more
wiley   +1 more source

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