Results 151 to 160 of about 152,231 (175)

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya, Adamos Christou, Sihang Ma, Ravinder Dahiya   +3 more
wiley   +1 more source

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

Advanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek, Minhyeok Kim, Hak‐Sung Kim, Jinho Ahn, Hongyun So   +4 more
wiley   +1 more source

High Aspect Ratio, Superconducting Vacuum Gap Capacitor NEMS with Plate Distances Down to 32 nm

Advanced Materials Technologies, EarlyView.
Fabrication of aluminium vacuum gap capacitor based NEMS is investigated with a free to move top electrode. To avoid collapse of the top electrode vertical stress gradient is controlled through sputter parameters. The result is wafer‐level high‐yield fabrication of vacuum gap capacitors with radii between 7 µm and 30 µm and integrated piezoactuators. A
Ioan Ignat, Daniel Platz, Ulrich Schmid
wiley   +1 more source

Flow Analysis in Pathological Microvascular Models by Ultrasound Localization Microscopy

Advanced Materials Technologies, EarlyView.
This study presents a new platform combining ultrasound localization microscopy with biomimetic gelatin phantoms to analyze flow dynamics in small vessels with narrowing or obstructions. Using microbubble tracking, the method enables high‐resolution velocity mapping in 100–500 µm channels, revealing flow changes in pathological microvascular conditions
Yarin Gershman, Grigori Shapiro, Tamar Mano, Tali Ilovitsh   +3 more
wiley   +1 more source

Dual Resonant Plasmonic Infrared Pixels for Selective Optical Encoding

Advanced Materials Technologies, EarlyView.
This study presents dual‐resonant plasmonic nanostructures for advanced optical encoding in the mid‐infrared. By optimizing plasmonic resonances in nano‐antennas within ring cavities, selective and simultaneous tunability in both the MWIR and LWIR regions is achieved.
Goekalp Engin Akinoglu, Leshy Patchett, Timothy Denis James, Paul Mulvaney, James Andell Hutchison   +4 more
wiley   +1 more source

Dielectric Barrier Discharge Electrothermal Heating and Additive Manufacturing of Thermoset Parts

Advanced Materials Technologies, EarlyView.
3D printing of thermosets is difficult due to the low yield stress of most uncured resins. However, by locally heating resin using a non‐equilibrium plasma, layers can be partially cured and printing enabled. Plasma application to a liquid epoxy/carbon nanotube composite is observed to cause rapid surface heating and oxidation of the cured layers ...
Ethan M. Harkin, Sayyam Deshpande, Smita Shivraj Dasari, Micah J. Green   +3 more
wiley   +1 more source

Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications

Advanced Materials Technologies, EarlyView.
Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley   +1 more source

Development of a Miniaturized Capillary Rheometer for High Shear Rate Rheology of Dense Suspensions

Advanced Materials Technologies, EarlyView.
This research presents a downscaled benchtop, low‐cost capillary rheometer that can characterize high shear rate rheometry of dense suspensions. The device is capable of measuring across a wide range of applicable shear rates using only a limited quantity of material and addresses a need for an accurate and affordable capillary rheometer.
John P. Reynolds, Ray S. Dietzenbach, Sara G. Watson, Kate J. Hornberger, Michael Coco, Christopher B. Williams, Michael J. Bortner   +6 more
wiley   +1 more source

High Magnetic Sensitivity at the Coercive Field Induced by Shear Horizontal SAW in Polycrystalline FeGa Films

Advanced Materials Technologies, EarlyView.
A theoretical framework links stress‐induced changes in the Young's modulus of Fe₇₂Ga₂₈ layers to their magnetization dynamics under SH‐SAW excitation. This interaction produces a sharp sensor response near the coercive field, highlighting FeGa's magnetoelastic sensitivity.
Juan Diego Aguilera, Rocio Ranchal, Fernando Gálvez, Jose Miguel Colino, Isabel Gràcia, Stella Vallejos, Antonio Hernando, Pilar Marín, Patricia de la Presa, Daniel Matatagui   +9 more
wiley   +1 more source

Toward Advancement of Fabrication Techniques of Neuromorphic Computing Devices Based on 2D Materials

Advanced Materials Technologies, EarlyView.
This review highlights emerging fabrication techniques of 2D material‐based neuromorphic devices, emphasizing proximity vapor transfer for bioinspired optoelectronic applications. Abstract The growing necessity for power‐efficient and cognitive computation mechanisms has driven progress in neuromorphic computing which seeks to imitate the synaptic ...
Shubham Umeshkumar Gupta, Malkeshkumar Patel, Naveen Kumar, László Pohl, Min‐Joon Park, Sung‐Min Youn, Chaewhan Jeong, Joondong Kim   +7 more
wiley   +1 more source