Results 71 to 80 of about 1,825 (173)
Copper-clad ceramic plate is an important heat dissipation component in an insulate-gate bipolar transistor (IGBT), which is composed of high thermal conductivity ceramic and pure copper connection.
Yanming HE +6 more
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Brazing technology of ceramic-Kovar alloy for high-temperature service
In view of the brazing challenge of ceramics and Kovar alloys under high-temperature service conditions, gold-nickel brazing filler metal with superior high-temperature resistance, which replaced the silver-copper-titanium brazing filler metal used in ...
Yue ZHANG +6 more
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Microstructures and Properties of FGH96/DD6 Joints Brazed at Vacuum Pressure State
Ni-Cr-B brazing filler was used to braze FGH96 and DD6 at 1120℃/10 min and 1120℃/10 min/2 MPa. The tensile strength of the joints was tested, the microstructures and fractures were observed by OM and SEM, and the reaction products were analyzed by EPMA ...
ZOU Wenjiang +4 more
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In Situ Synthesis of Al-Si-Cu Alloy During Brazing Process and Mechanical Property of Brazing Joint
The Al-Si-Cu alloy system is considered to be a promising choice of filler metal for aluminium alloys brazing due to its high strength and low melting point. The greatest obstacle is its lack of plastic forming ability and being difficult to be processed
LONG Wei-min +5 more
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Microstructure and brazing properties of Ag20Cu35Zn(43.5-x-y)MnxSnyNi1.5 foil-filler brazing alloy
The influence of the addition of Mn and Sn elements on the microstructure, melting characteristics, and wettability of low-silver Ag20Cu35Zn(43.5-x-y)MnxSnyNi1.5 brazing alloys was investigated, and the content of Mn and Sn elements in the brazing alloys
Xuecheng WANG +4 more
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The effect of pre-stretching on solid-liquid interaction, microstructure and brazing performance of AA4343/AA3xxx/AA4343 layered aluminum sheet during brazing at the atomic level (solid solution), nanoscale (dislocation) and micron level (grain boundary)
Zhipeng Yuan +11 more
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Microstructure and properties of AlN and Cu joints brazed with Cu-Sn-Ti filler metal
The brazing connection between AlN ceramics and Cu was achieved by using Cu-Sn-Ti filler metal, and the effect of process parameters on the interfacial microstructure and properties of AlN/Cu joints was investigated.
Chaonan NIU +6 more
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Microstructure and mechanical properties of Si3N4/Cu AMB joints
The active metal brazed joints of Si3N4 and Cu were obtained by using Ag-Cu-In-Ti brazing filler at a brazing temperature of 780 °C. The interfacial microstructure of the joint and its formation mechanism were investigated, and the effect of holding time
Miaomiao FANG +3 more
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