Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Research on Stress Variations During the 4H-SiC Indentation Process. [PDF]
Wang W, Lin S, Yu Y, Duan N.
europepmc +1 more source
Fabrication, Properties, and Applications of Scaffolds for Bone Tissue Regeneration
This review explores cutting‐edge biomaterials and fabrication techniques for scaffolds in bone tissue regeneration. It conducts a critical comparison of various strategies, meticulously analyzes the key contradictions in the field, and outlines an integrated development path spanning from biomaterial selection to clinical application, while ...
Shangsi Chen, Min Wang
wiley +1 more source
Smoothing Gradient Damage Modeling in Brittle/Quasi-brittle Fracture: Algorithms and Applications
identifier:oai:t2r2.star.titech.ac.jp ...
+4 more sources
Experimental Determination of Material Behavior Under Compression of a Carbon-Reinforced Epoxy Composite Boat Damaged by Slamming-like Impact. [PDF]
Altunsaray E +3 more
europepmc +1 more source
This review outlines how understanding bone's biology, hierarchical architecture, and mechanical anisotropy informs the design of lattice structures that replicate bone morphology and mechanical behavior. Additive manufacturing enables the fabrication of orthopedic implants that incorporate such structures using a range of engineering materials ...
Stylianos Kechagias +4 more
wiley +1 more source
Characteristics of Pulsed-Laser-Induced Layers with Cracks Prepared for SiC Grinding Processes. [PDF]
Li H, Jiang Y, Yang Y, Yang J, Zhu L.
europepmc +1 more source
Anti‐Slip Material‐Based Strategies and Approaches
This review highlights the principle mechanisms of slipping at the microscale, linking contact mechanics with a friction behavior model for surface interfaces. Main strategies to develop anti‐slip properties to the surfaces are discussed alongside standardized testing approaches.
Sogand Abbaspoor‐Zanjani +3 more
wiley +1 more source
Acoustic emission characteristics and failure precursors under uniaxial cyclic compression. [PDF]
Zhang Y, Mei F.
europepmc +1 more source
Ductility Tuning via Cluster Network Characteristics of Porous Components
Network optimization via cluster characteristics induced by interaction of stress concentration is proposed, demonstrating increased cluster size and dispersion in non‐uniform porous components. The optimized structures exhibit, for the first time, that enhanced ductility and damage progression is controllable through zigzag cluster network designed by
Ryota Toyoba +4 more
wiley +1 more source

