Positional isomerism in dibenzofuran‐based n‐type hosts modulates molecular polarity, charge‐transport balance, and emissive‐layer packing. The higher‐polarity BFPDB‐2 host facilitates efficient energy funneling, reduced aggregation, and preferential dipole orientation, leading to phosphor‐sensitized fluorescence OLEDs with enhanced external quantum ...
Nargis Ali +3 more
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Experimental Setup for <i>In Situ</i> Determination of Conductivity-Porosity-Pressure Relationships during Compression of Solid Electrolytes and of Cathode Active Materials. [PDF]
Miß V, Lange F, Staubitz S, Roling B.
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Unlocking Electrochemical-Driven Surface Oxygen Vacancies-Regulated Cathode-Electrolyte Interphase for Stabilizing Li-Ion Cells. [PDF]
Yan C +11 more
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Anion Chemistry: Structure, Electrochemistry and Stability of NASICON Cathodes. [PDF]
Cai T, Yu D, Zhang X, Zhao S, Wang L.
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Surface-Modified Nickel Foam Cathodes for the Electroflotation of Multi-Component Batik Wastewater. [PDF]
Musawwa MM +10 more
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Fe-substituted Na<sub>3.5</sub>V<sub>1.5</sub>Mn<sub>0.5</sub>(PO<sub>4</sub>)<sub>3</sub> NaSICON cathode with multi-electron reactions and improved energy output. [PDF]
Chayal L +6 more
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Research toolbox and material design to meet the challenge of rechargeable Ca metal batteries.
Lužanin O +4 more
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Cathode spot development on a bulk cathode in a vacuum arc
2012 25th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV), 2012This work considers transient spot development on a bulk cathode, taking into account the initial adjacent plasma generated during arc triggering. A self-consistent model was developed to describe the transient cathode phenomena and the time dependent cathode potential drop, taking into account the kinetics and gasdynamics of cathode plasma flow.
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Cathodic etching in a penning cold cathode discharge
Vacuum, 1959Abstract An apparatus for cathodic etching using a Penning cold cathode discharge is described. One of the twin cathodes is the specimen to be etched whilst the other is made of aluminium. The cathodes are water cooled so that metals of either low melting point or low sputtering rate will not overheat during the cathodic etching.
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