Results 251 to 260 of about 767,177 (355)
Beyond Order: Perspectives on Leveraging Machine Learning for Disordered Materials
This article explores how machine learning (ML) revolutionizes the study and design of disordered materials by uncovering hidden patterns, predicting properties, and optimizing multiscale structures. It highlights key advancements, including generative models, graph neural networks, and hybrid ML‐physics methods, addressing challenges like data ...
Hamidreza Yazdani Sarvestani +4 more
wiley +1 more source
Low fluid shear stress stimulates the uptake of noxious endothelial extracellular vesicles via MCAM and PECAM-1 cell adhesion molecules. [PDF]
Coly PM +12 more
europepmc +1 more source
The role of 67 kDa laminin receptor in G-CSF-induced hematopoietic stem cell mobilization [PDF]
Visconte, Valeria
core +1 more source
The share of technical thermoplastics is expected to grow further in the e‐mobility segment. In this study, a detailed temperature‐based tribological characterization of technical thermoplastics is performed. The tribological properties are discussed in terms of the dynamic mechanical properties of polymers at different ambient temperatures. A proof of
Harsha Raghuram +2 more
wiley +1 more source
Downregulation of ABLIM3 confers to the metastasis of neuroblastoma via regulating the cell adhesion molecules pathway. [PDF]
Gong B +11 more
europepmc +1 more source
Graphene–Catechol Dental Sealant: Antibacterial and Mechanical Evaluation
This study presents dental sealants made with graphene and L‐DOPA‐modified graphene. L‐DOPA enhances graphene dispersion, improving sealant properties. The material shows antibacterial activity against S. mutans and L. casei, along with high strength and elasticity.
Renata Pereira +6 more
wiley +1 more source
Lectin-like cell adhesion molecule 1 mediates leukocyte rolling in mesenteric venules in vivo
Klaus Ley +5 more
openalex +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan +5 more
wiley +1 more source

