Results 221 to 230 of about 9,346 (307)

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

open access: yesAdvanced Science, EarlyView.
This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo   +11 more
wiley   +1 more source

A Conformal Wearable Ultrasound Bioelectronics for Mechanotherapy Reprogramming of Fibroblast Plasticity via Wnt‐FGF10 Axis to Overcome Fibrotic Healing in Urethral Regeneration

open access: yesAdvanced Science, EarlyView.
Fibrotic scarring persistently challenges urethral reconstruction. This study introduces a conformal, wearable ultrasound bioelectronic system that overcomes this by reprogramming fibroblast fate. The device activates a developmental Wnt–FGF10 axis, driving fibroblasts toward a regenerative FGF10+ phenotype that promotes angiogenesis and matrix ...
Mingming Yu   +7 more
wiley   +1 more source

A Review of Wafer-Level Packaging Technology for SAW and BAW Filters. [PDF]

open access: yesMicromachines (Basel)
Liu X   +5 more
europepmc   +1 more source

Molecularly Bridged Heterointerface Engineering: Designing Transparent, Wear‐Resistant, Hard yet Flexible Optoelectronic Protective Film

open access: yesAdvanced Science, EarlyView.
A molecular‐bridging heterogeneous interface engineering strategy is introduced to combine a polyhedral oligomeric silsesquioxane (POSS)‐based hard coating with a colorless polyimide (CPI)‐based flexible layer. The robust heterogeneous interface endows the integrated system with the superior properties of both layers and their synergistic ...
Huiyang Lu   +5 more
wiley   +1 more source

Development and Characterization of Sawdust-Based Ceramic Membranes for Textile Effluent Treatment. [PDF]

open access: yesMembranes (Basel)
Marques AVS   +5 more
europepmc   +1 more source

Liquid Metals in Radio Frequency Applications: A Review of Physics, Manufacturing, and Emerging Technologies

open access: yesAdvanced Electronic Materials, EarlyView.
This paper reviews the physics of liquid metals in RF devices, including the influence of mechanical strain on resonance as well as fabrication methods and strategies for designing tunable and strain‐tolerant inductors, capacitors, and antennas.
Md Saifur Rahman, William J. Scheideler
wiley   +1 more source

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