Results 91 to 100 of about 6,632 (142)

CMOS-Compatible Fabrication Module for Sub-100 nm TiN and TaN Pillar Electrodes for Carbon Nanotube Test Structures. [PDF]

Nanomaterials (Basel)
Chen G, Fujii T, Yamada T, Hata K.
europepmc   +1 more source

Flow-Induced Dynamic Dispersion in Dispersant-Free Mixed-Oxide Slurry Systems. [PDF]

Langmuir
Lin YA, Yeh FM, Hu B, Huang TK, Lu HH, Zhong H, Li CC.   +6 more
europepmc   +1 more source

Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration and Contamination. [PDF]

Micromachines (Basel)
Lee E, Sun K, So Y, Baek J, Shin JH, Kim HD, Youn YB, Kim MW.   +7 more
europepmc   +1 more source

Process Temperature Control for Low Dishing in CMP. [PDF]

Materials (Basel)
Shin Y, Jeong J, Shin J, Jeong H.
europepmc   +1 more source

Planarization of Twisted Push-Pull Probes by Stretching Rather than by Compression: Core-Substituted Fluorescent Flippers as Materials Mechanosensors. [PDF]

JACS Au
Pamungkas KKP, Yamamoto R, Vonesch M, Sakai N, Sagara Y, Matile S.   +5 more
europepmc   +1 more source

Flipper dendrimers. [PDF]

Chem Sci
Gonzalez-Sanchis N, Bayard F, García-Arcos JM, Mandal T, Roux A, Sakai N, Matile S.   +6 more
europepmc   +1 more source

Tapered Cladding Design for Monolithic Waveguide-Photodetector Coupling in Si-Based Integrated Photonics. [PDF]

Nanomaterials (Basel)
Gonzalez-Fernandez AA, Vazquez-Hernandez JA, Aguilar-Valdez F, Moffat N.   +3 more
europepmc   +1 more source

A Pathway for the Integration of Novel Ferroelectric Thin Films on Non-Planar Photonic Integrated Circuits. [PDF]

Micromachines (Basel)
Lievens E, De Geest K, Picavet E, Van Landschoot L, Vrielinck H, Feutmba GF, Rijckaert H, De Buysser K, Van Thourhout D, Bienstman P, Beeckman J.   +10 more
europepmc   +1 more source

Piezochromic Nanomaterials: Fundamental Mechanisms, Advances, Applications, and Future Prospects in Solar Cell Engineering. [PDF]

Nanomaterials (Basel)
Wu X, Chen H, Luo Y, Yu J, Wang Y, Choy KL, Li Z.   +6 more
europepmc   +1 more source

Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding. [PDF]

Micromachines (Basel)
Zheng T, Xu Y, Mei C, Chen Y, Chang L, Yang G, Hu Q, Shi T, Yuan Y, Yu Z, Li L.   +10 more
europepmc   +1 more source