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Journal of Machine Engineering, 2023 A new eco-friendly slurry has been developed for the chemical mechanical polishing process with a solution of malic acid, deionized water, and an oxidizing agent hydrogen peroxide (H2O2).
Nguyen Minh Quang +7 more
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Chemical-Mechanical Polishing [PDF]
, 2007 CMP is a removal process that strips small portions of film deposited on a wafer by a combination of chemical reaction and mechanical polishing, thus making the surface smoother and more planarized. It is also used to remove bulk dielectric film on the surface to form STI on the silicon substrate, and remove bulk metal film from the wafer surface ...
Gregory Shinn +4 more
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Investigation of Chemical Mechanical Polishing Slurry of magnesium alloy [PDF]
E3S Web of Conferences, 2023 To improve the surface roughness of magnesium alloy, we researched and developed a chemical mechanical polishing (CMP) solution for magnesium alloy, and the effect of sodium tartrate on the surface quality of magnesium alloy and the mechanism of action ...
Zhao Shicheng +2 more
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CHEMICAL MECHANICAL POLISHING OF NONLINEAR OPTICAL ORGANIC CO-CRYSTALS BASED ON AMINOPYRIDINE SERIES [PDF]
Научно-технический вестник информационных технологий, механики и оптики, 2019 We have studied efficiency of chemical mechanical method for surface polishing of nonlinear optical materials based on aminopyridine series and 4-nitrophenol. Isopropanol (C3H8O) and butanol (C4H9OH) were the solvents utilized for polishing of researched
K. E. Zhevaikin +2 more
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Journal of Machine Engineering, 2023 This work provided a new chemical-mechanical polishing mixture with MgO, sodium metasilicate pentahydrate, ZrO2 abrasive particles, and deionized water.
Le Anh Duc +2 more
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Impact analysis of temperature and humidity effects on polishing [PDF]
EPJ Web of Conferences, 2021 The polishing process for optical glass is one with intertwined chemical and mechanical processes. The aim of the present study is to verify whether control of these factors can be used to improve the efficiency of the polishing process.
Benisch Michael F. +4 more
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Review on modeling and application of chemical mechanical polishing
Nanotechnology Reviews, 2020 With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang +6 more
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Micromachines, 2020 After the development of 3D printing, the post-processing of the 3D-printed materials has been continuously studied, and with the recent expansion of the application of 3D printing, interest in it is increasing. Among various surface-machining processes,
Jungyu Son, Hyunseop Lee
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A Review on Precision Polishing Technology of Single-Crystal SiC
Crystals, 2022 Single-crystal SiC is a typical third-generation semiconductor power-device material because of its excellent electronic and thermal properties. An ultrasmooth surface with atomic surface roughness that is scratch free and subsurface damage (SSD) free is
Gaoling Ma +5 more
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Review on chemical mechanical polishing of silicon wafers
Jin'gangshi yu moliao moju gongcheng, 2020 With the increase of wafer thickness and the decrease of chip thickness, the amount of material removal increases in the process of wafer processing, and the problem of improving the processing efficiency has become one of the research hotspots.
XU Jiahui +3 more
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