Results 31 to 40 of about 91,843 (195)

Investigation of the Visible Photocatalytic–Fenton Reactive Composite Polishing Process for Single-Crystal SiC Wafers Based on Response Surface Methodology

Micromachines
The third-generation semiconductor single-crystal silicon carbide (SiC), as a typical difficult-to-machine material, improves the chemical reaction rate on the SiC surface during the polishing process, which is key to realizing efficient chemical ...
Zijuan Han, Bo Ran, Jisheng Pan, Rongji Zhuang   +3 more
doaj   +1 more source

The effect of mechanical and chemical polishing techniques on the surface roughness of denture base acrylic resins

Saudi Dental Journal, 2010
Smooth polished surface of dental prostheses is important to prevent bacterial colonization and plaque accumulation. The acrylic base of prosthodontic appliances needs to be adjusted by grinding which often alters the surface of the denture base.
Mohammed Q. Al-Rifaiy
doaj   +1 more source

Multi-Field Characterisation of Material Removal Processes in Ultrasonic Magnetorheological Chemical Compound Polishing of GaN Wafers

Micromachines
Gallium nitride (GaN), as the core material of third-generation semiconductors, has important applications in high-temperature, high-frequency, and high-power devices, but its polishing process faces many challenges.
Huazhuo Liang, Wenjie Chen, Youzhi Fu, Wenjie Zhou, Ling Mo, Qi Wen, Dawei Liu, Junfeng He   +7 more
doaj   +1 more source

Multi grade polishing pad for sapphire chemical mechanical polishing

Journal of Materials Research and Technology
The synergy between polishing pad and abrasive is the key to material removal in chemical mechanical polishing (CMP). In order to achieve uniform material removal, a new multi gradient polishing pad for sapphire CMP was developed.
Zhaohui Deng, Rongjin Zhuo, Zhongyang Li, Wei Cao, Shangci Huang, Jimin Ge   +5 more
doaj   +1 more source

Microscopic mechanism for mechanical polishing of diamond (110) surfaces

, 1998
Mechanically induced degradation of diamond, as occurs during polishing, is studied using total--energy pseudopotential calculations. The strong asymmetry in the rate of polishing between different directions on the diamond (110) surface is explained in ...
D. R. Alfonso, E. M. Wilks, E. M. Wilks, F. M. van Bouwelen, J. S. Lin, K. C. Pandey, L. Kleinman, M. C. Payne, M. C. Payne, M. Couto, M. Couto, M. P. Hitchiner, M. R. Jarvis, Ruben Pérez, S. E. Grillo, S. Iarlori   +15 more
core   +1 more source

Double-walled carbon nanotube-based polymer composites for electromagnetic protection. [PDF]

, 2010
In this paper, we present a microwave absorber based on carbon nanotubes (CNT) dispersed inside a BenzoCycloButenw (BCB) polymer. The high aspect ratio and remarkable conductive characteristics of CNT give rise to good absorbing properties for ...
Bianco, Bordas, David Dubuc, Emmanuel Flahaut, Grenier, Katia Grenier, Pacchini, Said, Stauffer, Sébastien Pacchini, Yao   +10 more
core   +2 more sources

Energy beam-based direct and assisted polishing techniques for diamond: A review

International Journal of Extreme Manufacturing, 2023
Diamond is a highly valuable material with diverse industrial applications, particularly in the fields of semiconductor, optics, and high-power electronics.
Zhuo Li, Feng Jiang, Zhengyi Jiang, Zige Tian, Tian Qiu, Tao Zhang, Qiuling Wen, Xizhao Lu, Jing Lu, Hui Huang   +9 more
doaj   +1 more source

Influence of roughness on contact interface in fretting under dry and boundary lubricated sliding regimes [PDF]

, 2009
This paper presents experimental results of wear process under dry and boundary lubricated metallic (AISI 1034/AISI 52100) contacting bodies with different surfaces morphologies subjected to a wide range of kinematic fretting conditions.
Kubiak, Krzysztof, Mathia, T.G.
core   +1 more source

Preparation and Performance Study of Chemical Mechanical Polishing Slurry for New-type Aluminium Alloy

Chemical Engineering Transactions, 2018
Aluminium alloys are widely used in various industries because of their lightness and easy processing, leading to higher requirements for aluminium alloys in terms of the flatness and finish of aluminium alloy surface.
Yali Zhao, Genjie Yu, Yamin Li, Guixia Wang   +3 more
doaj   +1 more source

Optimization of CMP processing parameters for Si based on response surface method

Jin'gangshi yu moliao moju gongcheng, 2022
To improve the polishing efficiency and precision, the optimum processing parameters of Si in the chemical mechanical polishing (CMP) process were analysed by CMP experiments and response surface methodology.
Da BIAN, Enmin SONG, Zifeng NI, Shanhua QIAN, Yongwu ZHAO   +4 more
doaj   +1 more source