Results 11 to 20 of about 18,989 (261)

Preliminary Study on Polishing SLA 3D-Printed ABS-Like Resins for Surface Roughness and Glossiness Reduction

Micromachines, 2020
After the development of 3D printing, the post-processing of the 3D-printed materials has been continuously studied, and with the recent expansion of the application of 3D printing, interest in it is increasing. Among various surface-machining processes,
Jungyu Son, Hyunseop Lee
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A Review on Precision Polishing Technology of Single-Crystal SiC

Crystals, 2022
Single-crystal SiC is a typical third-generation semiconductor power-device material because of its excellent electronic and thermal properties. An ultrasmooth surface with atomic surface roughness that is scratch free and subsurface damage (SSD) free is
Gaoling Ma, Shujuan Li, Feilong Liu, Chen Zhang, Zhen Jia, Xincheng Yin   +5 more
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Polishing Approaches at Atomic and Close-to-Atomic Scale

Micromachines, 2023
Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes.
Zhichao Geng, Ning Huang, Marco Castelli, Fengzhou Fang   +3 more
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Effect of Hydrogen Peroxide and Oxalic Acid on Material Removal in Al CMP [PDF]

한국정밀공학회지, 2017
Chemical mechanical polishing achieves surface planarity through combined mechanical and chemical means. The role of the chemical reaction is very important in a metal CMP like aluminum.
Jin Yeop Jeong, Hyun Seop Lee, Da Sol Lee, Hae Do Jeong   +3 more
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Advances and challenges in mechanical, chemical and energy-field-assisted polishing techniques for single-crystal and polycrystalline diamonds: a comprehensive review

Materials & Design
Diamond has been extensively applied in optics and semiconductor industries owing to its exceptional physical and chemical properties. For industrial applications, diamond surfaces often demand high precision and minimal damage.
Xu Ling, Zhuo Li, Shajiu Le, Anna Jiang, Yangjian Chen, Baodong Wang   +5 more
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Study on the Electro-Fenton Chemomechanical Removal Behavior in Single-Crystal GaN Pin–Disk Friction Wear Experiments

Micromachines
Electro-Fenton chemical mechanical polishing primarily regulates the generation of hydroxyl radicals (·OH) via the Fenton reaction through an applied electric field, which subsequently influences the formation and removal of the oxide layer on the ...
Yangting Ou, Zhuoshan Shen, Juze Xie, Jisheng Pan   +3 more
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Analysis of Solid and Ionic Surface Reaction Form to Surface Quality when Using Chemical-Mechanical Slurry Polishing

Journal of Machine Engineering, 2022
The process of removing machining residues using chemical-mechanical slurry (CMS) has an important place in the creation of ultra-precise components in optical devices.
Le Anh Duc, Pham Minh Hieu, Nguyen Trong Mai, Thai Van Trong, Nguyen Minh Quang   +4 more
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Facet engineering of ceria and the preferential cleavage-consumption mechanism in chemical mechanical polishing

Journal of Materials Research and Technology
The rational design of high-performance ceria (CeO2) polishing abrasives is largely constrained by the unclear correlation between crystal plane exposure, dynamic oxygen vacancy evolution, and the chemical-mechanical synergistic mechanism during chemical
Xin Li, Mingjian Qiu, Quanmin Zhang, Xu Wang, Yuan Wu, Mitang Wang, Siqingaowa Jin, Wei Bi, Yan Zhao, Wei Zhou, bin Zhang, Dongliang Zhang   +11 more
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Fabrication and evaluation of a CMOS-based energy harvesting chip integrating photovoltaic and thermoelectric energy harvesters

Energy Conversion and Management: X
This study explores the development of an energy harvesting chip (EHC) using a complementary metal oxide semiconductor (CMOS) process, addressing the need for efficient micro-scale energy harvesters in modern electronics.
Zhi-Xuan Dai, Chun-Yu Chen
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Slurry Design for Chemical Mechanical Polishing

KONA Powder and Particle Journal, 2014
Chemical Mechanical Polishing (CMP) process is widely used in the microelectronics industry for planarization of metal and dielectric layers to achieve multi-layer metallization.
G. Bahar Basim, Brij M. Moudgil
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