Results 11 to 20 of about 20,386 (260)

Simulation Analysis of the Chemical Mechanical Polishing Process for Monocrystal 4H-Silicon Carbide Based on Molecular Dynamics [PDF]

open access: yesMicromachines
This paper delves into the mechanism of the chemical and mechanical action during chemical mechanical polishing (CMP) of monocrystal silicon carbide (SiC) through the molecular dynamics (MD) method.
Yang Lei   +3 more
doaj   +2 more sources

Monodisperse SiO2 Spheres: Efficient Synthesis and Applications in Chemical Mechanical Polishing [PDF]

open access: yesNanomaterials
The atomic level polishing of a material surface affects the accuracy of devices and the application of materials. Silica slurries play an important role in chemical mechanical polishing (CMP) by polishing the material surface.
Jinlong Ge   +7 more
doaj   +2 more sources

Study on Chemical Mechanical Polishing of Single-Crystal Diamond with a Novel Nicotinic Acid–Hydrogen Peroxide Green Slurry [PDF]

open access: yesMicromachines
Single-crystal diamond (SCD) has the characteristics of a hard surface and stable chemical properties, making it difficult to achieve ultra-smooth and ultra-low-damage surface polishing using conventional polishing slurries.
Jixiang Yi, Longxing Liao, Yiming Fang
doaj   +2 more sources

Effect of slurry composition on the chemical mechanical polishing of thin diamond films

open access: yesScience and Technology of Advanced Materials, 2017
Nanocrystalline diamond (NCD) thin films grown by chemical vapour deposition have an intrinsic surface roughness, which hinders the development and performance of the films’ various applications. Traditional methods of diamond polishing are not effective
Jessica M. Werrell   +7 more
doaj   +2 more sources

Advances and challenges in mechanical, chemical and energy-field-assisted polishing techniques for single-crystal and polycrystalline diamonds: a comprehensive review

open access: yesMaterials & Design
Diamond has been extensively applied in optics and semiconductor industries owing to its exceptional physical and chemical properties. For industrial applications, diamond surfaces often demand high precision and minimal damage.
Xu Ling   +5 more
doaj   +1 more source

Polishing Approaches at Atomic and Close-to-Atomic Scale

open access: yesMicromachines, 2023
Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes.
Zhichao Geng   +3 more
doaj   +1 more source

Study on the Electro-Fenton Chemomechanical Removal Behavior in Single-Crystal GaN Pin–Disk Friction Wear Experiments

open access: yesMicromachines
Electro-Fenton chemical mechanical polishing primarily regulates the generation of hydroxyl radicals (·OH) via the Fenton reaction through an applied electric field, which subsequently influences the formation and removal of the oxide layer on the ...
Yangting Ou   +3 more
doaj   +1 more source

Effect of Hydrogen Peroxide and Oxalic Acid on Material Removal in Al CMP [PDF]

open access: yes한국정밀공학회지, 2017
Chemical mechanical polishing achieves surface planarity through combined mechanical and chemical means. The role of the chemical reaction is very important in a metal CMP like aluminum.
Jin Yeop Jeong   +3 more
doaj   +1 more source

Design and analysis strategies for robust microbiome ageing research

open access: yesFEBS Letters, EarlyView.
The gut microbiome changes with age and associates with age‐related morbidity and mortality, establishing it as a potential biomarker and intervention target for ageing. Realising this potential requires methodological rigour, yet distinguishing biological signals from methodological artefacts remains challenging across cohorts. This review provides an
Mark Olenik   +5 more
wiley   +1 more source

Facet engineering of ceria and the preferential cleavage-consumption mechanism in chemical mechanical polishing

open access: yesJournal of Materials Research and Technology
The rational design of high-performance ceria (CeO2) polishing abrasives is largely constrained by the unclear correlation between crystal plane exposure, dynamic oxygen vacancy evolution, and the chemical-mechanical synergistic mechanism during chemical
Xin Li   +11 more
doaj   +1 more source

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