Results 11 to 20 of about 19,083 (259)

Impact analysis of temperature and humidity effects on polishing [PDF]

EPJ Web of Conferences, 2021
The polishing process for optical glass is one with intertwined chemical and mechanical processes. The aim of the present study is to verify whether control of these factors can be used to improve the efficiency of the polishing process.
Benisch Michael F., Liebl Johannes, Bogner Werner, Fähnle Oliver, Rädlein Edda   +4 more
doaj   +1 more source

Preliminary Study on Polishing SLA 3D-Printed ABS-Like Resins for Surface Roughness and Glossiness Reduction

Micromachines, 2020
After the development of 3D printing, the post-processing of the 3D-printed materials has been continuously studied, and with the recent expansion of the application of 3D printing, interest in it is increasing. Among various surface-machining processes,
Jungyu Son, Hyunseop Lee
doaj   +1 more source

A Review on Precision Polishing Technology of Single-Crystal SiC

Crystals, 2022
Single-crystal SiC is a typical third-generation semiconductor power-device material because of its excellent electronic and thermal properties. An ultrasmooth surface with atomic surface roughness that is scratch free and subsurface damage (SSD) free is
Gaoling Ma, Shujuan Li, Feilong Liu, Chen Zhang, Zhen Jia, Xincheng Yin   +5 more
doaj   +1 more source

Review on chemical mechanical polishing of silicon wafers

Jin'gangshi yu moliao moju gongcheng, 2020
With the increase of wafer thickness and the decrease of chip thickness, the amount of material removal increases in the process of wafer processing, and the problem of improving the processing efficiency has become one of the research hotspots.
XU Jiahui, KANG Renke, DONG Zhigang, WANG Ziguang   +3 more
doaj  

Polishing Approaches at Atomic and Close-to-Atomic Scale

Micromachines, 2023
Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes.
Zhichao Geng, Ning Huang, Marco Castelli, Fengzhou Fang   +3 more
doaj   +1 more source

Advances and challenges in mechanical, chemical and energy-field-assisted polishing techniques for single-crystal and polycrystalline diamonds: a comprehensive review

Materials & Design
Diamond has been extensively applied in optics and semiconductor industries owing to its exceptional physical and chemical properties. For industrial applications, diamond surfaces often demand high precision and minimal damage.
Xu Ling, Zhuo Li, Shajiu Le, Anna Jiang, Yangjian Chen, Baodong Wang   +5 more
doaj   +1 more source

Effect of Hydrogen Peroxide and Oxalic Acid on Material Removal in Al CMP [PDF]

한국정밀공학회지, 2017
Chemical mechanical polishing achieves surface planarity through combined mechanical and chemical means. The role of the chemical reaction is very important in a metal CMP like aluminum.
Jin Yeop Jeong, Hyun Seop Lee, Da Sol Lee, Hae Do Jeong   +3 more
doaj   +1 more source

Study on the Electro-Fenton Chemomechanical Removal Behavior in Single-Crystal GaN Pin–Disk Friction Wear Experiments

Micromachines
Electro-Fenton chemical mechanical polishing primarily regulates the generation of hydroxyl radicals (·OH) via the Fenton reaction through an applied electric field, which subsequently influences the formation and removal of the oxide layer on the ...
Yangting Ou, Zhuoshan Shen, Juze Xie, Jisheng Pan   +3 more
doaj   +1 more source

Structural insights into an engineered feruloyl esterase with improved MHET degrading properties

FEBS Letters, EarlyView.
A feruloyl esterase was engineered to mimic key features of MHETase, enhancing the degradation of PET oligomers. Structural and computational analysis reveal how a point mutation stabilizes the active site and reshapes the binding cleft, expading substrate scope.
Panagiota Karampa, Konstantinos Makryniotis, Theofani‐Iosifina Sousani, Evangelos Topakas, Vangelis Daskalakis, Maria Dimarogona   +5 more
wiley   +1 more source

Facet engineering of ceria and the preferential cleavage-consumption mechanism in chemical mechanical polishing

Journal of Materials Research and Technology
The rational design of high-performance ceria (CeO2) polishing abrasives is largely constrained by the unclear correlation between crystal plane exposure, dynamic oxygen vacancy evolution, and the chemical-mechanical synergistic mechanism during chemical
Xin Li, Mingjian Qiu, Quanmin Zhang, Xu Wang, Yuan Wu, Mitang Wang, Siqingaowa Jin, Wei Bi, Yan Zhao, Wei Zhou, bin Zhang, Dongliang Zhang   +11 more
doaj   +1 more source