Modelling of dishing for metal chemical mechanical polishing [PDF]
, 2000 In this paper, a physical model for the development of dishing during metal chemical mechanical polishing (CMP) is proposed. The main assumption of the model is that material removal occurs predominantly at the pad/wafer contacts. The distribution of pad/
Daamen, Roel +4 more
core +15 more sources
Hydrodynamics of slurry flow in chemical mechanical polishing : a review [PDF]
, 2006 Chemical mechanical polishing (CMP) is a process that is commonly used to planarize wafer surfaces during fabrication. Although the complex interactions between the wafer, pad, and slurry make the CMP process difficult to predict, it has been postulated ...
Higgs, C. Fred, Terrell, Elon Jahdal
core +2 more sources
Analysis of infrared optical polishing effluents and reduction of COD and TSS levels by ultrafiltration and coagulation/flocculation [PDF]
, 2014 Samples of polishing effluent produced during infrared optics manufacture were analyzed. Their particle size, composition, Zeta potential, chemical oxygen demand (COD), total suspended solids (TSS), and settleable solids were determined.
Durazo-Cardenas, Isidro Sergio +2 more
core +1 more source
A Review on Precision Polishing Technology of Single-Crystal SiC
Crystals, 2022 Single-crystal SiC is a typical third-generation semiconductor power-device material because of its excellent electronic and thermal properties. An ultrasmooth surface with atomic surface roughness that is scratch free and subsurface damage (SSD) free is
Gaoling Ma +5 more
doaj +1 more source
Modification of the cylindrical products outer surface influenced by radial beam of argon ions at automatic mode [PDF]
, 2015 Obtaining surface with high purity and good roughness is important for increasing the corrosion resistance and wear resistance of products working in corrosion-active environment. Installation ILUR-03 with the coaxial ion beam wide energy spectrum source
Asainov, Oleg Khaydarovich +9 more
core +1 more source
Micromachines, 2020 After the development of 3D printing, the post-processing of the 3D-printed materials has been continuously studied, and with the recent expansion of the application of 3D printing, interest in it is increasing. Among various surface-machining processes,
Jungyu Son, Hyunseop Lee
doaj +1 more source
Correlation between pattern density and linewidth variation in silicon photonics waveguides [PDF]
, 2020 We describe the correlation between the measured width of silicon waveguides fabricated with 193 nm lithography and the local pattern density of the mask layout.
Bogaerts, Wim +3 more
core +1 more source
Polishing Approaches at Atomic and Close-to-Atomic Scale
Micromachines, 2023 Roughness down to atomic and close-to-atomic scale is receiving an increasing attention in recent studies of manufacturing development, which can be realized by high-precision polishing processes.
Zhichao Geng +3 more
doaj +1 more source
Class I Gap-formation in Highly-viscous Glass-ionomer Restorations: Delayed vs Immediate Polishing [PDF]
, 2007 This in vitro study evaluated the effects of delayed versus immediate polishing to permit maturation of interfacial gap-formation around highly viscous conventional glass-ionomer cement (HV-GIC) in Class I restorations, together with determining the ...
M. Irie +28 more
core +6 more sources
Examination of the material removal mechanisms during the lapping process of advanced ceramic rolling elements [PDF]
, 2005 Two types of HIPed Si3N4 bearing ball blanks with different surface hardness and fracture toughness were lapped under various loads, speeds, and lubricants using a novel eccentric lapping machine.
Ahn +19 more
core +1 more source