Results 1 to 10 of about 14,575 (156)

Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review [PDF]

International Journal of Precision Engineering and Manufacturing - Green Technology, 2021
Chemical mechanical polishing (CMP) is an essential planarization process for semiconductor manufacturing. The application of CMP has been increasing in semiconductor fabrication for highly integrated devices. Recently, environmental burden caused by the
Haedo Jeong, Hyoungjae Kim, Hyunseop Lee   +2 more
exaly   +3 more sources

Research on influences of contact force in chemical mechanical polishing (CMP) process

AIP Advances, 2015
A series of simulations of chemical mechanical polishing (CMP) were conducted to investigate the contact force between abrasive particles and specimens by using the finite element method (FEM).
Lei Han, Hongwei Zhao, Qixun Zhang, Mingjun Jin, Lin Zhang, Peng Zhang   +5 more
doaj   +2 more sources

Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)

Micromachines, 2020
Fluidized bed machining (FBM) is used for the surface finishing or cleaning of complex 3D machine parts. FBM is a process of injecting air into a chamber to encourage particles into a fluid-like state.
Taekyoung Kim, Hyunseop Lee
doaj   +3 more sources

One‐Step, High‐Removal‐Rate and Low‐Damage Chemical Mechanical Polishing of InP Enabled by Hydrolysis Activated PF6− with In Situ Fluoride Passivation

Advanced Science
Achieving high‐throughput, low‐damage preparation of indium phosphide (InP) surfaces remains challenging because increasing the material removal rate (MRR) in chemical mechanical polishing (CMP) often compromises ultralow roughness and requires post‐CMP ...
Shigong Fu, Jianwei Zhou, Chenwei Wang, Yanchao Ge, Chong Luo, Yuhang Qi   +5 more
doaj   +2 more sources

Characterization of Ceria Nanoparticles as Abrasives Applied with Defoaming Polymers for CMP (Chemical Mechanical Polishing) Applications

Polymers
Chemical mechanical polishing/planarization (CMP) is an essential manufacturing process in semiconductor technologies. This method combines chemical and mechanical forces to smooth the surfaces of wafers.
Woonjung Kim
exaly   +2 more sources

Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes

Precision Engineering, 2013
H D Jeong, D A Dornfeld
exaly   +2 more sources

Scavenger with Protonated Phosphite Ions for Incredible Nanoscale ZrO₂-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Planarization

Nanomaterials, 2021
For scaling-down advanced nanoscale semiconductor devices, tungsten (W)-film surface chemical mechanical planarization (CMP) has rapidly evolved to increase the W-film surface polishing rate via Fenton-reaction acceleration and enhance nanoscale-abrasive
Seong-In Kim, Gi-Ppeum Jeong, Seung-Jae Lee, Jong-Chan Lee, Jun-Myeong Lee, Jin-Hyung Park, Jae-Young Bae, Jea-Gun Park   +7 more
doaj   +1 more source

Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper

Applied Sciences, 2021
Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles.
Seonghyun Park, Hyunseop Lee
doaj   +1 more source

Effect of Hydrogen Peroxide and Oxalic Acid on Material Removal in Al CMP [PDF]

한국정밀공학회지, 2017
Chemical mechanical polishing achieves surface planarity through combined mechanical and chemical means. The role of the chemical reaction is very important in a metal CMP like aluminum.
Jin Yeop Jeong, Hyun Seop Lee, Da Sol Lee, Hae Do Jeong   +3 more
doaj   +1 more source

Optimization of CMP processing parameters for Si based on response surface method

Jin'gangshi yu moliao moju gongcheng, 2022
To improve the polishing efficiency and precision, the optimum processing parameters of Si in the chemical mechanical polishing (CMP) process were analysed by CMP experiments and response surface methodology.
BIAN Da, SONG Enmin, NI Zifeng, QIAN Shanhua, ZHAO Yongwu   +4 more
doaj   +3 more sources