Results 1 to 10 of about 1,122 (152)

Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review [PDF]

International Journal of Precision Engineering and Manufacturing-Green Technology, 2021
Chemical mechanical polishing (CMP) is an essential planarization process for semiconductor manufacturing. The application of CMP has been increasing in semiconductor fabrication for highly integrated devices. Recently, environmental burden caused by the CMP process was assessed because of interest in the global environment.
Lee H, Kim H, Jeong H.
europepmc   +4 more sources

Study on Chemical Mechanical Polishing of Single-Crystal Diamond with a Novel Nicotinic Acid–Hydrogen Peroxide Green Slurry [PDF]

Micromachines
Single-crystal diamond (SCD) has the characteristics of a hard surface and stable chemical properties, making it difficult to achieve ultra-smooth and ultra-low-damage surface polishing using conventional polishing slurries.
Jixiang Yi, Longxing Liao, Yiming Fang
doaj   +2 more sources

Optimization of the Immersion Chemical-Mechanical Polishing Process for Gear [PDF]

Micromachines
To address surface quality defects caused by traditional mechanical polishing of gears, such as machining scratches and large surface waviness, this study proposes a novel immersed chemical-mechanical polishing (CMP) process for gear finishing. Numerical
Jian Sun, Longxing Liao, Fuli Cai, Mengqiao Guan   +3 more
doaj   +2 more sources

Research on the Application of Diamond Film in Chemical Mechanical Polishing [PDF]

Nanomaterials
Polishing pad conditioners are of critical importance in chemical mechanical polishing (CMP), acting as a key determinant of CMP efficiency and an indispensable consumable in the polishing process.
Yibao Wang, Xueyu Zhang, Fengxiang Guo, Mei Zhang, Xiaoling Sun, Lili Zhang, Guangsen Xia, Xu Chai, Shaoyan Wang, Xuesong Zhou, Zhigang Gai   +10 more
doaj   +2 more sources

A novel immersion chemical mechanical polishing device and tailored slurry for processing heavy duty gas turbine compressor blades [PDF]

Scientific Reports
As a key component of heavy-duty gas turbines, the compressor blades typically have complex free-form surfaces. These blades are widely made of martensitic stainless steel, which has excellent high strength, high corrosion resistance, and wear resistance,
Qiyuan Li, Yaowen Wu, Liguang Dong, Yihai Liu, Qiang Dong, Lin Yang, Dingjun Li, Xiaocong Xiong, Ke Zhou   +8 more
doaj   +2 more sources

A Comprehensive Review of the Nano-Abrasives Key Parameters Influencing the Performance in Chemical Mechanical Polishing [PDF]

Nanomaterials
Chemical Mechanical Polishing (CMP) is a critical process in many industries where achieving superior surface quality through controlled material removal rates by using nano-abrasives is essential.
Houda Bellahsene, Saad Sene, Gautier Félix, Joulia Larionova, Marc Ferrari, Yannick Guari   +5 more
doaj   +2 more sources

Chemical mechanical polishing as an alternative surface treatment technique for corrosion prevention of carbon steel in an acidic medium [PDF]

Scientific Reports
Chemical mechanical polishing (CMP) has been a standard technique in semiconductor manufacturing for achieving smooth surfaces. CMP utilizes a synergistic interplay of chemical and mechanical interactions to achieve the desired removal rates, selectivity,
Mohamed Ahmed, Buthainah Ali Al-Timimi, Maha Al-Ali, Ghassan H. Abdullah, Safa Khalaf Atiyaha, Ahmed Yaseen Ali Aljanabi, Maizirwan Mel   +6 more
doaj   +2 more sources

Investigation of the Visible Photocatalytic–Fenton Reactive Composite Polishing Process for Single-Crystal SiC Wafers Based on Response Surface Methodology [PDF]

Micromachines
The third-generation semiconductor single-crystal silicon carbide (SiC), as a typical difficult-to-machine material, improves the chemical reaction rate on the SiC surface during the polishing process, which is key to realizing efficient chemical ...
Zijuan Han, Bo Ran, Jisheng Pan, Rongji Zhuang   +3 more
doaj   +2 more sources

One‐Step, High‐Removal‐Rate and Low‐Damage Chemical Mechanical Polishing of InP Enabled by Hydrolysis Activated PF6− with In Situ Fluoride Passivation [PDF]

Advanced Science
Achieving high‐throughput, low‐damage preparation of indium phosphide (InP) surfaces remains challenging because increasing the material removal rate (MRR) in chemical mechanical polishing (CMP) often compromises ultralow roughness and requires post‐CMP ...
Shigong Fu, Jianwei Zhou, Chenwei Wang, Yanchao Ge, Chong Luo, Yuhang Qi   +5 more
doaj   +2 more sources

Monodisperse SiO₂ Spheres: Efficient Synthesis and Applications in Chemical Mechanical Polishing [PDF]

Nanomaterials
The atomic level polishing of a material surface affects the accuracy of devices and the application of materials. Silica slurries play an important role in chemical mechanical polishing (CMP) by polishing the material surface.
Jinlong Ge, Yu Cao, Hui Han, Xiaoqi Jin, Jing Liu, Yuhong Jiao, Qiuqin Wang, Yan Gao   +7 more
doaj   +2 more sources