Results 41 to 50 of about 1,061 (174)

High-efficiency planarization method combining mechanical polishing and atmospheric-pressure plasma etching for hard-to-machine semiconductor substrates

Mechanical Engineering Journal, 2016
A high-efficiency planarization technique for preprocessing before final polishing is needed for hard-to-machine wide-band-gap semiconductors, such as silicon carbide (SiC), gallium nitride, and diamond.
Yasuhisa SANO, Kousuke SHIOZAWA, Toshiro DOI, Syuhei KUROKAWA, Hideo AIDA, Tadakazu MIYASHITA, Kazuto YAMAUCHI   +6 more
doaj   +1 more source

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Friction, 2023
The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was investigated in ...
Lei Xu, Kihong Park, Hong Lei, Pengzhan Liu, Eungchul Kim, Yeongkwang Cho, Taesung Kim, Chuandong Chen   +7 more
doaj   +1 more source

Engineering SiO2 Nanoparticles: A Perspective on Chemical Mechanical Planarization Slurry for Advanced Semiconductor Processing

KONA Powder and Particle Journal, 2023
Chemical mechanical polishing (CMP) is a process that uses mechanical abrasive particles and chemical interaction in slurry to remove materials from the surface of films. With advancements in semiconductor device technology applying various materials and
Ganggyu Lee, Kangchun Lee, Seho Sun, Taeseup Song, Ungyu Paik   +4 more
doaj   +1 more source

Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing

Micromachines, 2023
Endpoint detection is an important technology in chemical mechanical polishing (CMP), which is used to capture the material interface and compensate the variations of consumables and incoming wafer thickness.
Fangxin Tian, Tongqing Wang, Xinchun Lu
doaj   +1 more source

Electrochemical Characterizations on Chemical Mechanical Polishing Compositions of Polishing Ruthenium Films in CMP Processes [PDF]

ECS Meeting Abstracts, 2012
Abstract not Available.
Tom X. Shi, James Henry, James Schlueter
openaire   +1 more source

Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces

Lubricants, 2017
This paper provides a tribochemical study of the selective layer surface by chemical mechanical planarization (CMP). CMP is used to remove excess material obtained in the process of selective transfer.
Filip Ilie, George Ipate
doaj   +1 more source

Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

Applied Sciences, 2021
The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures.
Hanchul Cho, Taekyung Lee, Doyeon Kim, Hyoungjae Kim   +3 more
doaj   +1 more source

Designable van der Waals Crystal for Artificial Neuronal Cell Mimicking

Advanced Materials, EarlyView.
Designable van der Waals crystal has been demonstrated for device‐scale neuronal cell mimicking. The structural similarity between ion‐channel in biological membranes and layered vdW lattices is realized with nano‐crystallization via Ar + H2S plasma sulfurization.
Jinhyoung Lee, Gunhyoung Kim, Dongho Lee, Seowoo Son, Hyunho Seok, Sihoon Son, Hyunbin Choi, Geonwook Kim, Geumji Back, Hyunkyu Kim, Chaerin Park, Junmin Ahn, Seongyun Je, Chaeyoung Im, Junil Cho, Magdalena Grzeszczyk, Seongho Kim, Eunseo Go, Hyunwoo Shim, Donghwan Choi, Muyoung Kim, Hyoeng‐U. Kim, Won‐Jun Jang, Taesung Kim   +23 more
wiley   +1 more source

A distinctive material removal mode in chemical mechanical polishing besides chemical bonding and mechanical plowing: Shear slipping

Friction
Layered materials, such as bismuth, offer exceptional properties for future integrated circuits (ICs). Research is underway to adapt these materials to conventional IC manufacturing processes, such as chemical mechanical polishing (CMP). However, the CMP
Yushan Chen, Liuyue Xu, Yuan Wu, Liao Zhou, Yuting Wei, Zihan Zheng, Hui Li, Liang Jiang, Linmao Qian   +8 more
doaj   +1 more source

Tunable Extraordinary Optical Transmission in the Long‐Wavelength Infrared Range Using Electrostatic MEMS Actuation

Advanced Materials Technologies, EarlyView.
A MEMS‐integrated metamaterial filter enables continuous, low‐voltage spectral tuning in the long‐wavelength infrared (LWIR). The device employs extraordinary optical transmission in a dual suspended metasurface stack, where electrostatic actuation precisely controls the intermembrane air gap.
Oleg Bannik, Fedor Kovalev, Michal Zawierta, Dilusha Silva, Lorenzo Faraone, Ilya Shadrivov, Mariusz Martyniuk   +6 more
wiley   +1 more source