Results 41 to 50 of about 14,575 (156)

Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

Applied Sciences, 2021
The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures.
Hanchul Cho, Taekyung Lee, Doyeon Kim, Hyoungjae Kim   +3 more
doaj   +1 more source

Microscopic Origin of Temperature‐Dependent Anisotropic Heat Transport in Ultrawide‐Bandgap Rutile GeO2

Advanced Functional Materials, Volume 36, Issue 58, 20 July 2026.
Rutile GeO2${\rm GeO}_{2}$ exhibits orientation‐dependent heat transport with temperature‐dependent anisotropy, showing higher cross‐plane thermal conductivity along [001] than along the equivalent in‐plane [100] and [010] directions. Temperature‐dependent TDTR measurements and first‐principles phonon calculations identify the microscopic phonon ...
Pouria Emtenani, Marta Loletti, Felix Nippert, Eduardo Bedê Barros, Zbigniew Galazka, Hans Tornatzky, Christian Thomsen, Juan Sebastián Reparaz, Riccardo Rurali, Markus R. Wagner   +9 more
wiley   +1 more source

Multi grade polishing pad for sapphire chemical mechanical polishing

Journal of Materials Research and Technology
The synergy between polishing pad and abrasive is the key to material removal in chemical mechanical polishing (CMP). In order to achieve uniform material removal, a new multi gradient polishing pad for sapphire CMP was developed.
Zhaohui Deng, Rongjin Zhuo, Zhongyang Li, Wei Cao, Shangci Huang, Jimin Ge   +5 more
doaj   +1 more source

Designable van der Waals Crystal for Artificial Neuronal Cell Mimicking

Advanced Materials, Volume 38, Issue 38, 8 July 2026.
Designable van der Waals crystal has been demonstrated for device‐scale neuronal cell mimicking. The structural similarity between ion‐channel in biological membranes and layered vdW lattices is realized with nano‐crystallization via Ar + H2S plasma sulfurization.
Jinhyoung Lee, Gunhyoung Kim, Dongho Lee, Seowoo Son, Hyunho Seok, Sihoon Son, Hyunbin Choi, Geonwook Kim, Geumji Back, Hyunkyu Kim, Chaerin Park, Junmin Ahn, Seongyun Je, Chaeyoung Im, Junil Cho, Magdalena Grzeszczyk, Seongho Kim, Eunseo Go, Hyunwoo Shim, Donghwan Choi, Muyoung Kim, Hyoeng‐U. Kim, Won‐Jun Jang, Taesung Kim   +23 more
wiley   +1 more source

Research on the Application of Diamond Film in Chemical Mechanical Polishing

Nanomaterials
Polishing pad conditioners are of critical importance in chemical mechanical polishing (CMP), acting as a key determinant of CMP efficiency and an indispensable consumable in the polishing process.
Yibao Wang, Xueyu Zhang, Fengxiang Guo, Mei Zhang, Xiaoling Sun, Lili Zhang, Guangsen Xia, Xu Chai, Shaoyan Wang, Xuesong Zhou, Zhigang Gai   +10 more
doaj   +1 more source

Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding

Friction, 2023
With the rapid development of semiconductors, the number of materials needed to be polished sharply increases. The material properties vary significantly, posing challenges to chemical mechanical polishing (CMP).
Yuan Wu, Liang Jiang, Wenhui Li, Jiaxin Zheng, Yushan Chen, Linmao Qian   +5 more
doaj   +1 more source

Tunable Extraordinary Optical Transmission in the Long‐Wavelength Infrared Range Using Electrostatic MEMS Actuation

Advanced Materials Technologies, Volume 11, Issue 14, 22 July 2026.
A MEMS‐integrated metamaterial filter enables continuous, low‐voltage spectral tuning in the long‐wavelength infrared (LWIR). The device employs extraordinary optical transmission in a dual suspended metasurface stack, where electrostatic actuation precisely controls the intermembrane air gap.
Oleg Bannik, Fedor Kovalev, Michal Zawierta, Dilusha Silva, Lorenzo Faraone, Ilya Shadrivov, Mariusz Martyniuk   +6 more
wiley   +1 more source

Review on modeling and application of chemical mechanical polishing

Nanotechnology Reviews, 2020
With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang, Wei Zhen, Wang Weilei, Feng Daohuan, Xu Aoxue, Liu Weili, Song Zhitang   +6 more
doaj   +1 more source

Electrochemical Characterizations on Chemical Mechanical Polishing Compositions of Polishing Ruthenium Films in CMP Processes [PDF]

ECS Meeting Abstracts, 2012
Abstract not Available.
Tom X. Shi, James Henry, James Schlueter
openaire   +1 more source

Unraveling the Molecular Mechanisms Underlying Spontaneous Multipolar Mitosis Through CIN‐seq

Advanced Science, Volume 13, Issue 40, 17 July 2026.
Multipolar mitosis, a hallmark of chromosomal instability (CIN), drives tumor heterogeneity but is challenging to study in live cells. Using CIN‐seq, a single‐cell multiomics method, we profiled rare CIN events and identified mechanisms associated with viable multipolar mitosis, including PTEN attenuation, Rho GTPase‐driven cytokinesis failure, and ...
Pin‐Rui Su, Ting‐Chun Chou, Maria Teresa López‐Cascales, Junfeng Huang, Tsai‐Ying Chen, Sjoukje van Wieren, Chan Li, Cecile Beerens, Li You, Jelle Storteboom, Miao‐Ping Chien   +10 more
wiley   +1 more source