Results 41 to 50 of about 7,532,110 (199)

Studies on slurry design fundamentals for advanced CMP applications [PDF]

, 2013
Due to copyright restrictions, the access to the full text of this article is only available via subscription.New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization ...
Vakarelski, Ivan Uriev, Özdemir, Zeynep, Chen, L., Basim, G. B., Ozdemir, Z., Chen, Long, Karagoz, A., Vakarelski, I. U., Başım, Gül Bahar, Karagöz, Ayşe   +9 more
core   +1 more source

Metal oxide nano film characterization for CMP optimization

, 2013
Due to copyright restrictions, the access to the full text of this article is only available via subscription.This paper focuses on the planarization of metallic films in microelectronics manufacturing by CMP through investigation of metal oxide thin ...
Özdemir, Zeynep, Başım, Gül Bahar, Karagöz, Ayşe   +2 more
core   +1 more source

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Friction, 2023
The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was investigated in ...
Lei Xu, Kihong Park, Hong Lei, Pengzhan Liu, Eungchul Kim, Yeongkwang Cho, Taesung Kim, Chuandong Chen   +7 more
doaj   +1 more source

MAPA: A Semantic Network Framework for Functional Module Discovery and Interpretation in Multi‐Omics Data

Advanced Science, EarlyView.
MAPA transforms complex multi‐omics data into biologically coherent functional modules by integrating pathway information with molecular interaction networks. Retrieval‐augmented large language models then generate structured, literature‐informed interpretations.
Yifei Ge, Feifan Zhang, Yijiang Liu, Chao Jiang, Peng Gao, Nguan Soon Tan, Sai Zhang, Yuchen Shen, Qianyi Zhou, Xin Zhou, Xiao Wang, Fangqing Zhao, Chuchu Wang, Xiaotao Shen   +13 more
wiley   +1 more source

Determining the Relationship Between Composition, Structure, and Device Properties of GexSe1‐x‐Based Selector‐Only Memory

Advanced Electronic Materials, EarlyView.
Composition‐dependent structural evolution in GeXSe1‐X selector‐only memory (SOM) is correlated with device switching behavior. Increasing Ge strengthens network rigidity, suppresses atomic motion, and stabilizes threshold switching, while narrowing the memory window. The revealed structure–property relationship provides a guideline for compositionally
Tien Anh Nguyen, Changdeok Han, Dipannita Ghosh, Suyong Chae, Moongyu Choi, Sanghyun Ban, Myoungsub Kim, Sangmin Yoo, Seung Hwan Lee, Sieun Chae   +9 more
wiley   +1 more source

Chemical mechanical polishing (CMP) of gallium oxide: Experiments and simulation

, 2023
Gallium oxide has become a material of interest in semiconductor manufacturing in recent years. Primarily due to its superior electrical properties and potential for manufacturing with technology being used for silicon. Understanding chemical, mechanical,
Sonal, Sonal
core  

A distinctive material removal mode in chemical mechanical polishing besides chemical bonding and mechanical plowing: Shear slipping

Friction
Layered materials, such as bismuth, offer exceptional properties for future integrated circuits (ICs). Research is underway to adapt these materials to conventional IC manufacturing processes, such as chemical mechanical polishing (CMP). However, the CMP
Yushan Chen, Liuyue Xu, Yuan Wu, Liao Zhou, Yuting Wei, Zihan Zheng, Hui Li, Liang Jiang, Linmao Qian   +8 more
doaj   +1 more source

Interface Engineering in Piezoelectric‐on‐Insulator Platforms: Coupling of Electrons, Photons, and Phonons for Multifunctional Integration

Electron, EarlyView.
The underlying interface physics and engineering strategies across key POI material systems, including LiNbO3/Si, LiNbO3/SiC, LiNbO3/diamond, and AlN/diamond, were reviewed. The key engineering strategies such as atomic‐scale bonding optimization, nanostructuring, ultrathin phonon‐bridge interlayers, and ferroelectric domain wall engineering for ...
Yunjia Bao, Zhiqiang Wang, Rongbang Yang, Gongbin Tang, Ruiqiang Guo, Kunfeng Chen, Wen Hu   +6 more
wiley   +1 more source

Engineering SiO2 Nanoparticles: A Perspective on Chemical Mechanical Planarization Slurry for Advanced Semiconductor Processing

KONA Powder and Particle Journal, 2023
Chemical mechanical polishing (CMP) is a process that uses mechanical abrasive particles and chemical interaction in slurry to remove materials from the surface of films. With advancements in semiconductor device technology applying various materials and
Ganggyu Lee, Kangchun Lee, Seho Sun, Taeseup Song, Ungyu Paik   +4 more
doaj   +1 more source

High‐Speed Integrated Graphene‐Silicon Slot‐Waveguide Electro‐Absorption Modulator at 2 and 1.5 µm Wavebands

Laser &Photonics Reviews, EarlyView.
A high‐speed, efficient, robust, and compact 2‐μm$\mathrm{\mu}\mathrm{m}$ waveband E/O absorption modulator based on a graphene‐silicon slot waveguide is demonstrated. This work represents a significant advancement towards the realization of high‐speed integrated E/O modulators for optical communication systems operating at the 2‐μm$\mathrm{\mu}\mathrm{
Chao Luan, Deming Kong, Yunhong Ding, Hao Hu   +3 more
wiley   +1 more source