Results 41 to 50 of about 6,173 (209)
Mechanics,Mechanisms and Modeling of the Chemical Mechanical Polishing Process [PDF]
, 2002 The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fabrication. However, due to the complexity of process parameters on the material removal rate (MRR), mechanism of material removal and pattern effect are ...
Chun, Jung-Hoon +3 more
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Characterisation and macro-modeling of patterned micronic and nano-scale dummy metal-fills in integrated circuits [PDF]
, 2009 In this paper, a wideband characterization and macro-modeling of patterned micronic and nano-scale dummy metal-fills is presented. Impacts of patterned dummy metal-fill topologies including square, cross, vertical and horizontal shaped arrays on ...
Bajon, Damienne, Wane, Sidina
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Electrochemical Characterizations on Chemical Mechanical Polishing Compositions of Polishing Ruthenium Films in CMP Processes [PDF]
ECS Meeting Abstracts, 2012 Abstract not Available.
Tom X. Shi, James Henry, James Schlueter
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Advanced Materials Technologies, EarlyView.A MEMS‐integrated metamaterial filter enables continuous, low‐voltage spectral tuning in the long‐wavelength infrared (LWIR). The device employs extraordinary optical transmission in a dual suspended metasurface stack, where electrostatic actuation precisely controls the intermembrane air gap.
Oleg Bannik +6 more
wiley +1 more source
FrictionLayered materials, such as bismuth, offer exceptional properties for future integrated circuits (ICs). Research is underway to adapt these materials to conventional IC manufacturing processes, such as chemical mechanical polishing (CMP). However, the CMP
Yushan Chen +8 more
doaj +1 more source
Micromachines, 2020 Fluidized bed machining (FBM) is used for the surface finishing or cleaning of complex 3D machine parts. FBM is a process of injecting air into a chamber to encourage particles into a fluid-like state.
Taekyoung Kim, Hyunseop Lee
doaj +1 more source
Unraveling the Molecular Mechanisms Underlying Spontaneous Multipolar Mitosis Through CIN‐seq
Advanced Science, EarlyView.Multipolar mitosis, a hallmark of chromosomal instability (CIN), drives tumor heterogeneity but is challenging to study in live cells. Using CIN‐seq, a single‐cell multiomics method, we profiled rare CIN events and identified mechanisms associated with viable multipolar mitosis, including PTEN attenuation, Rho GTPase‐driven cytokinesis failure, and ...
Pin‐Rui Su +10 more
wiley +1 more source
Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding
Friction, 2023 With the rapid development of semiconductors, the number of materials needed to be polished sharply increases. The material properties vary significantly, posing challenges to chemical mechanical polishing (CMP).
Yuan Wu +5 more
doaj +1 more source
Advanced Science, EarlyView.In this work, we propose a CMP method for InP using NH4PF₆, which hydrolyzes under In3+ catalysis to form reactive species. These convert InP into low‐binding‐energy fluorides, facilitating removal and dissolution. The process delivers high material removal rates, smooth surfaces, and fluorine passivation that lowers defect density and improves ...
Shigong Fu +5 more
wiley +1 more source
Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures [PDF]
, 2004 Long the dominant method of wafer planarization in the integrated circuit (IC) industry, chemical-mechanical polishing is starting to play an important role in microelectromechnical systems (MEMS).
Boning, Duane S., Tang, Brian D.
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