Results 31 to 40 of about 14,575 (156)
Polymers, 2023 Chemical mechanical planarization (CMP) is a wafer-surface-polishing planarization technique based on a wet procedure that combines chemical and mechanical forces to fully flatten materials for semiconductors to be mounted on the wafer surface.
W. Chiu, Ching-I. Huang
semanticscholar +1 more source
Contrast Experiments in Dielectrophoresis Polishing (DEPP)/Chemical Mechanical Polishing (CMP) of Sapphire Substrate [PDF]
Applied Sciences, 2019 The broad applications of sapphire substrates in many fields warrants an urgent demand for a highly efficient and high precision polishing method for the sapphire substrates. The authors proposed a novel sapphire substrate polishing method that is based on the dielectrophoresis (DEP) effect.
Tianchen Zhao +5 more
openaire +2 more sources
Laser &Photonics Reviews, EarlyView.A high‐speed, efficient, robust, and compact 2‐μm$\mathrm{\mu}\mathrm{m}$ waveband E/O absorption modulator based on a graphene‐silicon slot waveguide is demonstrated. This work represents a significant advancement towards the realization of high‐speed integrated E/O modulators for optical communication systems operating at the 2‐μm$\mathrm{\mu}\mathrm{
Chao Luan +3 more
wiley +1 more source
MicromachinesThe third-generation semiconductor single-crystal silicon carbide (SiC), as a typical difficult-to-machine material, improves the chemical reaction rate on the SiC surface during the polishing process, which is key to realizing efficient chemical ...
Zijuan Han +3 more
doaj +1 more source
Lubricants, 2017 This paper provides a tribochemical study of the selective layer surface by chemical mechanical planarization (CMP). CMP is used to remove excess material obtained in the process of selective transfer.
Filip Ilie, George Ipate
doaj +1 more source
Advanced Sensor Research, Volume 5, Issue 8, August 2026.This report presents an 8‐inch quasi‐standard piezoelectric integrated MEMS technology (PIMT) platform which, through the integration of core and additional processes, reliably supports three rounds of multi‐project wafer (MPW) fabrication. Whilst ensuring support for mass production processes, the platform offers certain flexibility, providing a ...
Yongquan Su +18 more
wiley +1 more source
Clinical and Translational Allergy, Volume 16, Issue 8, August 2026.ABSTRACT Allergic Rhinitis and its Impact on Asthma (ARIA) was, up until 2017, a guideline using the best evidence (Grading of Recommendations, Assessment, Development and Evaluation, GRADE) and developed as a change management strategy. A second change management strategy—in collaboration with the European Academy of Allergy and Clinical Immunology ...
Jean Bousquet +155 more
wiley +1 more source
De novo or Salvage? Nucleotide Availability as a Driver of Bacterial Adaptation and Virulence
MicrobiologyOpen, Volume 15, Issue 4, August 2026.Bacterial pathogens survive in different host environments by switching between making nucleotides by de novo synthesis and scavenging them from the host. This flexibility supports growth and virulence making nucleotide metabolism an attractive therapeutic target.
Riya Joshi +2 more
wiley +1 more source
physica status solidi (a), Volume 223, Issue 14, 22 July 2026.Backside thinning techniques critically influence GaN laser performance. Compared to lapping, grinding reduces subsurface damage depth fivefold and lowers wafer bow, while mechanical polishing eliminates subsurface damage entirely. These improvements directly translate to smoother cleaved facets and a nearly 40% reduction in laser threshold current ...
S. Makhladi +6 more
wiley +1 more source
Optimization of the Immersion Chemical-Mechanical Polishing Process for Gear
MicromachinesTo address surface quality defects caused by traditional mechanical polishing of gears, such as machining scratches and large surface waviness, this study proposes a novel immersed chemical-mechanical polishing (CMP) process for gear finishing. Numerical
Jian Sun +3 more
doaj +1 more source