Results 31 to 40 of about 7,532,110 (199)
Recent Developments in Chemical Mechanical Polishing (CMP) for Precision Manufacturing
International Journal of Advanced Research in Science, Communication and Technology, 2022 Advanced developments and applications of Chemical Mechanical Planarization/Polishing (CMP) did by researchers in current decade were discussed in this article. Topics on which this article forms the basis are Abrasives and slurry developments, environment and safety conditions, manufacturing process improvements, modelling and simulations methods for ...
null Amey S. Kulkarni, null Ankur Gupta
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Applications of chemical mechanical planarization (CMP) to More than Moore devices
, 2022 S.463-485In addition to the ongoing increase in memory capacity and microprocessor performance of devices ("More Moore"), other functionalities like analogue/RF devices, passive components, high voltage and power transistors, sensors and actuators (MEMS,
Zwicker, G.
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Slurry Design for Chemical Mechanical Polishing
KONA Powder and Particle Journal, 2014 Chemical Mechanical Polishing (CMP) process is widely used in the microelectronics industry for planarization of metal and dielectric layers to achieve multi-layer metallization.
G. Bahar Basim, Brij M. Moudgil
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Silica nanoparticles separation from water: aggregation by cetyltrimethylammonium bromide (CTAB) [PDF]
, 2013 Nanoparticles will inevitably be found in industrial and domestic wastes in the near future and as a consequence soon in water resources. Due to their ultra-small size, nanoparticles may not only have new hazards for environment and human health, but ...
Tourbin, Mallorie +3 more
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Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a process that planarizes semiconductor surfaces and is essential for the manufacture of highly integrated devices.
Jungyu Son, Hyunseop Lee
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A New Environmentally Friendly Chemical Mechanical Polishing Method Applied for Surface Finishing Ti-6Al-4V Alloy [PDF]
, 2023 A new eco-friendly slurry has been developed for the chemical mechanical polishing process with a solution of malic acid, deionized water, and an oxidizing agent hydrogen peroxide (H2O2).
Tung, Nguyen Tien +15 more
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Atomically smooth gallium nitride surface prepared by chemical-mechanical polishing with S2O82−-Fe2+ based slurry [PDF]
, 2016 In this paper, a significant improvement of chemical-mechanical polishing on gallium nitride with S2O82--Fe2+ based slurry is presented in detail. The results indicate that the S2O82--Fe2+ additives possessed obvious effect to enhance the polishing ...
Xu, Li +6 more
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Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System
Applied Sciences, 2020 This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure
Chao-Chang A. Chen +4 more
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Soft Chemical Mechanical Polishing Pad for Oxide CMP Applications
ECS Journal of Solid State Science and Technology, 2021 Chemical mechanical polishing (CMP) is widely accepted as the best planarization technique for fabricating nanoscale devices. A soft CMP pad that can enable higher oxide removal rates (RRs) and good planarity has been proposed for oxide CMP applications. In this study, three pads namely, Pad-1 (hard), Pad-2 (soft), and a commercial pad (hard) were used
N. B. Kenchappa +6 more
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Mechanical Engineering Journal, 2016 A high-efficiency planarization technique for preprocessing before final polishing is needed for hard-to-machine wide-band-gap semiconductors, such as silicon carbide (SiC), gallium nitride, and diamond.
Yasuhisa SANO +6 more
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