Results 51 to 60 of about 6,173 (209)

Kidney Hematopoietic Stem and Progenitor Cells Contribute to Myeloid Development and Pathology in Lupus Nephritis

Arthritis &Rheumatology, Accepted Article.
Objectives The hematopoietic system maintains homeostasis by balancing myeloid and lymphoid cell production in the bone marrow (BM). In response to increased hematopoietic demand, extramedullary hematopoiesis (EMH) may occur in non‐lymphoid organs. We investigated the role of EMH and kidney‐resident hematopoietic stem and progenitor cells (HSPCs) in ...
Hansol Yi, Seyoung Jung, Jeong Ho Joo, Young‐Eun Kim, Heounjeong Go, Yong‐Gil Kim, Chang‐Keun Lee, Bin Yoo, Jeong Seok Lee, Seokchan Hong   +9 more
wiley   +1 more source

In Situ Metrology for Pad Surface Monitoring in CMP Using a Common-Path Phase-Shifting Interferometry: A Feasibility Study

Applied Sciences, 2021
In the fabrication of semiconductors, chemical mechanical polishing (CMP) is an essential wafer-planarization process. For optimal CMP, it is crucial to monitor the texture of the polishing pad; this leads to homogenous planarization of wafers. Hence, we
Eun-Soo Kim, Woo-June Choi
doaj   +1 more source

Emerging research directions in nanoparticle‐based foam control for bioprocessing: a bibliometric approach

Biofuels, Bioproducts and Biorefining, EarlyView.
Abstract Overfoaming remains a critical challenge in industrial bioprocesses, compromising mass transfer, operational stability, and downstream efficiency in bioreactors and wastewater treatment systems. This study provides a bibliometric and scientometric assessment of nanoparticle‐enabled foam control to map technological trends and identify research
Antonio Átila Menezes Ferreira, John Hebert da Silva Felix, Thiago Queiroz da Silva, Larissa Oliveira Araújo, Maria Tayane Barroso dos Santos, Larysse Maria Santiago de Castro, José Cleiton Sousa dos Santos   +6 more
wiley   +1 more source

Review on modeling and application of chemical mechanical polishing

Nanotechnology Reviews, 2020
With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang, Wei Zhen, Wang Weilei, Feng Daohuan, Xu Aoxue, Liu Weili, Song Zhitang   +6 more
doaj   +1 more source

Analysis of Correlation between Pad Temperature and Asperity Angle in Chemical Mechanical Planarization

Applied Sciences, 2021
Chemical mechanical planarization (CMP) is a technology widely employed in device integration and planarization processes used in semiconductor fabrication. In CMP, the polishing pad plays a key role both mechanically and chemically.
Seonho Jeong, Kyeongwoo Jeong, Jinuk Choi, Haedo Jeong   +3 more
doaj   +1 more source

Keggin‐Type Aluminum Polyoxometalate‐Mediated Oxidation of Amorphous Carbon for Engineered Electrochemical Interfaces

Carbon Energy, EarlyView.
Keggin‐type Al‐POM‐coated silica achieves selective surface oxidation of amorphous carbon through electrostatic attraction and proton‐coupled oxidation, tailoring interfacial properties for lithium‐ion batteries and semiconductor processes. ABSTRACT Amorphous carbon is widely used in energy storage and semiconductor technologies, where surface ...
Ganggyu Lee, Dongmin Kang, Sumin Hong, Hongjun Park, Myungju Woo, Woojin Jeong, Giha Lee, Junsang Lee, Sangkyun Kim, Jea‐Gun Park, Takamasa Mori, Yehwan Kim, Taeseup Song, Ungyu Paik   +13 more
wiley   +1 more source

Multi grade polishing pad for sapphire chemical mechanical polishing

Journal of Materials Research and Technology
The synergy between polishing pad and abrasive is the key to material removal in chemical mechanical polishing (CMP). In order to achieve uniform material removal, a new multi gradient polishing pad for sapphire CMP was developed.
Zhaohui Deng, Rongjin Zhuo, Zhongyang Li, Wei Cao, Shangci Huang, Jimin Ge   +5 more
doaj   +1 more source

Noise properties of high-T-c superconducting flux transformers fabricated using chemical-mechanical polishing [PDF]

, 2012
Reproducible high-temperature superconducting multilayer flux transformers were fabricated using chemical mechanical polishing. The measured magnetic field noise of the flip-chip magnetometer based on one such flux transformer with a 9 x 9 mm(2) pickup ...
Chukharkin, Maxim, Kalaboukhov, Alexei, Lai, Zonghe, Schneiderman, Justin F., Snigirev, O., Winkler, Dag, Öisjöen, Fredrik   +6 more
core   +1 more source

Prediction of Removal Rates in Chemical–Mechanical Polishing (CMP) Using Tribocorrosion Modeling [PDF]

Journal of Bio- and Tribo-Corrosion, 2016
The influence of electrochemical parameters, open circuit potential, and passivation kinetics, on the removal rates of tungsten in chemical–mechanical polishing (CMP) was investigated in the presented study. Removal rates were measured on a CMP machine, while electrochemical test were performed separately, both using technical CMP slurries ...
J. Stojadinović, D. Bouvet, S. Mischler
openaire   +1 more source

Impact of Nickel Diffusion on Leakage Current Degradation in β‐Ga2O3 Schottky Barrier Diodes

Information &Functional Materials, EarlyView.
The diffusion of Ni atoms during Schottky electrode fabrication induces localized stress defects in β‐Ga₂O₃ substrates, which act as primary reverse leakage pathways in SBDs. Elucidating this mechanism provides critical guidance for optimizing electrode composition in high‐performance β‐Ga₂O₃ electronics.
Ziyi Wang, Zhu Jin, Defan Wu, Xiliang Luo, Zhongyi Lin, Yingying Liu, Ning Xia, Cheng Li, Hui Zhang, Deren Yang   +9 more
wiley   +1 more source