Results 51 to 60 of about 1,061 (174)

Unraveling the Molecular Mechanisms Underlying Spontaneous Multipolar Mitosis Through CIN‐seq

Advanced Science, EarlyView.
Multipolar mitosis, a hallmark of chromosomal instability (CIN), drives tumor heterogeneity but is challenging to study in live cells. Using CIN‐seq, a single‐cell multiomics method, we profiled rare CIN events and identified mechanisms associated with viable multipolar mitosis, including PTEN attenuation, Rho GTPase‐driven cytokinesis failure, and ...
Pin‐Rui Su, Ting‐Chun Chou, Maria Teresa López‐Cascales, Junfeng Huang, Tsai‐Ying Chen, Sjoukje van Wieren, Chan Li, Cecile Beerens, Li You, Jelle Storteboom, Miao‐Ping Chien   +10 more
wiley   +1 more source

Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding

Friction, 2023
With the rapid development of semiconductors, the number of materials needed to be polished sharply increases. The material properties vary significantly, posing challenges to chemical mechanical polishing (CMP).
Yuan Wu, Liang Jiang, Wenhui Li, Jiaxin Zheng, Yushan Chen, Linmao Qian   +5 more
doaj   +1 more source

Emerging research directions in nanoparticle‐based foam control for bioprocessing: a bibliometric approach

Biofuels, Bioproducts and Biorefining, EarlyView.
Abstract Overfoaming remains a critical challenge in industrial bioprocesses, compromising mass transfer, operational stability, and downstream efficiency in bioreactors and wastewater treatment systems. This study provides a bibliometric and scientometric assessment of nanoparticle‐enabled foam control to map technological trends and identify research
Antonio Átila Menezes Ferreira, John Hebert da Silva Felix, Thiago Queiroz da Silva, Larissa Oliveira Araújo, Maria Tayane Barroso dos Santos, Larysse Maria Santiago de Castro, José Cleiton Sousa dos Santos   +6 more
wiley   +1 more source

Keggin‐Type Aluminum Polyoxometalate‐Mediated Oxidation of Amorphous Carbon for Engineered Electrochemical Interfaces

Carbon Energy, EarlyView.
Keggin‐type Al‐POM‐coated silica achieves selective surface oxidation of amorphous carbon through electrostatic attraction and proton‐coupled oxidation, tailoring interfacial properties for lithium‐ion batteries and semiconductor processes. ABSTRACT Amorphous carbon is widely used in energy storage and semiconductor technologies, where surface ...
Ganggyu Lee, Dongmin Kang, Sumin Hong, Hongjun Park, Myungju Woo, Woojin Jeong, Giha Lee, Junsang Lee, Sangkyun Kim, Jea‐Gun Park, Takamasa Mori, Yehwan Kim, Taeseup Song, Ungyu Paik   +13 more
wiley   +1 more source

Review on modeling and application of chemical mechanical polishing

Nanotechnology Reviews, 2020
With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang, Wei Zhen, Wang Weilei, Feng Daohuan, Xu Aoxue, Liu Weili, Song Zhitang   +6 more
doaj   +1 more source

In Situ Metrology for Pad Surface Monitoring in CMP Using a Common-Path Phase-Shifting Interferometry: A Feasibility Study

Applied Sciences, 2021
In the fabrication of semiconductors, chemical mechanical polishing (CMP) is an essential wafer-planarization process. For optimal CMP, it is crucial to monitor the texture of the polishing pad; this leads to homogenous planarization of wafers. Hence, we
Eun-Soo Kim, Woo-June Choi
doaj   +1 more source

High‐Efficiency Graphene‐Silicon Slot‐Waveguide Microring Modulator at 1.5 and 2 µm Wavelength Bands

Laser &Photonics Reviews, EarlyView.
E/O modulators typically face a trade‐off between bandwidth and modulation efficiency. An integrated E/O modulator is presented that simultaneously achieves wideband, large bandwidth, and high modulation efficiency operation by embedding a partially overlapped double‐layer graphene on a compact silicon slot‐waveguide microring resonator.
Chao Luan, Deming Kong, Yong Liu, Yunhong Ding, Hao Hu   +4 more
wiley   +1 more source

Multi grade polishing pad for sapphire chemical mechanical polishing

Journal of Materials Research and Technology
The synergy between polishing pad and abrasive is the key to material removal in chemical mechanical polishing (CMP). In order to achieve uniform material removal, a new multi gradient polishing pad for sapphire CMP was developed.
Zhaohui Deng, Rongjin Zhuo, Zhongyang Li, Wei Cao, Shangci Huang, Jimin Ge   +5 more
doaj   +1 more source

Analysis of Correlation between Pad Temperature and Asperity Angle in Chemical Mechanical Planarization

Applied Sciences, 2021
Chemical mechanical planarization (CMP) is a technology widely employed in device integration and planarization processes used in semiconductor fabrication. In CMP, the polishing pad plays a key role both mechanically and chemically.
Seonho Jeong, Kyeongwoo Jeong, Jinuk Choi, Haedo Jeong   +3 more
doaj   +1 more source

Epitaxial Integration of III–V Membrane Photodetectors With Lateral p–i–n Junctions on the Silicon‐On‐Insulator Waveguide Platform

Laser &Photonics Reviews, EarlyView.
Epitaxial growth forms III–V membranes directly atop the silicon waveguide layer on SOI, while in‐plane in situ doping defines lateral p–i–n InP/InGaAs junctions in a single growth step. The membrane photodetectors achieve 50 Gb/s NRZ‐OOK operation.
Zhao Yan, Yifu Chen, Martin Ebert, Ka Ming Wong, Wenjie Wang, Tim Grieb, Florian F. Krause, Andreas Rosenauer, Graham T. Reed, David J. Thomson, Qiang Li   +10 more
wiley   +1 more source