Results 51 to 60 of about 14,575 (156)

Chemical mechanical polishing as an alternative surface treatment technique for corrosion prevention of carbon steel in an acidic medium

Scientific Reports
Chemical mechanical polishing (CMP) has been a standard technique in semiconductor manufacturing for achieving smooth surfaces. CMP utilizes a synergistic interplay of chemical and mechanical interactions to achieve the desired removal rates, selectivity,
Mohamed Ahmed, Buthainah Ali Al-Timimi, Maha Al-Ali, Ghassan H. Abdullah, Safa Khalaf Atiyaha, Ahmed Yaseen Ali Aljanabi, Maizirwan Mel   +6 more
doaj   +1 more source

Effect of slurry composition on the chemical mechanical polishing of thin diamond films

Science and Technology of Advanced Materials, 2017
Nanocrystalline diamond (NCD) thin films grown by chemical vapour deposition have an intrinsic surface roughness, which hinders the development and performance of the films’ various applications. Traditional methods of diamond polishing are not effective
Jessica M. Werrell, Soumen Mandal, Evan L. H. Thomas, Emmanuel B. Brousseau, Ryan Lewis, Paola Borri, Philip R. Davies, Oliver A. Williams   +7 more
doaj   +1 more source

Emerging research directions in nanoparticle‐based foam control for bioprocessing: a bibliometric approach

Biofuels, Bioproducts and Biorefining, Volume 20, Issue 4, Page 1708-1728, July/August 2026.
Abstract Overfoaming remains a critical challenge in industrial bioprocesses, compromising mass transfer, operational stability, and downstream efficiency in bioreactors and wastewater treatment systems. This study provides a bibliometric and scientometric assessment of nanoparticle‐enabled foam control to map technological trends and identify research
Antonio Átila Menezes Ferreira, John Hebert da Silva Felix, Thiago Queiroz da Silva, Larissa Oliveira Araújo, Maria Tayane Barroso dos Santos, Larysse Maria Santiago de Castro, José Cleiton Sousa dos Santos   +6 more
wiley   +1 more source

Keggin‐Type Aluminum Polyoxometalate‐Mediated Oxidation of Amorphous Carbon for Engineered Electrochemical Interfaces

Carbon Energy, Volume 8, Issue 7, July 2026.
Keggin‐type Al‐POM‐coated silica achieves selective surface oxidation of amorphous carbon through electrostatic attraction and proton‐coupled oxidation, tailoring interfacial properties for lithium‐ion batteries and semiconductor processes. ABSTRACT Amorphous carbon is widely used in energy storage and semiconductor technologies, where surface ...
Ganggyu Lee, Dongmin Kang, Sumin Hong, Hongjun Park, Myungju Woo, Woojin Jeong, Giha Lee, Junsang Lee, Sangkyun Kim, Jea‐Gun Park, Takamasa Mori, Yehwan Kim, Taeseup Song, Ungyu Paik   +13 more
wiley   +1 more source

Characterization of wet pad surface in chemical mechanical polishing (CMP) process with full-field optical coherence tomography (FF-OCT).

Optics Express, 2011
Chemical mechanical polishing (CMP) is a key process for global planarization of silicon wafers for semiconductors and AlTiC wafers for magnetic heads. Removal rate of wafer material is directly dependent on the surface roughness of a CMP pad, thus the ...
W. Choi, Sung-Pyo Jung, J. Shin, Danning Yang, B. Lee   +4 more
semanticscholar   +1 more source

A Novel Laboratorial Approach to Evaluate Bacterial Microleakage of Endodontic Sealers

Current Protocols, Volume 6, Issue 7, July 2026.
Abstract To avoid failure of endodontic treatment, it is important to properly seal the root canals after chemomechanical preparation in order to avoid microleakage. Typically, sealing involves the use of gutta‐percha and sealing cement, the latter of which adheres to the dentin and fills the spaces between the gutta‐percha and the dentin walls ...
Emannuel Fonseca Thomé da Silva Monteiro, Alice Abib Ramos Fabri, Marcelo Barbosa Garcia, Sabrina Silva Azevedo, Higor Machado Gonçalves, Ana Clara Miranda Porto Figueiredo, Fabrícia Nogueira Klein, Gabriela Ceccon Chianca, Roberta Barcelos, Helvécio Cardoso Corrêa Póvoa, Leonardo Santos Antunes, Natalia Lopes Pontes Póvoa Iorio   +11 more
wiley   +1 more source

Monodisperse SiO₂ Spheres: Efficient Synthesis and Applications in Chemical Mechanical Polishing

Nanomaterials
The atomic level polishing of a material surface affects the accuracy of devices and the application of materials. Silica slurries play an important role in chemical mechanical polishing (CMP) by polishing the material surface.
Jinlong Ge, Yu Cao, Hui Han, Xiaoqi Jin, Jing Liu, Yuhong Jiao, Qiuqin Wang, Yan Gao   +7 more
doaj   +1 more source

Optimization of CMP solution for yttrium aluminum garnet crystal

Jin'gangshi yu moliao moju gongcheng, 2021
Yttrium aluminum garnet (YAG) crystal is widely used as gain medium in laser device due to its excellent physical, chemical and optical properties. However, current process can hardly satisfy the requirements of high efficiency and high quality in YAG ...
ZHANG Zili, JIN Zhuji, MU Qing, YANG Huipeng, HAN Xiaolong   +4 more
doaj  

Advances and Challenges in Functional Abrasive Design for Chemical Mechanical Polishing of Semiconductors and in Optical Manufacturing

Interdisciplinary Materials, Volume 5, Issue 4, Page 506-550, July 2026.
This review summarizes recent advances in chemical mechanical polishing abrasives based on CeO2, SiO2, Al2O3, and emerging nanomaterials, highlighting how structural engineering and interfacial chemistry govern material removal and surface quality. Mechanism‐driven abrasive design is identified as a key pathway toward high selectivity, low damage, and ...
Wenqi Tang, Zean Teng, Fang Luo, Xinlong Zhang, Biao Ran, Yonghong Qin, Jiyi Zhu, Yatao Cui, Xuezi Tan, Zihan Xu, Chaopeng Fu, Jiao Zhang   +11 more
wiley   +1 more source

A Comprehensive Review of the Nano-Abrasives Key Parameters Influencing the Performance in Chemical Mechanical Polishing

Nanomaterials
Chemical Mechanical Polishing (CMP) is a critical process in many industries where achieving superior surface quality through controlled material removal rates by using nano-abrasives is essential.
Houda Bellahsene, Saad Sene, Gautier Félix, Joulia Larionova, Marc Ferrari, Yannick Guari   +5 more
doaj   +1 more source