Results 51 to 60 of about 7,532,110 (199)

Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces

Lubricants, 2017
This paper provides a tribochemical study of the selective layer surface by chemical mechanical planarization (CMP). CMP is used to remove excess material obtained in the process of selective transfer.
Filip Ilie, George Ipate
doaj   +1 more source

Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing

Micromachines, 2023
Endpoint detection is an important technology in chemical mechanical polishing (CMP), which is used to capture the material interface and compensate the variations of consumables and incoming wafer thickness.
Fangxin Tian, Tongqing Wang, Xinchun Lu
doaj   +1 more source

Focusing Polarization‐Splitting Grating Coupler in Lithium Niobate on Insulator Photonic Platform

Advanced Photonics Research, Volume 7, Issue 10, October 2026.
Compact, focusing polarization‐selective grating coupler with low (<1 dB) polarization‐dependent loss (PDL), operating at the telecom C‐band and fabricated at a standard LNOI foundry using a process design kit (PDK). Lithium niobate‐on‐insulator (LNOI) is a rapidly emerging platform for integrated photonics, offering high‐speed modulation, efficient ...
Dor Oz, Eitan Kaminski, Margarita Gindina, Vladislav Kostianovskii, Liana Kartvelishvili, Peng Sun, Boris Desiatov, Ilya Goykhman   +7 more
wiley   +1 more source

Experimental Evidence for the Impact of Copper Microstructure on Residual Stress of Through Silicon Via

Advanced Electronic Materials, Volume 12, Issue 19, 12 October 2026.
The impact of Cu microstructure on the thermomechanical residual stress of TSVs with a diameter of 3 μm$\umu{\rm m}$ is investigated by comparing Raman stress imaging and EBSD grain characterization. By correlating Raman‐imaged TSV stress with Cu grain structure, direct experimental evidence is provided to highlight the direct correlation between ...
Shuhang Lyu, Thomas Beechem, Tiwei Wei
wiley   +1 more source

High‐Efficiency Graphene‐Silicon Slot‐Waveguide Microring Modulator at 1.5 and 2 µm Wavelength Bands

Laser &Photonics Reviews, Volume 20, Issue 19, 7 October 2026.
E/O modulators typically face a trade‐off between bandwidth and modulation efficiency. An integrated E/O modulator is presented that simultaneously achieves wideband, large bandwidth, and high modulation efficiency operation by embedding a partially overlapped double‐layer graphene on a compact silicon slot‐waveguide microring resonator.
Chao Luan, Deming Kong, Yong Liu, Yunhong Ding, Hao Hu   +4 more
wiley   +1 more source

Epitaxial Integration of III–V Membrane Photodetectors With Lateral p–i–n Junctions on the Silicon‐On‐Insulator Waveguide Platform

Laser &Photonics Reviews, Volume 20, Issue 19, 7 October 2026.
Epitaxial growth forms III–V membranes directly atop the silicon waveguide layer on SOI, while in‐plane in situ doping defines lateral p–i–n InP/InGaAs junctions in a single growth step. The membrane photodetectors achieve 50 Gb/s NRZ‐OOK operation.
Zhao Yan, Yifu Chen, Martin Ebert, Ka Ming Wong, Wenjie Wang, Tim Grieb, Florian F. Krause, Andreas Rosenauer, Graham T. Reed, David J. Thomson, Qiang Li   +10 more
wiley   +1 more source

Flat-top femtosecond laser modification enhances chemical mechanical polishing of 4H-SiC through progressive removal of laser-induced periodic surface structures (LIPSS)

Journal of Materials Research and Technology
The high hardness and chemical inertness of silicon carbide (SiC) hinder efficient planarization by chemical mechanical polishing (CMP). Femtosecond laser modification can enhance CMP by generating laser-induced periodic surface structures (LIPSS ...
Qingfa Peng, Gaopan Chen, Jie Hu, Lan Jiang, Wei Liu, Jiaxin Sun, Ximing Dong, Di Wang   +7 more
doaj   +1 more source

Engineering Photothermal Nanoplatforms for Multimodal Theranostics and Biosensing

Rare Metals, Volume 45, Issue 10, October 2026.
ABSTRACT Photothermal platforms bridge materials science and biomedicine, emerging as a transformative frontier in biomedical applications. They offer spatiotemporally precise, noninvasive modalities with cell‐type‐independent efficacy for treating a range of diseases.
Xiao Han, Peng Jin, Haiqing Wang, Hao Xue   +3 more
wiley   +1 more source

Multi grade polishing pad for sapphire chemical mechanical polishing

Journal of Materials Research and Technology
The synergy between polishing pad and abrasive is the key to material removal in chemical mechanical polishing (CMP). In order to achieve uniform material removal, a new multi gradient polishing pad for sapphire CMP was developed.
Zhaohui Deng, Rongjin Zhuo, Zhongyang Li, Wei Cao, Shangci Huang, Jimin Ge   +5 more
doaj   +1 more source

Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

Applied Sciences, 2021
The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures.
Hanchul Cho, Taekyung Lee, Doyeon Kim, Hyoungjae Kim   +3 more
doaj   +1 more source