Results 71 to 80 of about 1,061 (174)

Multi‐Functional ZnO–Te Heterojunction Devices Enabling Compact Frequency Quadrupler

Advanced Functional Materials, Volume 36, Issue 42, 26 May 2026.
Wafer‐scale ZnO–Te heterojunction devices featuring tunable double negative differential transconductance (D‐NDT) are demonstrated at ≤ 200°C. Leveraging this unique characteristic, a single‐stage frequency quadrupler is realized, achieving a 64%–75% reduction in device count.
Jae Hyeon Jun, Byeong Gwan Kim, Min Seo Kang, Ui Gwan Shin, Minjae Kim, Kiyung Kim, Hae‐Won Lee, Yongsu Lee, Byoung Hun Lee   +8 more
wiley   +1 more source

Production and characterization of microcapsules consisting of melamine-formaldehyde wall material

Studies in Science and Technology
Semiconductor integrated circuits use ultra-flat substrates called wafers, in which minute irregularities are eliminated to the utmost limit. To produce such a flat substrate, a polishing technique called chemical mechanical polishing (CMP) is used.
Takumi Sayo, Hayato Marumoto, Kengo Nishio, Keita Goto, Kazuishi Fukuda, Yasutomo Shimizu, Takayoshi Kawasaki, Yoshihiro Ohzuno, Takayuki Takei, Masahiro Yoshida   +9 more
doaj   +1 more source

Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments

Nanomaterials
Polyamines have become important chemical components used in several integrated circuit manufacturing processes, such as etching, chemical mechanical polishing (CMP), and cleaning.
Ziwei Lin, Junli Zhu, Qi Huang, Lei Zhu, Weimin Li, Wenjie Yu   +5 more
doaj   +1 more source

Analysis of sapphire- chemical mechanical polishing using digital image processing

Mechanical Engineering Journal, 2016
This study investigated the contact interface behavior between a wafer and a polishing pad in sapphire- chemical mechanical polishing (CMP) for considering the improvement of the removal rate.
Michio UNEDA, Keiichi TAKANO, Koji KOYAMA, Hideo AIDA, Ken-ichi ISHIKAWA   +4 more
doaj   +1 more source

Synthesis and Characterization of SiO2 Nanoparticles and Their Efficacy in Chemical Mechanical Polishing Steel Substrate

Advances in Materials Science and Engineering, 2014
Chemical mechanical polishing (CMP) technology is extensively used in the global planarization of highly value-added and large components in the aerospace industry. A nanopowder of SiO2 was prepared by the sol-gel method and was compounded into polishing
M. J. Kao, F. C. Hsu, D. X. Peng
doaj   +1 more source

Effect of chemical mechanical polishing on surface nature of titanium implants FT-IR and wettability data of titanium implants surface after chemical mechanical polishing implementation

Data in Brief, 2017
Bioactivity of titanium depends on the quality and characteristics of its surface oxide film. Through implementation of chemical mechanical polishing (CMP) process on titanium plates, a protective oxide (titania) film grows on the titanium based implant ...
Zeynep Ozdemir, Gul Bahar Basim
doaj   +1 more source

Effect of abrasive vibration on microstructure evolution and material removal of SiC CMP

Jin'gangshi yu moliao moju gongcheng
To address issues related to abrasion, agglomeration, and the challenges of mechanical and chemical release during chemical mechanical polishing (CMP), a vibration-assisted CMP method is employed.
Ailing TANG, Zewei YUAN, Meiling TANG, Ying WANG   +3 more
doaj   +1 more source

Advance on molecular dynamics simulations of precision polishing of SiC

Jin'gangshi yu moliao moju gongcheng
SignificanceSilicon carbide (SiC), as a representative material of third-generation semiconductors, holds vast potential for applications in microelectronics, optoelectronics, aerospace, and energy.
Jiayu ZHANG, Erchao MENG, Jianlin SUN, Jianzhong JI   +3 more
doaj   +1 more source

Atomic-scale chemical mechanical polishing: advances and challenges for the post-Moore’s law era

Materials Futures
Chemical mechanical polishing (CMP) has emerged as a critical technology for local and global surface planarization in integrated circuit manufacturing for decades.
Lifei Zhang, Xinchun Lu
doaj   +1 more source

Poster Sessions

HemaSphere, Volume 10, Issue S1, June 2026.
wiley   +1 more source