Results 81 to 90 of about 7,532,110 (199)

Research on influences of contact force in chemical mechanical polishing (CMP) process

AIP Advances, 2015
A series of simulations of chemical mechanical polishing (CMP) were conducted to investigate the contact force between abrasive particles and specimens by using the finite element method (FEM).
Lei Han, Hongwei Zhao, Qixun Zhang, Mingjun Jin, Lin Zhang, Peng Zhang   +5 more
doaj   +1 more source

Development of fixed abrasive chemical mechanical polishing process for glass disk substrates

, 2013
Glass disk substrates are used in a wide range of portable devices because of their relatively high resistance to heat and shocks compared to aluminum substrates.
Zhong, Zhao Wei, Lai, S. T., Tian, Ye Bing, Ang, Y. J.   +3 more
core   +1 more source

Atomically smooth gallium nitride surface prepared by chemical-mechanical polishing with different abrasives

, 2014
For chemical-mechanical polishing of epitaxial gallium nitride (GaN), a two-step experiment method with two kinds of abrasives, aluminum oxide (Al2O3) and colloidal silica (SiO2), was put forward.
Zhou, Yan, Gong, Hua, Pan, Guoshun, Zou, Chunli, Shi, Xiaolei   +4 more
core   +1 more source

Effects of chemical slurries on fixed abrasive chemical-mechanical polishing of optical silicon substrates

, 2013
Chemical mechanical polishing (CMP) with fixed abrasive pad is an alternative machining method to loose abrasive lapping and partial polishing with traditional pad in the fabrication of optical silicon substrates.
Tian, Yebing, Zhong, Zhaowei, Ng, Jun Hao   +2 more
core   +1 more source

Production and characterization of microcapsules consisting of melamine-formaldehyde wall material

Studies in Science and Technology
Semiconductor integrated circuits use ultra-flat substrates called wafers, in which minute irregularities are eliminated to the utmost limit. To produce such a flat substrate, a polishing technique called chemical mechanical polishing (CMP) is used.
Takumi Sayo, Hayato Marumoto, Kengo Nishio, Keita Goto, Kazuishi Fukuda, Yasutomo Shimizu, Takayoshi Kawasaki, Yoshihiro Ohzuno, Takayuki Takei, Masahiro Yoshida   +9 more
doaj   +1 more source

Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments

Nanomaterials
Polyamines have become important chemical components used in several integrated circuit manufacturing processes, such as etching, chemical mechanical polishing (CMP), and cleaning.
Ziwei Lin, Junli Zhu, Qi Huang, Lei Zhu, Weimin Li, Wenjie Yu   +5 more
doaj   +1 more source

Effect of abrasive vibration on microstructure evolution and material removal of SiC CMP

Jin'gangshi yu moliao moju gongcheng
To address issues related to abrasion, agglomeration, and the challenges of mechanical and chemical release during chemical mechanical polishing (CMP), a vibration-assisted CMP method is employed.
Ailing TANG, Zewei YUAN, Meiling TANG, Ying WANG   +3 more
doaj   +3 more sources

Analysis of slurry flow in chemical-mechanical polishing [PDF]

, 2005
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005.Includes bibliographical references (leaves 110-112).Chemical-Mechanical Polishing (CMP) is one of the enabling processes used in the manufacture of semiconductor
Kopanski, Krzysztof D
core  

Recent developments and applications of chemical mechanical polishing

, 2020
This article discusses advanced developments and applications of chemical mechanical polishing (CMP) published recently in the selected papers indexed by Web of Science.
Zhong, Zhao Wei
core   +1 more source

Synthesis and Characterization of SiO2 Nanoparticles and Their Efficacy in Chemical Mechanical Polishing Steel Substrate

Advances in Materials Science and Engineering, 2014
Chemical mechanical polishing (CMP) technology is extensively used in the global planarization of highly value-added and large components in the aerospace industry. A nanopowder of SiO2 was prepared by the sol-gel method and was compounded into polishing
M. J. Kao, F. C. Hsu, D. X. Peng
doaj   +1 more source