Results 81 to 90 of about 6,173 (209)

Single-charge devices with ultrasmall Nb/AlOx/Nb trilayer Josephson junctions

, 2004
Josephson junction transistors and 50-junction arrays with linear junction dimensions from 200 nm down to 70 nm were fabricated from standard Nb/AlOx/Nb trilayers.
A. B. Zorin, Averin D. V., H. Scherer, J. Niemeyer, R. Dolata   +4 more
core   +1 more source

Microstructural Effects During Chemical Mechanical Planarization of Copper [PDF]

, 2010
Novel die-stacking schema using through-wafer interconnects require vias to be filled with electroplated Cu, resulting in thick copper films, and requiring an aggressive first-step CMP.
Andersen, Patrick J., Bentancur, Mariela N., Frary, Megan, Moll, Amy J.   +3 more
core   +2 more sources

Metal‐Free Submicron‐Hollow‐Fiber Conjugated Polymer Sponges for Efficient Pollutant Removal and Thermal Insulation

Small, Volume 22, Issue 24, 27 April 2026.
Mimicking natural tubular structures, metal‐free conjugated hollow fibers are synthesized via one‐pot Chichibabin condensation. Pyridinic networks spontaneously self‐assemble into submicron hollow fibers and entangle into spongy monoliths—without templates, metals, or post‐processing.
Songah Jeong, Hyungwoo Kim
wiley   +1 more source

Monolithic 3D Nanoelectrode Arrays on CMOS Circuitry for Scalable, High‐Resolution Neural Recording

Small, Volume 22, Issue 22, 17 April 2026.
A CMOS‐integrated in vitro electrophysiology platform with 26,400 3D nanoelectrodes enables high‐resolution extracellular recordings with enhanced spatial sensitivity. Wafer‐scale, low‐temperature post‐fabrication monolithic integration of nanoelectrodes on foundry‐made CMOS chips preserves circuit functionality and electrical performance.
Aziliz Lecomte, Laurent Mazenq, Marie‐Charline Blatché, Aurélie Lecestre, Guilhem Larrieu   +4 more
wiley   +1 more source

Scratching by pad asperities in chemical mechanical polishing [PDF]

, 2011
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.Cataloged from PDF version of thesis.Includes bibliographical references (p.
Roberts, Michael P. (Michael Philip)
core  

Wafer Scale III‐Nitride Deep‐Ultraviolet Vertical‐Cavity Surface‐Emitting Lasers Featuring Nanometer‐Class Control of Cavity Length

Advanced Science, Volume 13, Issue 13, 3 March 2026.
A DUV‐VCSEL strategy featuring the nanometer‐class control of the cavity length is proposed in the DUV optoelectronic framework based on GaN templates. After the sapphire removal, a self‐terminated etching technology is developed, whereby the cavity length can be accurately determined by epitaxy instead of the fabrication process. As such, a record low
Chen Ji, Jiaming Wang, Fujun Xu, Lisheng Zhang, Jing Lang, Ziyao Zhang, Fuyun Tan, Chengzhi Ji, Junchuan Zhang, Erfei Zhang, Xiangning Kang, Zhixin Qin, Guangxu Ju, Jiejun Wu, Xuelin Yang, Ning Tang, Xinqiang Wang, Weikun Ge, Bo Shen   +18 more
wiley   +1 more source

Non-Uniformity of Wafer and Pad in CMP: Kinematic Aspects of View [PDF]

[[abstract]]In this paper, we analyze the non-uniformity of sliding distance on both wafer and polishing pad from kinematic point of view. Using the Fourier series expansion, we can show that in steady state the non-uniformity is determined by the ratio ...
[[alternative]]田豐, Tyan, Feng
core   +1 more source

Production and characterization of microcapsules consisting of melamine-formaldehyde wall material

Studies in Science and Technology
Semiconductor integrated circuits use ultra-flat substrates called wafers, in which minute irregularities are eliminated to the utmost limit. To produce such a flat substrate, a polishing technique called chemical mechanical polishing (CMP) is used.
Takumi Sayo, Hayato Marumoto, Kengo Nishio, Keita Goto, Kazuishi Fukuda, Yasutomo Shimizu, Takayoshi Kawasaki, Yoshihiro Ohzuno, Takayuki Takei, Masahiro Yoshida   +9 more
doaj   +1 more source

Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes. [PDF]

Micromachines (Basel), 2023
Lee H.
europepmc   +1 more source

Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments

Nanomaterials
Polyamines have become important chemical components used in several integrated circuit manufacturing processes, such as etching, chemical mechanical polishing (CMP), and cleaning.
Ziwei Lin, Junli Zhu, Qi Huang, Lei Zhu, Weimin Li, Wenjie Yu   +5 more
doaj   +1 more source