Results 81 to 90 of about 1,061 (174)

Fusion of Physical Mechanism and Data-Driven Methods for Online Thickness Measurement and Error Compensation in SiC CMP. [PDF]

Micromachines (Basel)
Lin J, Chen T, Ren Y, Song Z, Lyu B, Yuan J, Zhao W.   +6 more
europepmc   +1 more source

Simulation Analysis of the Chemical Mechanical Polishing Process for Monocrystal 4H-Silicon Carbide Based on Molecular Dynamics. [PDF]

Micromachines (Basel)
Lei Y, Guo W, Feng K, Sun Z.
europepmc   +1 more source

A High-Efficiency Environmentally Friendly Polishing Slurry for K9 Glass Utilizing Cerium-Based Compounds. [PDF]

Molecules
Li S, Ye R, Zou Z, He Z, Feng K, Cui H, Chi R, Chen Y, Luo Y.   +8 more
europepmc   +1 more source

Flow-Induced Dynamic Dispersion in Dispersant-Free Mixed-Oxide Slurry Systems. [PDF]

Langmuir
Lin YA, Yeh FM, Hu B, Huang TK, Lu HH, Zhong H, Li CC.   +6 more
europepmc   +1 more source

Basic study on pad conditioning in CMP(Chemical-Mechanical Polishing)

Proceedings of JSPE Semestrial Meeting, 2005
Kamikawa, Daiti, Doi, Shiro, Fujita, Takashi, Ogawa, Makoto, Watanabe, Shigeru, Seiki, Akihiko, Ogata, Kenjiro   +6 more
openaire   +1 more source

Chemical Mechanical Polishing of Plasma-Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding. [PDF]

Adv Sci (Weinh)
Kang S, Jeon C, Park J, Park S, Kim KM, Kim S.   +5 more
europepmc   +1 more source

Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration and Contamination. [PDF]

Micromachines (Basel)
Lee E, Sun K, So Y, Baek J, Shin JH, Kim HD, Youn YB, Kim MW.   +7 more
europepmc   +1 more source

Process Temperature Control for Low Dishing in CMP. [PDF]

Materials (Basel)
Shin Y, Jeong J, Shin J, Jeong H.
europepmc   +1 more source

Prediction Model and Experimental Verification of Surface Roughness of Single Crystal Diamond Chemical Mechanical Polishing Based on Archimedes Optimization Algorithm. [PDF]

Micromachines (Basel)
Li Z, Guo X, Fan G, Deng Y, Kang R, Wang X.   +5 more
europepmc   +1 more source

Consideration of Pad Conditioning in CMP(Chemical–Mechanical Polishing)

Proceedings of JSPE Semestrial Meeting, 2006
Kamikawa, Daichi, Fujita, Takasi, Doi, Tosiro   +2 more
openaire   +1 more source