Wafer-Level Transfer of GaN-on-Si Light-Emitting Devices via SiO<sub>2</sub>-SiO<sub>2</sub> Direct Bonding: Strain Evolution and Optoelectronic Performance. [PDF]
Zhang S, Zhang S, Fan Q, Ni X, Gu X.
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Controllable Synthesis of Monodisperse CeO<sub>2</sub> Nanoparticles with Tunable Sizes for Chemical-Mechanical Polishing. [PDF]
Ma Y +6 more
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Oxide Planarization of Trench Structure using Chemical Mechanical Polishing(CMP) [PDF]
openaire +1 more source
Study on polishing mechanisms of BEOL metal interconnects based on chemical and mechanical synergy. [PDF]
Tian Z +5 more
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Two-Step Polishing Technique for Flat and Smooth Copper Substrates by Electrochemical and Chemical Etching. [PDF]
Wang K +8 more
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Controlled Synthesis and Formation Mechanism of Uniformly Sized Spherical CeO<sub>2</sub> Nanoparticles. [PDF]
Xie J +6 more
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Void-free Cu/dielectric hybrid bonding at low-temperature enabled by ultrathin metal passivation engineering for 3D-IC applications. [PDF]
Cheemalamarri HK +6 more
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Improving 3C-SiC Quality Through Wafer-Bonded Switchback Epitaxy. [PDF]
Colston G +6 more
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Chemical Mechanical Polishing of Zerodur<sup>®</sup> Using Silica and Ceria Nanoparticles: Toward Ultra-Smooth Optical Surfaces. [PDF]
Bellahsene H +10 more
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Methods for Enhancing the Formation of Hydroxyl Radicals When Polishing Single Crystal SiC. [PDF]
Shi D, Feng K, Zhao T.
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