Results 91 to 100 of about 14,575 (156)

Mechanisms of the Chemical Mechanical Polishing (CMP) Process in Integrated Circuit Fabrication

CIRP Annals, 2001
Abstract A contact mechanics model that describes the polishing mechanisms of copper-patterned silicon wafers in the fabrication of ultra-large-scale integrated (ULSI) circuits is presented. The model explains the die-scale variation of material removal rates due to pattern geometry, and predicts results that are in agreement with experimental ...
N. Saka, J. Lai, J. Chun, Nam P. Sun
semanticscholar   +2 more sources

Strategies for Optimal Chemical Mechanical Polishing (CMP) Slurry Design

Journal of Dispersion Science and Technology, 2003
Abstract Chemical mechanical polishing (CMP) has become the preferred route for achieving wafer‐level global planarization in microelectronics device manufacturing. However, the micro‐ to molecular‐level mechanisms that control its performance and optimization are not well understood.
G. Bahar Basim, Scott C. Brown, I. Vakarelski, B. Moudgil   +3 more
semanticscholar   +2 more sources

Models of nanoparticles movement, collision, and friction in chemical mechanical polishing (CMP)

Journal of Nanoparticle Research, 2012
Nanoparticles have been widely used in polishing slurry such as chemical mechanical polishing (CMP) process. The movement of nanoparticles in polishing slurry and the interaction between nanoparticles and solid surface are very important to obtain an atomic smooth surface in CMP process.
F. Ilie
semanticscholar   +2 more sources

XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Applied Surface Science, 2014
Xiaolei Shi, Guoshun Pan, Guihai Luo
exaly   +2 more sources

Nd 3+ -doped colloidal SiO 2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers

Applied Surface Science, 2017
Hong Lei
exaly   +2 more sources

Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances

Wear, 2011
Guoshun Pan
exaly   +2 more sources

Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)

Applied Surface Science, 2011
Jianbin Luo, Wenhu Xu, Guoshun Pan
exaly   +2 more sources

Abrasive-free and ultra-low abrasive chemical mechanical polishing (CMP) processes

Advances in Chemical Mechanical Planarization (CMP), 2022
As the semiconductors industry changes, several novel materials are being introduced into the integration scheme both in the interconnect and transistor regions, and new chemical mechanical polishing/planarization (CMP) steps are being introduced.
N. K. Penta
semanticscholar   +1 more source

Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

Journal of Electronic Materials, 2010
Taesung Kim, Ji Chul Yang, Kim Taesung
exaly   +2 more sources

Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process

Microelectronic Engineering, 2006
Nam-Hoon Kim, Sang-Yong Kim
exaly   +2 more sources