Results 91 to 100 of about 7,532,110 (199)
Advance on molecular dynamics simulations of precision polishing of SiC
Jin'gangshi yu moliao moju gongchengSignificanceSilicon carbide (SiC), as a representative material of third-generation semiconductors, holds vast potential for applications in microelectronics, optoelectronics, aerospace, and energy.
Jiayu ZHANG +3 more
doaj +3 more sources
Materials & DesignTraditional planar chemical mechanical polishing (CMP) cannot achieve uniform finishing on complex curved gear surfaces. This paper develops an immersion chemical–mechanical synergistic polishing (ICMSP) method for GCr15 gear.
Longxing Liao, Fuli Cai, Mengqiao Guan
doaj +1 more source
, 2018 Chemical-mechanical polishing (CMP) has drawn significant attention as one of the most advanced techniques for achieving an atomic-level smooth surface. However, the mechanism of CMP is still unclear, and the in situ characterization of CMP behaviors at ...
Xu, Li +6 more
core +1 more source
88th Annual Meeting of the Meteoritical Society 2026: Abstracts
Meteoritics &Planetary Science, Volume 61, Issue S1, Page S48-S551, August 2026.
wiley +1 more source
Investigation on the surface characterization of Ga-faced GaN after chemical-mechanical polishing
, 2015 The relationship between the surface characterization after chemical mechanical polishing (CMP) and the size of the silica (SiO2) abrasive used for CMP of gallium nitride (GaN) substrates was investigated in detail.
Zhou, Yan +5 more
core +1 more source
Atomic-scale chemical mechanical polishing: advances and challenges for the post-Moore’s law era
Materials FuturesChemical mechanical polishing (CMP) has emerged as a critical technology for local and global surface planarization in integrated circuit manufacturing for decades.
Lifei Zhang, Xinchun Lu
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Electro-chemical mechanical polishing of copper and chemical mechanical polishing of glass
, 2004 In IC and optical manufacturing some of the materials that are polished after grinding are Si, Ge, Pyrex and BK 7 glass. In the case of Al, Cu and W, they are deposited and are CMP polished.
Sudin, Izman +2 more
core +1 more source
Validation of a Sensor System Solution for Process Monitoring in Robot Assisted Polishing [PDF]
, 2013 It was validated the possible correlation between hidden process variables (AE, force, power consumption) and the vital quality characteristic (roughness) for robot assisted flat polishing with diamond paste.\nIt was also validated the possibility of in ...
Dazzi, Mattia
core
A plasticity-based model of material removal in chemical-mechanical polishing (CMP)
, 2001 It is well known that the chemical reaction between an oxide layer and a water-based slurry produces a softer hydroxylated interface layer. During chemical-mechanical polishing (CMP), it is assumed that material removal occurs by the plastic deformation ...
Fu, Guanghui +3 more
core +1 more source
A Basic Study on Chemical Mechanical Polishing (CMP)
The Proceedings of The Manufacturing & Machine Tool Conference, 2002 Akiyoshi ODA +3 more
openaire +2 more sources