Effect of Structurally Modified Toluene Diisocyanate-Based Polyurethane Pads on Chemical Mechanical Polishing of 4H Silicon Carbide Substrate. [PDF]
Meng Y, Zhang S, Zhang Z.
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Synergistic Multi-Mechanism Enhancement in Chemomechanical Abrasive Polishing of Polycrystalline Diamond via a New SiO<sub>2</sub>-Diamond Slurry in High-Concentration H<sub>2</sub>O<sub>2</sub> Solution. [PDF]
Zheng X +8 more
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Multi-Field Characterisation of Material Removal Processes in Ultrasonic Magnetorheological Chemical Compound Polishing of GaN Wafers. [PDF]
Liang H +7 more
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Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling. [PDF]
Szczotka N +5 more
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Design and Fabrication of a Dual-Axis MEMS Electrostatic Micromirror Based on a Planar Comb Drive. [PDF]
Li M +7 more
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Numerical Simulation and Experimental Study on Picosecond Laser Polishing of 4H-SiC Wafer. [PDF]
Yan Y +5 more
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Investigation the CMP process of 6 H-SiC in H2O2 solution with ReaxFF molecular dynamics simulation. [PDF]
Gu Y +5 more
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A contamination-free and low-leakage-current Cu-TSV technology enabled by engineered double-sided processing. [PDF]
Hao Y +6 more
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Big data approaches, overcoming critical limitations, and enhanced optical and environmental stability of Al<sub>2</sub>O<sub>3</sub>/Ti/Al<sub>2</sub>O<sub>3</sub> colored solar-selective absorber coatings. [PDF]
Lai YT, Lai FD, Lin TY, Lai HC.
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