Results 101 to 110 of about 6,173 (209)

Carbon Nanotube Interconnect [PDF]

, 2006
Method and system for fabricating an electrical interconnect capable of supporting very high current densities ( 10(exp 6)-10(exp 10) Amps/sq cm), using an array of one or more carbon nanotubes (CNTs).
Li, Jun, Meyyappan, Meyya
core   +1 more source

Composition design and optimization of electrochemical mechanical polishing slurry for single crystal SiC

Jin'gangshi yu moliao moju gongcheng
Objectives: Single crystal silicon carbide (SiC) is known for its high hardness and high chemical inertness, making it chanllenging to process effectively using traditional chemical mechanical polishing (CMP) methods.
Zhibin GU, Haoxiang WANG, Xin SONG, Renke KANG, Shang GAO   +4 more
doaj   +1 more source

A Systematic Study of the Factors Affecting the Surface Quality of Chemically Vapor-Deposited Diamond during Chemical and Mechanical Polishing

Micromachines
Diamond surfaces must be of high quality for potential use in semiconductors, optical windows, and heat conductivity applications. However, due to the material’s exceptional hardness and chemical stability, it can be difficult to obtain a smooth surface ...
Zewei Yuan, Zhihui Cheng, Yusen Feng
doaj   +1 more source

Facet engineering of ceria and the preferential cleavage-consumption mechanism in chemical mechanical polishing

Journal of Materials Research and Technology
The rational design of high-performance ceria (CeO2) polishing abrasives is largely constrained by the unclear correlation between crystal plane exposure, dynamic oxygen vacancy evolution, and the chemical-mechanical synergistic mechanism during chemical
Xin Li, Mingjian Qiu, Quanmin Zhang, Xu Wang, Yuan Wu, Mitang Wang, Siqingaowa Jin, Wei Bi, Yan Zhao, Wei Zhou, bin Zhang, Dongliang Zhang   +11 more
doaj   +1 more source

Enhancing Slurry Stability and Surface Flatness of Silicon Wafers through Organic Amine-Catalyzed Synthesis Silica Sol

Nanomaterials
The stability of slurries used for chemical mechanical polishing (CMP) is a crucial concern in industrial chip production, influencing both the quality and cost-effectiveness of polishing fluids.
Yi Xing, Weilei Wang, Weili Liu, Zhitang Song   +3 more
doaj   +1 more source

A Basic Study on Chemical Mechanical Polishing (CMP)

The Proceedings of The Manufacturing & Machine Tool Conference, 2002
Akiyoshi ODA, Masato OHTA, Junji SHIBATA, Takayasu KIMURA   +3 more
openaire   +2 more sources

Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method [PDF]

, 2017

core   +1 more source

Synergistic Effects of Ceria Morphology in Magnetically-Assisted Chemical Mechanical Polishing: A Dual-Component Approach for Ultraprecision Surface Planarization. [PDF]

ACS Omega
Wang H, Shi Y, Wang K, Lei H, Zhang H, Wang Y, Zhang J.   +6 more
europepmc   +1 more source

Fusion of Physical Mechanism and Data-Driven Methods for Online Thickness Measurement and Error Compensation in SiC CMP. [PDF]

Micromachines (Basel)
Lin J, Chen T, Ren Y, Song Z, Lyu B, Yuan J, Zhao W.   +6 more
europepmc   +1 more source

Oxide Planarization of Trench Structure using Chemical Mechanical Polishing(CMP) [PDF]

Journal of the Korean Institute of Electrical and Electronic Material Engineers, 2002
openaire   +1 more source