Development of a suitable modelling approach for the robot assisted polishing process [PDF]
, 2013 Mazzucato, Federico
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High Removal Rates and Atomically Smooth Surfaces Are Achieved on Silicon Wafers Using the New SiO<sub>2</sub>@ZrO<sub>2</sub> Core-Shell Abrasive. [PDF]
Nanomaterials (Basel)Wang M +8 more
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Poly(acrylic acid)-Containing Ceria Slurries for Shallow Trench Isolation Chemical Mechanical Polishing: Colloidal Stability, Planarization Efficiency, and Selectivity. [PDF]
Polymers (Basel)Hwang S, Lyu T, Kim W.
europepmc +1 more source
Chemical Mechanical Lapping of 316 Based on Solid-Phase Fenton Reaction. [PDF]
Materials (Basel)Guo L +6 more
europepmc +1 more source
A Study of Pad Conditioning in CMP(Chemical-Mechanical Polishing)
Proceedings of JSPE Semestrial Meeting, 2006 Kamikawa, Daichi +3 more
openaire +1 more source
Oxide Planarization of Trench Structure using Chemical Mechanical Polishing ( CMP ) [PDF]
Journal of Korean Institute of Electrical and Electronic Materials Engineers, 2002 Chul Bok Kim +2 more
openaire +1 more source
Investigation and optimization of in-process dressing of chemical mechanical polishing
, 2003 Chemical Mechanical Polishing (CMP) is the technique known to provide global planarization of topography with low post planarization slope and it is a technique to planarize the dielectric layers, which insulate the multilevel interconnect and it can ...
Zaw Moe Aung
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Junction Formation and Leakage Current Suppression in Planar High-Purity Germanium Detectors for Low-Energy X-Ray Detection. [PDF]
Materials (Basel)Cao M +7 more
europepmc +1 more source
Synergistic Effects of Ceria Morphology in Magnetically-Assisted Chemical Mechanical Polishing: A Dual-Component Approach for Ultraprecision Surface Planarization. [PDF]
ACS OmegaWang H +6 more
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Embedded glass fan-out integration method for high-performance Ka-band RF microsystem. [PDF]
Microsyst NanoengZhang B, Chen L, Wang Q, Wang W.
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