Study on the Effect of Substitutional Doping of Ce Atomic on the Damage Properties of Fused Silica. [PDF]
Chen J, Ni K, Hong R, Li L, Sui Z.
europepmc +1 more source
Fabrication of Polyimide/Aluminum Nitride Composites and Wafer Channel Filling via Direct Ink Writing. [PDF]
Xiao J +5 more
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Study on the Electro-Fenton Chemomechanical Removal Behavior in Single-Crystal GaN Pin-Disk Friction Wear Experiments. [PDF]
Ou Y, Shen Z, Xie J, Pan J.
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Study on Self-Sharpening Mechanism and Polishing Performance of Triethylamine Alcohol on Gel Polishing Discs. [PDF]
Lei Y, Xu L, Feng K.
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Tribo-Electrochemical Mechanism of Material Removal Examined for Chemical Mechanical Planarization of Stainless-Steel Using Citrate Buffer as a Complexing Agent. [PDF]
Santefort DR, Gamagedara KU, Roy D.
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A review of glass thermal reflow: method, device, and applications. [PDF]
Zhu M +13 more
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Perovskite/Copper Indium Gallium Selenide Tandem Solar Cells. [PDF]
Chen X +7 more
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Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers. [PDF]
Chen H +6 more
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Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy. [PDF]
Alderete NA +3 more
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