Experimental Study on Double-Sided Chemical Mechanical Polishing of Molybdenum Substrates for LED Devices. [PDF]
Micromachines (Basel)Zhou Z, Wang J, Hu Z, Hsieh P, Xu X.
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Fusion of Physical Mechanism and Data-Driven Methods for Online Thickness Measurement and Error Compensation in SiC CMP. [PDF]
Micromachines (Basel)Lin J +6 more
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Lapping of Soft-Brittle Lithium Niobate Crystal with Fixed Abrasive Pad. [PDF]
Materials (Basel)Zhu N, Gao X, Tang C, Chen J, Zhu Y.
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Simulation Analysis of the Chemical Mechanical Polishing Process for Monocrystal 4H-Silicon Carbide Based on Molecular Dynamics. [PDF]
Micromachines (Basel)Lei Y, Guo W, Feng K, Sun Z.
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A High-Efficiency Environmentally Friendly Polishing Slurry for K9 Glass Utilizing Cerium-Based Compounds. [PDF]
MoleculesLi S +8 more
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Flow-Induced Dynamic Dispersion in Dispersant-Free Mixed-Oxide Slurry Systems. [PDF]
LangmuirLin YA +6 more
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Chemical Mechanical Polishing of Plasma-Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding. [PDF]
Adv Sci (Weinh)Kang S +5 more
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Basic study on pad conditioning in CMP(Chemical-Mechanical Polishing)
Proceedings of JSPE Semestrial Meeting, 2005 Kamikawa, Daiti +6 more
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Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration and Contamination. [PDF]
Micromachines (Basel)Lee E +7 more
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Process Temperature Control for Low Dishing in CMP. [PDF]
Materials (Basel)Shin Y, Jeong J, Shin J, Jeong H.
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