Interfacial Characteristics of HgCdTe Infrared Detectors Grown on Alternative Substrates. [PDF]
Li Y +7 more
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Controlled Synthesis and Formation Mechanism of Uniformly Sized Spherical CeO<sub>2</sub> Nanoparticles. [PDF]
Xie J +6 more
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Chemical Mechanical Polishing of Zerodur<sup>®</sup> Using Silica and Ceria Nanoparticles: Toward Ultra-Smooth Optical Surfaces. [PDF]
Bellahsene H +10 more
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Methods for Enhancing the Formation of Hydroxyl Radicals When Polishing Single Crystal SiC. [PDF]
Shi D, Feng K, Zhao T.
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Void-free Cu/dielectric hybrid bonding at low-temperature enabled by ultrathin metal passivation engineering for 3D-IC applications. [PDF]
Cheemalamarri HK +6 more
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Two-Step Polishing Technique for Flat and Smooth Copper Substrates by Electrochemical and Chemical Etching. [PDF]
Wang K +8 more
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Improving 3C-SiC Quality Through Wafer-Bonded Switchback Epitaxy. [PDF]
Colston G +6 more
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Atomic-Scale Mechanism of Titanium-Induced Frictional Removal of Silicon Carbide: A Molecular Dynamics Study. [PDF]
Ling X +6 more
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Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused Review. [PDF]
Park DB +12 more
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Effect of Structurally Modified Toluene Diisocyanate-Based Polyurethane Pads on Chemical Mechanical Polishing of 4H Silicon Carbide Substrate. [PDF]
Meng Y, Zhang S, Zhang Z.
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