Results 131 to 140 of about 6,173 (209)

A contamination-free and low-leakage-current Cu-TSV technology enabled by engineered double-sided processing. [PDF]

Microsyst Nanoeng
Hao Y, Ding Y, Zhang Z, Yang B, Zhang J, Xie H, Chen Z.   +6 more
europepmc   +1 more source

Investigation the CMP process of 6 H-SiC in H₂O₂ solution with ReaxFF molecular dynamics simulation. [PDF]

Sci Rep
Gu Y, Feng K, Xu L, Zhao L, Zhao T, Lyu B.   +5 more
europepmc   +1 more source

Study on the Effect of Substitutional Doping of Ce Atomic on the Damage Properties of Fused Silica. [PDF]

Materials (Basel)
Chen J, Ni K, Hong R, Li L, Sui Z.
europepmc   +1 more source

Study on Self-Sharpening Mechanism and Polishing Performance of Triethylamine Alcohol on Gel Polishing Discs. [PDF]

Micromachines (Basel)
Lei Y, Xu L, Feng K.
europepmc   +1 more source

Study on the Electro-Fenton Chemomechanical Removal Behavior in Single-Crystal GaN Pin-Disk Friction Wear Experiments. [PDF]

Micromachines (Basel)
Ou Y, Shen Z, Xie J, Pan J.
europepmc   +1 more source

Tribo-Electrochemical Mechanism of Material Removal Examined for Chemical Mechanical Planarization of Stainless-Steel Using Citrate Buffer as a Complexing Agent. [PDF]

Materials (Basel)
Santefort DR, Gamagedara KU, Roy D.
europepmc   +1 more source

Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers. [PDF]

Materials (Basel)
Chen H, Lee S, Kang M, Youn HS, Go S, Kang E, Cho CR.   +6 more
europepmc   +1 more source

Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy. [PDF]

ACS Appl Nano Mater
Alderete NA, Daharwal PD, Ciobanu CV, Stan G.   +3 more
europepmc   +1 more source

Research on Deflection and Stress Analyses and the Improvement of the Removal Uniformity of Silicon in a Single-Sided Polishing Machine Under Pressure. [PDF]

Micromachines (Basel)
Ye G, Yao Z.
europepmc   +1 more source