Results 131 to 140 of about 14,575 (156)

Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2012
Jui-Chin Chen, J. Lau, P. Tzeng, Shang-Chun Chen, Chien-Ying Wu, Chien-Chou Chen, Y. Hsin, Y. Hsu, S. Shen, S. Liao, C. Ho, Cha-Hsin Lin, T. Ku, M. Kao   +13 more
semanticscholar   +1 more source

CMP – Chemical-Mechanical Polishing

2013
openaire   +1 more source

Chemical mechanical polishing (CMP) composition

2020
REICHARDT ROBERT, SIEBERT MAX, LAN YONGQING, LAUTER MICHAEL, GUEVENC HACI OSMAN, PROELSS JULIAN, USMAN IBRAHIM SHEIK ANSAR, GOLZARIAN REZA   +7 more
openaire   +1 more source

Chemical evidences for the optimal coagulant dosage and pH adjustment of silica removal from chemical mechanical polishing (CMP) wastewater

, 2009
W. Kuan, Ching-Yao Hu
semanticscholar   +1 more source

Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density

, 2004
Y. Seo, Sang-Yong Kim, Yeongtae Choi, Yong-Taek Oh, Woo-Sun Lee   +4 more
semanticscholar   +1 more source

Chemical Mechanical Polishing (CMP) of Cobalt-Containing Substrate

2016
SHI XIAOBO, JAMES ALLEN SCHLUETER, MARC O'NEAL LEONARD   +2 more
openaire   +4 more sources

Contact Behavior and Chemical Mechanical Polishing (CMP) Performance of Hole-Type Polishing Pad

ECS Journal of Solid State Science and Technology, 2012
Hong Jin Kim, Jae Kwang Choi, Myung Ki Hong, Kuntack Lee, Yongsun Ko   +4 more
openaire   +1 more source

Chemical Mechanical Polishing (CMP) of Cobalt-Containing substrate

2017
SHI XIAOBO, ROSE JOSEPH, CLORE TIMOTHY JOSEPH, SCHLUETER JAMES ALLEN, GRIEF MALCOLM, O'NEILL MARK LEONARD   +5 more
openaire   +2 more sources

An optimization of tungsten plug chemical mechanical polishing (CMP) using different consumables

, 2001
Woo-Sun Lee, Sang-Yong Kim, Y. Seo, Jong-kook Lee   +3 more
semanticscholar   +1 more source

Experimental investigation of process parameters for roll-type linear chemical mechanical polishing (Roll-CMP) system

Precision Engineering, 2014
Haedo Jeong, Hyunseop Lee
exaly