Results 61 to 70 of about 14,575 (156)

The Multifaceted Role of Pyroptosis: Molecular Mechanisms, Crosstalk with Other Cell Death Pathways, and Therapeutic Implications

open access: yesMedComm, Volume 7, Issue 7, July 2026.
Pyroptosis maintains immune homeostasis by eliminating damaged or infected cells, but its dysregulation promotes inflammation and cancer progression. The diagram illustrates key activation pathways, links with other programmed cell deaths, and cancer‐specific effects, enhancing its dual protective and pathogenic roles.
Diego Liviu Boaru   +18 more
wiley   +1 more source

Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization

open access: yesLubricants
Chemical–mechanical planarization (CMP) is used to smoothen the topographies of a rough surface by combining several functions of tribology (friction, lubrication), chemistry, and electrochemistry (corrosion, wear, tribo-corrosion).
Kassapa Gamagedara, Dipankar Roy
doaj   +1 more source

Nonlinear Strain‐Mediated Magnetoelectric Coupling in Sub‐Microscale Ni/BPZT Thin‐Film Devices

open access: yesAdvanced Electronic Materials, Volume 12, Issue 11, 8 June 2026.
Sub‐micrometer Ni/BPZT thin‐film magnetoelectric devices with lateral gates enable localized, low‐voltage strain control of magnetization. By combining anisotropic magnetoresistance, nitrogen‐vacancy magnetometry, multiphysics strain simulations, and micromagnetic modelling, the study quantitatively links ferroelectric strain hysteresis to magnetic ...
Fanfan Meng   +8 more
wiley   +1 more source

The Chemical Deformation of a Thermally Cured Polyimide Film Surface into Neutral 1,2,4,5-Benzentetracarbonyliron and 4,4′-Oxydianiline to Remarkably Enhance the Chemical–Mechanical Planarization Polishing Rate

open access: yesNanomaterials
The rapid advancement of 3D packaging technology has emerged as a key solution to overcome the scaling-down limitation of advanced memory and logic devices.
Man-Hyup Han   +10 more
doaj   +1 more source

Scratch generation probability in chemical mechanical polishing (CMP) process

open access: yes, 2020
Chemical mechanical polishing (CMP) process is a critical new technology to planarize the wafer surface aided by the combined force of the chemical etching and mechanical polishing. In this process, defectivity due to scratch generation has become more and more important as it influences the wafer product quality, throughput and cost significantly with
openaire   +4 more sources

Production and characterization of microcapsules consisting of melamine-formaldehyde wall material

open access: yesStudies in Science and Technology
Semiconductor integrated circuits use ultra-flat substrates called wafers, in which minute irregularities are eliminated to the utmost limit. To produce such a flat substrate, a polishing technique called chemical mechanical polishing (CMP) is used.
Takumi Sayo   +9 more
doaj   +1 more source

Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments

open access: yesNanomaterials
Polyamines have become important chemical components used in several integrated circuit manufacturing processes, such as etching, chemical mechanical polishing (CMP), and cleaning.
Ziwei Lin   +5 more
doaj   +1 more source

Effect of abrasive vibration on microstructure evolution and material removal of SiC CMP

open access: yesJin'gangshi yu moliao moju gongcheng
To address issues related to abrasion, agglomeration, and the challenges of mechanical and chemical release during chemical mechanical polishing (CMP), a vibration-assisted CMP method is employed.
Ailing TANG   +3 more
doaj   +3 more sources

A novel immersion chemical mechanical polishing device and tailored slurry for processing heavy duty gas turbine compressor blades

open access: yesScientific Reports
As a key component of heavy-duty gas turbines, the compressor blades typically have complex free-form surfaces. These blades are widely made of martensitic stainless steel, which has excellent high strength, high corrosion resistance, and wear resistance,
Qiyuan Li   +8 more
doaj   +1 more source

Synthesis and Characterization of SiO2 Nanoparticles and Their Efficacy in Chemical Mechanical Polishing Steel Substrate

open access: yesAdvances in Materials Science and Engineering, 2014
Chemical mechanical polishing (CMP) technology is extensively used in the global planarization of highly value-added and large components in the aerospace industry. A nanopowder of SiO2 was prepared by the sol-gel method and was compounded into polishing
M. J. Kao, F. C. Hsu, D. X. Peng
doaj   +1 more source

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