Results 61 to 70 of about 6,173 (209)
Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties [PDF]
In chemical-mechanical polishing (CMP), even the soft pad asperities may, under certain conditions, generate scratches on the relatively hard surfaces being polished. In the present study, contact mechanics models of pad-induced scratching are formulated,
Chun, Jung-Hoon +2 more
core +1 more source
Materials used for fabricating sustainable composites. ABSTRACT A composite sample with 18% flax fiber flyash (FF) exhibits increased tensile strength (TS) and greater load‐transfer efficiency of the reinforcement under corrosive conditions.
Sumesh Keerthiveettil Ramakrishnan +2 more
wiley +1 more source
We use ultra-high vacuum chemical vapor deposition to grow polycrystalline silicon carbide (SiC) on c-plane sapphire wafers which are then annealed between 1250 and 1450{\deg}C in vacuum to create epitaxial multilayer graphene (MLG).
Breslin, Christopher M. +8 more
core +1 more source
Atomic Step–Terrace Ordering Enables Unprecedentedly Low Pop‐in Stress Scatter in GaN (0001)
Step–terrace GaN surfaces with monoatomic topography were realized using catalyst‐referred etching. On these surfaces, pop‐ins occurred at ideal strength with a record‐low stress scatter of 2.3%, providing compelling evidence that atomic‐scale surface ordering plays a critical role in triggering incipient plasticity. Atomic‐scale surface irregularities,
Hiroto Oguri +8 more
wiley +1 more source
A self‐assembled conjugated hollow fiber monolith enables simultaneous solar‐driven desalination and hydrovoltaic electricity generation. Metal‐free polymerization produces cross‐linked hollow fibers that entangle into a porous monolith, followed by gradient polypyrrole coating for efficient light absorption and directional water transport.
Songah Jeong +5 more
wiley +1 more source
Scratch generation probability in chemical mechanical polishing (CMP) process
Chemical mechanical polishing (CMP) process is a critical new technology to planarize the wafer surface aided by the combined force of the chemical etching and mechanical polishing. In this process, defectivity due to scratch generation has become more and more important as it influences the wafer product quality, throughput and cost significantly with
openaire +4 more sources
This study investigates the UV‐induced degradation of silicon heterojunction cell precursors by isolating the impact of subcell layers under controlled UVA and UVB irradiation. Front hydrogenated amorphous silicon (i/n)a‐Si:H selective layers are identified as key degradation sites, leading to significant losses in minority carrier lifetime and iVoc ( >
Hugo Lajoie +7 more
wiley +1 more source
AI‐Driven Properties Prediction in Si3N4 Ceramics: Image‐Based and Processing Parameter Strategies
ABSTRACT This review presents AI‐based approaches for predicting key properties of silicon nitride (Si3N4) ceramics from both microstructural images and process parameters. Convolutional neural networks (CNNs) successfully predicted bending strength, fracture toughness, and dielectric breakdown strength directly from microstructural images, with higher
Ryoichi Furushima +3 more
wiley +1 more source
Dressed Photon-phonon Technology for Ultra Flat Surface [PDF]
A reduction of the surface roughness, Ra, is required in various applications including electronic devic-es and / or optical devices. Although chemical-mechanical polishing (CMP) has been used to flatten the sur-faces, it is generally limited to reducing
Ohtsu, M., Yatsui, T.
core +1 more source
Monolithic Integration of ScAlN Modulators on Silicon‐On‐Insulator Platform
Monolithic integration of scandium‐doped aluminum nitride (ScAlN) modulators on a silicon‐on‐insulator platform is reported. A multilayer electrode design enhances RF‐optical field overlap, enabling direct access to the diagonal electro‐optic coefficient and improved modulation efficiency.
Sihao Wang +6 more
wiley +1 more source

