Results 61 to 70 of about 7,532,110 (199)
Electrochemical Characterizations on Chemical Mechanical Polishing Compositions of Polishing Ruthenium Films in CMP Processes [PDF]
Abstract not Available.
Tom X. Shi, James Henry, James Schlueter
openaire +1 more source
A decade of UV‐C irradiation in Apple postharvest processing: from whole fruit to juice. ABSTRACT The apple is a fruit with significant economic value and a rich nutritional profile, containing high levels of fiber, vitamins, minerals, and bioactive compounds. However, it is susceptible to chemical‐enzymatic oxidation and microbial spoilage.
Mahyra da Paixão e Silva +6 more
wiley +1 more source
A coupled material removal model for chemical mechanical polishing processes
Chemical mechanical polishing (CMP) is a process used to obtain planarized surfaces in microelectronic device manufacturing. The planarization is achieved by material removal from the wafer surface by synergistic effect of chemical and mechanical actions.
Akbar, Wazir, Ertunç, Özgür
core +1 more source
This report presents an 8‐inch quasi‐standard piezoelectric integrated MEMS technology (PIMT) platform which, through the integration of core and additional processes, reliably supports three rounds of multi‐project wafer (MPW) fabrication. Whilst ensuring support for mass production processes, the platform offers certain flexibility, providing a ...
Yongquan Su +18 more
wiley +1 more source
Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing
During copper chemical mechanical polishing (Cu-CMP), the physical properties of slurry, such as the dispersion and suspension stability of abrasives, the interaction between particles and the polished surface, and the rheological characteristics ...
Wu, Y. F., Tsai, Tzu-hsuan; Wu, Y. F.
core +1 more source
Review on modeling and application of chemical mechanical polishing
With the development of integrated circuit technology, especially after entering the sub-micron process, the reduction of critical dimensions and the realization of high-density devices, the flatness between integrated circuit material layers is becoming
Zhao Gaoyang +6 more
doaj +1 more source
Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding
With the rapid development of semiconductors, the number of materials needed to be polished sharply increases. The material properties vary significantly, posing challenges to chemical mechanical polishing (CMP).
Yuan Wu +5 more
doaj +1 more source
ABSTRACT Allergic Rhinitis and its Impact on Asthma (ARIA) was, up until 2017, a guideline using the best evidence (Grading of Recommendations, Assessment, Development and Evaluation, GRADE) and developed as a change management strategy. A second change management strategy—in collaboration with the European Academy of Allergy and Clinical Immunology ...
Jean Bousquet +155 more
wiley +1 more source
Effect of slurry composition on the chemical mechanical polishing of thin diamond films
Nanocrystalline diamond (NCD) thin films grown by chemical vapour deposition have an intrinsic surface roughness, which hinders the development and performance of the films’ various applications. Traditional methods of diamond polishing are not effective
Jessica M. Werrell +7 more
doaj +1 more source
De novo or Salvage? Nucleotide Availability as a Driver of Bacterial Adaptation and Virulence
Bacterial pathogens survive in different host environments by switching between making nucleotides by de novo synthesis and scavenging them from the host. This flexibility supports growth and virulence making nucleotide metabolism an attractive therapeutic target.
Riya Joshi +2 more
wiley +1 more source

