Results 21 to 30 of about 7,532,110 (199)
Micromachines, 2020 After the development of 3D printing, the post-processing of the 3D-printed materials has been continuously studied, and with the recent expansion of the application of 3D printing, interest in it is increasing. Among various surface-machining processes,
Jungyu Son, Hyunseop Lee
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Chemical–Mechanical Polishing of 4H Silicon Carbide Wafers
Advanced Materials Interfaces, 2023 4H silicon carbide (4H‐SiC) holds great promise for high‐power and high‐frequency electronics, in which high‐quality 4H‐SiC wafers with both global and local planarization are cornerstones.
Wantang Wang +6 more
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A Review on Precision Polishing Technology of Single-Crystal SiC
Crystals, 2022 Single-crystal SiC is a typical third-generation semiconductor power-device material because of its excellent electronic and thermal properties. An ultrasmooth surface with atomic surface roughness that is scratch free and subsurface damage (SSD) free is
Gaoling Ma +5 more
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Effect of nanotopogranphy in direct wafer bonding: modeling and measurements [PDF]
, 2005 Nanotopography, which refers to surface height variations of tens to hundreds of nanometers that extend across millimeter-scale wavelengths, is a wafer geometry feature that may cause failure in direct wafer bonding processes.
W.A. Baylies +12 more
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Investigation of the chemical residuals on the fused silica during chemical mechanical polishing [PDF]
, 2018 Chemical residuals on fused silica after chemical mechanical polishing with silica and ceria have been analyzed. The surface of fused silica terminates with silanol after being polished with silica abrasives but ends up with Ce‐O−Si in a ceria‐based ...
Xu, Li +5 more
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Chemical Engineering Transactions, 2018 Aluminium alloys are widely used in various industries because of their lightness and easy processing, leading to higher requirements for aluminium alloys in terms of the flatness and finish of aluminium alloy surface.
Yali Zhao +3 more
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Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies
Micromachines, 2022 Chemical mechanical polishing (CMP) is a well-known technology that can produce surfaces with outstanding global planarization without subsurface damage.
Chi-Hsiang Hsieh +5 more
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Biomaterials applications of chemical mechanical polishing [PDF]
, 2012 Chemical Mechanical Polishing (CMP) is used in semiconductor industry to enable planarization of the interlayer dielectrics and metals. In this study, CMP is used as a polishing technique to modify the surface roughness of the bio-implant materials in a ...
Özdemir, Zeynep +2 more
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MATEC Web of Conferences, 2016 An ultrasonic elliptical vibration assisted chemical mechanical polishing(UEV-CMP) is employed to achieve high material removal rate and high surface quality in the finishing of hard and brittle materials such as monocrystalline silicon, which combines ...
Liu Defu, Chen Tao, Yan Riming
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Machines, 2022 Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put ...
Jianguo Yao +4 more
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