Results 21 to 30 of about 6,173 (209)
Correlation between pattern density and linewidth variation in silicon photonics waveguides [PDF]
, 2020 We describe the correlation between the measured width of silicon waveguides fabricated with 193 nm lithography and the local pattern density of the mask layout.
Bogaerts, Wim +3 more
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Recent Developments in Chemical Mechanical Polishing (CMP) for Precision Manufacturing
International Journal of Advanced Research in Science, Communication and Technology, 2022 Advanced developments and applications of Chemical Mechanical Planarization/Polishing (CMP) did by researchers in current decade were discussed in this article. Topics on which this article forms the basis are Abrasives and slurry developments, environment and safety conditions, manufacturing process improvements, modelling and simulations methods for ...
null Amey S. Kulkarni, null Ankur Gupta
openaire +1 more source
Machines, 2022 Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put ...
Jianguo Yao +4 more
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Hydrodynamics of slurry flow in chemical mechanical polishing : a review [PDF]
, 2006 Chemical mechanical polishing (CMP) is a process that is commonly used to planarize wafer surfaces during fabrication. Although the complex interactions between the wafer, pad, and slurry make the CMP process difficult to predict, it has been postulated ...
Higgs, C. Fred, Terrell, Elon Jahdal
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Chemical Engineering Transactions, 2018 Aluminium alloys are widely used in various industries because of their lightness and easy processing, leading to higher requirements for aluminium alloys in terms of the flatness and finish of aluminium alloy surface.
Yali Zhao +3 more
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MATEC Web of Conferences, 2016 An ultrasonic elliptical vibration assisted chemical mechanical polishing(UEV-CMP) is employed to achieve high material removal rate and high surface quality in the finishing of hard and brittle materials such as monocrystalline silicon, which combines ...
Liu Defu, Chen Tao, Yan Riming
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Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a process that planarizes semiconductor surfaces and is essential for the manufacture of highly integrated devices.
Jungyu Son, Hyunseop Lee
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A New Approach for the Study of Chemical Mechanical Polishing [PDF]
, 1999 The process of chemical mechanical polishing (CMP) can be studied using in situ atomic force microscopy (AFM) by intentionally using a high tip/sample interaction force.
Devecchio, D. +2 more
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Slurry Design for Chemical Mechanical Polishing
KONA Powder and Particle Journal, 2014 Chemical Mechanical Polishing (CMP) process is widely used in the microelectronics industry for planarization of metal and dielectric layers to achieve multi-layer metallization.
G. Bahar Basim, Brij M. Moudgil
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Analysis of infrared optical polishing effluents and reduction of COD and TSS levels by ultrafiltration and coagulation/flocculation [PDF]
, 2014 Samples of polishing effluent produced during infrared optics manufacture were analyzed. Their particle size, composition, Zeta potential, chemical oxygen demand (COD), total suspended solids (TSS), and settleable solids were determined.
Durazo-Cardenas, Isidro Sergio +2 more
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