Micromachines, 2020 Fluidized bed machining (FBM) is used for the surface finishing or cleaning of complex 3D machine parts. FBM is a process of injecting air into a chamber to encourage particles into a fluid-like state.
Taekyoung Kim, Hyunseop Lee
doaj +4 more sources
Contrast Experiments in Dielectrophoresis Polishing (DEPP)/Chemical Mechanical Polishing (CMP) of Sapphire Substrate [PDF]
Applied Sciences, 2019 The broad applications of sapphire substrates in many fields warrants an urgent demand for a highly efficient and high precision polishing method for the sapphire substrates. The authors proposed a novel sapphire substrate polishing method that is based on the dielectrophoresis (DEP) effect.
Tianchen Zhao +5 more
openaire +3 more sources
Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles.
Seonghyun Park, Hyunseop Lee
doaj +2 more sources
Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes. [PDF]
Micromachines (Basel), 2023 Lee H.
europepmc +2 more sources
The Chemical Deformation of a Thermally Cured Polyimide Film Surface into Neutral 1,2,4,5-Benzentetracarbonyliron and 4,4′-Oxydianiline to Remarkably Enhance the Chemical–Mechanical Planarization Polishing Rate [PDF]
NanomaterialsThe rapid advancement of 3D packaging technology has emerged as a key solution to overcome the scaling-down limitation of advanced memory and logic devices.
Man-Hyup Han +10 more
doaj +2 more sources
Scratch generation probability in chemical mechanical polishing (CMP) process [PDF]
, 2020 Chemical mechanical polishing (CMP) process is a critical new technology to planarize the wafer surface aided by the combined force of the chemical etching and mechanical polishing. In this process, defectivity due to scratch generation has become more and more important as it influences the wafer product quality, throughput and cost significantly with
Han, Yingying
openaire +5 more sources
Nanomaterials, 2021 For scaling-down advanced nanoscale semiconductor devices, tungsten (W)-film surface chemical mechanical planarization (CMP) has rapidly evolved to increase the W-film surface polishing rate via Fenton-reaction acceleration and enhance nanoscale-abrasive
Seong-In Kim +7 more
doaj +1 more source
Effect of Hydrogen Peroxide and Oxalic Acid on Material Removal in Al CMP [PDF]
한국정밀공학회지, 2017 Chemical mechanical polishing achieves surface planarity through combined mechanical and chemical means. The role of the chemical reaction is very important in a metal CMP like aluminum.
Jin Yeop Jeong +3 more
doaj +1 more source
Bore polishing of diesel engine cylinder liners [PDF]
, 1987 This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.There are two important omissions in the literature on bore polishing, firstly there is no evidence of the successful development of a reliable tribo test ...
Al-Khalidi, Ghazi
core +7 more sources
Optimization of CMP processing parameters for Si based on response surface method
Jin'gangshi yu moliao moju gongcheng, 2022 To improve the polishing efficiency and precision, the optimum processing parameters of Si in the chemical mechanical polishing (CMP) process were analysed by CMP experiments and response surface methodology.
BIAN Da +4 more
doaj +3 more sources