Results 11 to 20 of about 14,575 (156)
Micromachines, 2020 After the development of 3D printing, the post-processing of the 3D-printed materials has been continuously studied, and with the recent expansion of the application of 3D printing, interest in it is increasing. Among various surface-machining processes,
Jungyu Son, Hyunseop Lee
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Chemical–Mechanical Polishing of 4H Silicon Carbide Wafers
Advanced Materials Interfaces, 2023 4H silicon carbide (4H‐SiC) holds great promise for high‐power and high‐frequency electronics, in which high‐quality 4H‐SiC wafers with both global and local planarization are cornerstones.
Wantang Wang +6 more
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A Review on Precision Polishing Technology of Single-Crystal SiC
Crystals, 2022 Single-crystal SiC is a typical third-generation semiconductor power-device material because of its excellent electronic and thermal properties. An ultrasmooth surface with atomic surface roughness that is scratch free and subsurface damage (SSD) free is
Gaoling Ma +5 more
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Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies
Micromachines, 2022 Chemical mechanical polishing (CMP) is a well-known technology that can produce surfaces with outstanding global planarization without subsurface damage.
Chi-Hsiang Hsieh +5 more
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Chemical Engineering Transactions, 2018 Aluminium alloys are widely used in various industries because of their lightness and easy processing, leading to higher requirements for aluminium alloys in terms of the flatness and finish of aluminium alloy surface.
Yali Zhao +3 more
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Machines, 2022 Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put ...
Jianguo Yao +4 more
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MATEC Web of Conferences, 2016 An ultrasonic elliptical vibration assisted chemical mechanical polishing(UEV-CMP) is employed to achieve high material removal rate and high surface quality in the finishing of hard and brittle materials such as monocrystalline silicon, which combines ...
Liu Defu, Chen Tao, Yan Riming
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Recent Developments in Chemical Mechanical Polishing (CMP) for Precision Manufacturing
International Journal of Advanced Research in Science, Communication and Technology, 2022 Advanced developments and applications of Chemical Mechanical Planarization/Polishing (CMP) did by researchers in current decade were discussed in this article. Topics on which this article forms the basis are Abrasives and slurry developments, environment and safety conditions, manufacturing process improvements, modelling and simulations methods for ...
null Amey S. Kulkarni, null Ankur Gupta
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Slurry Design for Chemical Mechanical Polishing
KONA Powder and Particle Journal, 2014 Chemical Mechanical Polishing (CMP) process is widely used in the microelectronics industry for planarization of metal and dielectric layers to achieve multi-layer metallization.
G. Bahar Basim, Brij M. Moudgil
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Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a process that planarizes semiconductor surfaces and is essential for the manufacture of highly integrated devices.
Jungyu Son, Hyunseop Lee
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