Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review [PDF]
International Journal of Precision Engineering and Manufacturing-Green Technology, 2021 Chemical mechanical polishing (CMP) is an essential planarization process for semiconductor manufacturing. The application of CMP has been increasing in semiconductor fabrication for highly integrated devices. Recently, environmental burden caused by the CMP process was assessed because of interest in the global environment.
Lee H, Kim H, Jeong H.
europepmc +4 more sources
Research on the Application of Diamond Film in Chemical Mechanical Polishing [PDF]
NanomaterialsPolishing pad conditioners are of critical importance in chemical mechanical polishing (CMP), acting as a key determinant of CMP efficiency and an indispensable consumable in the polishing process.
Yibao Wang +10 more
doaj +2 more sources
A Comprehensive Review of the Nano-Abrasives Key Parameters Influencing the Performance in Chemical Mechanical Polishing [PDF]
NanomaterialsChemical Mechanical Polishing (CMP) is a critical process in many industries where achieving superior surface quality through controlled material removal rates by using nano-abrasives is essential.
Houda Bellahsene +5 more
doaj +2 more sources
Chemical mechanical polishing as an alternative surface treatment technique for corrosion prevention of carbon steel in an acidic medium [PDF]
Scientific ReportsChemical mechanical polishing (CMP) has been a standard technique in semiconductor manufacturing for achieving smooth surfaces. CMP utilizes a synergistic interplay of chemical and mechanical interactions to achieve the desired removal rates, selectivity,
Mohamed Ahmed +6 more
doaj +2 more sources
Investigation of the Visible Photocatalytic–Fenton Reactive Composite Polishing Process for Single-Crystal SiC Wafers Based on Response Surface Methodology [PDF]
MicromachinesThe third-generation semiconductor single-crystal silicon carbide (SiC), as a typical difficult-to-machine material, improves the chemical reaction rate on the SiC surface during the polishing process, which is key to realizing efficient chemical ...
Zijuan Han +3 more
doaj +2 more sources
Monodisperse SiO2 Spheres: Efficient Synthesis and Applications in Chemical Mechanical Polishing [PDF]
NanomaterialsThe atomic level polishing of a material surface affects the accuracy of devices and the application of materials. Silica slurries play an important role in chemical mechanical polishing (CMP) by polishing the material surface.
Jinlong Ge +7 more
doaj +2 more sources
Micromachines, 2020 Fluidized bed machining (FBM) is used for the surface finishing or cleaning of complex 3D machine parts. FBM is a process of injecting air into a chamber to encourage particles into a fluid-like state.
Taekyoung Kim, Hyunseop Lee
doaj +3 more sources
The Chemical Deformation of a Thermally Cured Polyimide Film Surface into Neutral 1,2,4,5-Benzentetracarbonyliron and 4,4′-Oxydianiline to Remarkably Enhance the Chemical–Mechanical Planarization Polishing Rate [PDF]
NanomaterialsThe rapid advancement of 3D packaging technology has emerged as a key solution to overcome the scaling-down limitation of advanced memory and logic devices.
Man-Hyup Han +10 more
doaj +2 more sources
Advanced ScienceAchieving high‐throughput, low‐damage preparation of indium phosphide (InP) surfaces remains challenging because increasing the material removal rate (MRR) in chemical mechanical polishing (CMP) often compromises ultralow roughness and requires post‐CMP ...
Shigong Fu +5 more
doaj +2 more sources
Effects of Hydrolysis Reaction and Abrasive Drag Force Accelerator on Enhancing Si-Wafer Polishing Rate and Improving Si-Wafer Surface Roughness [PDF]
NanomaterialsTo satisfy the superior surface quality requirements in the fabrication of HBM (High-Bandwidth Memory) and 3D NAND Flash Memory, high-efficiency Si chemical mechanical planarization (CMP) is essential.
Min-Uk Jeon +9 more
doaj +2 more sources