Results 51 to 60 of about 19,083 (259)

Modern scientific and practical approaches to the production of substrates from semiconductor compounds А3В5. Review

Конденсированные среды и межфазные границы
Modern electronic and optical engineering uses А3В5 single-crystal semiconductor materials (GaAs, GaSb, InAs, InSb, and InP) as substrates for epitaxial growth. These materials are obtained in the form of massive single-crystal ingots.
Elena N. Abramova, Roman Yu. Kozlov, Anatoliy I. Khokhlov, Yuriy V. Syrov, Yuriy N. Parkhomenko   +4 more
doaj   +1 more source

Affecting the Properties of Copper–Graphene Electroconductive Composite by Severe Plastic Deformation

Advanced Engineering Materials, EarlyView.
Copper‐based composites enhanced with carbon feature convenient mechanical properties and favorable electric conductivity. Processing via deformation and thermomechanical treatments can introduce advantageous microstructures further enhancing their performance. Herein, copper–graphene powder‐based composites are directly consolidated via rotary swaging
Radim Kocich, Lenka Kunčická, Pavel Czernek, Zifan Wang   +3 more
wiley   +1 more source

Understanding the Stochastic Nature of Process Parameter Development of Blown Powder Laser Beam Directed Energy Deposition Additive Manufacturing of Pure Molybdenum

Advanced Engineering Materials, EarlyView.
Identified through the use of statistical design of experiments and metallographic investigation, this study exposes the stochastic origins of intergranular cracks in blown powder laser beam directed energy deposition additive manufacturing of pure molybdenum. It further demonstrates a successful crack mitigation approach with direct correlation to the
Nathaniel J. Lies, Daniel E. Driemeyer, Aaron P. Stebner   +2 more
wiley   +1 more source

Research progress in chemical mechanical polishing of single crystal SiC substrates

Jin'gangshi yu moliao moju gongcheng, 2020
Single crystal SiC has become an important epitaxial layer material because of its excellent physical and chemical properties.It is widely used in satellite communications, integrated circuits, and consumer electronics.The growth of an epitaxial layer of
DENG Jiayun, PAN Jisheng, ZHANG Qixiang, GUO Xiaohui, YAN Qiusheng   +4 more
doaj  

Multimodal Data‐Driven Microstructure Characterization

Advanced Engineering Materials, EarlyView.
A self‐consistent autonomous workflow for EBSP‐based microstructure segmentation by integrating PCA, GMM clustering, and cNMF with information‐theoretic parameter selection, requiring no user input. An optimal ROI size related to characteristic grain size is identified.
Qi Zhang, Santiago Benito, Özge Özgün, Sebastian Weber, Markus Stricker   +4 more
wiley   +1 more source

Semiconductor Physics, Quantum Electronics & Optoelectronics, 20 (1), P. 091-095 (2017). DOI: https://doi.org/10.15407/spqeo20.01.091 The influence of ethylene glycol on the chemical interaction of PbTe and Pb1–xSnxTe crystals with H2O2–HBr–ethylene glycol etching compositions

Semiconductor Physics, Quantum Electronics & Optoelectronics, 2017
The process of cutting, mechanical and chemical treatment of the PbTe and Pb1–xSnxTe crystal surface has been studied. The dependences of the chemical-mechanical polishing rate versus dilution of the base polishing etchant H2O2–HBr–ethylene glycol by the
G.P. Malanych, V.M. Tomashyk, O.S. Lytvyn   +2 more
doaj  

Microstructure‐Controlled Crack Propagation and Fracture Resistance in MoSiBTiC Alloy Revealed by Multiscale Extended Finite Element Method Modeling

Advanced Engineering Materials, EarlyView.
A two‐dimensional multiscale finite element analysis framework was established for the first‐generation MoSiBTiC alloy, and the mechanical and fracture‐related parameters of the constituent phases were calibrated through experiments and simulations. The framework provides a basis for analyzing crack propagation behavior in its complex microstructure ...
Junfeng Du, Takahiro Kaneko, Xinyu Yan, Takahito Ohmura, Kyosuke Yoshimi   +4 more
wiley   +1 more source

Microstructure Evolution of a VMnFeCoNi High‐Entropy Alloy After Synthesis, Swaging, and Annealing

Advanced Engineering Materials, EarlyView.
The synthesis and processing (rotary swaging and annealing) of the novel VMnFeCoNi alloy is investigated, alongside the estimation of the grain size effect on hardness. Analysis of a wide grain size range of recrystallized microstructures (12–210 µm) reveals a low annealing twin density.
Aditya Srinivasan Tirunilai, Zeki Ayrildi, Buse Şen, Maik Rajkowski, Mathias Redondo Garcia, Markus Stricker, Guillaume Laplanche   +6 more
wiley   +1 more source

Slip Localization Intensification Mediated by Grain Boundary Sliding in a Polycrystalline Nickel‐Based Superalloy

Advanced Engineering Materials, EarlyView.
The temperature dependence of fatigue behavior in nickel‐based superalloys is investigated through high‐resolution measurements of plastic localization. While increasing temperature reduces localization and enhances fatigue performance in René 88DT, Inconel 718 exhibits a sharp degradation at intermediate temperature due to intensified slip ...
M. Calvat, D. Anjaria, I. Woo, C. Bean, D. Texier, J. C. Stinville   +5 more
wiley   +1 more source

Systematic analysis on the chemical reaction to the material removal in bonnet polishing of fused silica glass

Journal of Materials Research and Technology
Fused silica glass, known for its exceptional physical and chemical properties, is widely used across diverse industries. Cerium oxide (CeO2), a common polishing abrasive, is extensively employed in polishing fused silica surfaces.
Xiaolong Ke, Wei Wu, Bo Zhong, Tianyi Wang, Song Yuan, Zhenzhong Wang, Daewook Kim, Jianchun Liu, Min Li, Jiang Guo, Chunjin Wang   +10 more
doaj   +1 more source