Results 51 to 60 of about 6,632 (142)
Colloid Aspects of Chemical-Mechanical Planarization
Kemija u Industriji, 2010 The essential parts of interconnects for silicon based logic and memory devices consist of metal wiring (e.g. copper), a barrier metal (Ta, TaN), and of insulation (SiO2 , low-k polymer).
Matijević, E., Babu, S. E.
doaj
Advances in Materials Science and Engineering, 2014 Chemical mechanical polishing (CMP) technology is extensively used in the global planarization of highly value-added and large components in the aerospace industry. A nanopowder of SiO2 was prepared by the sol-gel method and was compounded into polishing
M. J. Kao, F. C. Hsu, D. X. Peng
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Scalable methods for ultra-smooth platinum in nanoscale devices
Micro and Nano Engineering, 2019 Ultra-smooth metal structures are increasingly important in nanoscale device applications, from photonics to molecular electronics and 2D material growth.
Charmaine Chia +2 more
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Machines, 2022 Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are put ...
Jianguo Yao +4 more
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Nanomaterials, 2022 Recently, as an alternative solution for overcoming the scaling-down limitations of logic devices with design length of less than 3 nm and enhancing DRAM operation performance, 3D heterogeneous packaging technology has been intensively researched ...
Jae-Young Bae +7 more
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Role of the Oxidation State in Cobalt Chemical Mechanical Planarization
MetalMatCobalt (Co) is a promising next‐generation contact metal to replace tungsten for the system‐large‐scale integration devices beyond the 5 nm technology node due to its low resistivity and high gap‐filling capability at high aspect ratios.
Ganggyu Lee +7 more
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Nanomaterials, 2022 To scale down semiconductor devices to a size less than the design rule of 10 nm, lithography using a carbon polymer hard-mask was applied, e.g., spin-on-carbon (SOC) film.
Jun-Myeong Lee +6 more
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Process development of silicon-silicon carbide hybrid structures for micro-engines (January 2002) [PDF]
, 2002 MEMS-based gas turbine engines are currently under development at MIT for use as a button-sized portable power generator or micro-aircraft propulsion sources. Power densities expected for the micro-engines require very high rotor peripheral speeds of 300-
Choi, D. +2 more
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Ultrathin TaN Damascene Nanowire Structures on 300-mm Si Wafers for Quantum Applications
IEEE Transactions on Quantum Engineering, 2023 We report on the development and characterization of superconducting damascene tantalum nitride (TaN) nanowires, 100 nm–3 μm wide, with TaN thicknesses varying from 5 to 35 nm, using 193-nm optical lithography and chemical mechanical ...
Ekta Bhatia +19 more
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Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures [PDF]
, 2004 Long the dominant method of wafer planarization in the integrated circuit (IC) industry, chemical-mechanical polishing is starting to play an important role in microelectromechnical systems (MEMS).
Boning, Duane S., Tang, Brian D.
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