Chemical–mechanical planarization

Results 81 to 90 of about 6,632 (142)

Coupling Supramolecular Assemblies and Reactive Oxygen Species (ROS) with Megasonic Action for Applications in Shallow Trench Isolation (STI) Post-Chemical Mechanical Planarization (p-CMP) Cleaning. [PDF]

ACS Omega, 2022
Wortman-Otto KM, Watson D, Dussault D, Keleher JJ. +3 more
europepmc +1 more source

Side-wall metallization process for enhanced electrical contact in SOI-based MEMS switches

Micro and Nano Engineering
MEMS inertial switches provide a zero-power alternative to conventional accelerometers by mechanically closing an electrical contact only when a specific acceleration threshold is exceeded.
Inês S. Garcia +9 more
doaj +1 more source

A Mechanical Model for Erosion in Copper Chemical-Mechanical Polishing [PDF]

, 2003
The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron feature size, the ...
Chun, Jung-Hoon, Noh, Kyungyoon, Saka, Nannaji +2 more
core

Mitigating Galvanic Corrosion of Molybdenum Diffusion Barriers in Chemical Mechanical Planarization of Copper Interconnects: A Case Study Using Imidazole in a Citrate Slurry of Neutral pH

Electrochem
Molybdenum (Mo) is currently considered as a potential diffusion barrier material for copper (Cu) interconnects, and these interconnect structures are generally processed using the technique of chemical mechanical planarization (CMP).
Kassapa U. Gamagedara, Dipankar Roy
doaj +1 more source

The Chemical Deformation of a Thermally Cured Polyimide Film Surface into Neutral 1,2,4,5-Benzentetracarbonyliron and 4,4'-Oxydianiline to Remarkably Enhance the Chemical-Mechanical Planarization Polishing Rate. [PDF]