Results 1 to 10 of about 128 (97)
Chemical Mechanical Planarization and Old Italian Violins [PDF]
Micromachines, 2018 Previous studies have shown that spectral analysis based on force data can elucidate fundamental physical phenomena during chemical mechanical planarization (CMP). While it has not been literally described elsewhere, such analysis was partly motivated by
Ara Philipossian +2 more
doaj +3 more sources
Particle Technology in Chemical Mechanical Planarization
KONA Powder and Particle Journal, 2014 In order to keep pace with Moore’s law, multilevel metallization has become the process of choice. Having a planar wafer surface before every successive step in multilevel metallization is important. The Chemical
Kalyan S. Gokhale, Brij M. Moudgil
doaj +3 more sources
Colloid Aspects of Chemical-Mechanical Planarization
Kemija u Industriji, 2010 The essential parts of interconnects for silicon based logic and memory devices consist of metal wiring (e.g. copper), a barrier metal (Ta, TaN), and of insulation (SiO2 , low-k polymer).
Matijević, E., Babu, S. E.
doaj +1 more source
Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper
Applied Sciences, 2021 Chemical–mechanical polishing (CMP) is a planarization process that utilizes chemical reactions and mechanical material removal using abrasive particles.
Seonghyun Park, Hyunseop Lee
doaj +1 more source
Chemical–Mechanical Polishing of 4H Silicon Carbide Wafers
Advanced Materials Interfaces, 2023 4H silicon carbide (4H‐SiC) holds great promise for high‐power and high‐frequency electronics, in which high‐quality 4H‐SiC wafers with both global and local planarization are cornerstones.
Wantang Wang +6 more
doaj +1 more source
Applied Sciences, 2021 In the fabrication of semiconductors, chemical mechanical polishing (CMP) is an essential wafer-planarization process. For optimal CMP, it is crucial to monitor the texture of the polishing pad; this leads to homogenous planarization of wafers. Hence, we
Eun-Soo Kim, Woo-June Choi
doaj +1 more source
Investigation of the Two-Way Injection Slurry-Supply Method for the Cu CMP Process
Applied Sciences, 2023 The effect of the two-way injection method during a copper chemical mechanical planarization (CMP) process was investigated. The two-way slurry-injection method has the advantage of not only preventing the degradation of the slurry, but also shortening ...
Chulwoo Bae +4 more
doaj +1 more source
Applied Sciences, 2022 Topography of tungsten should be assured at a minimum through chemical mechanical planarization (CMP) in the metal gate structures (e.g., buried gates, replacement metal gates) and via contact in the middle of line (MOL) process for sub−7 nm ...
Kangchun Lee, Jihoon Seo
doaj +1 more source
Applied Sciences, 2021 Chemical mechanical planarization (CMP) is a technology widely employed in device integration and planarization processes used in semiconductor fabrication. In CMP, the polishing pad plays a key role both mechanically and chemically.
Seonho Jeong +3 more
doaj +1 more source
Lubricants, 2017 This paper provides a tribochemical study of the selective layer surface by chemical mechanical planarization (CMP). CMP is used to remove excess material obtained in the process of selective transfer.
Filip Ilie, George Ipate
doaj +1 more source