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Directions in the Chemical Mechanical Planarization Research
MRS Proceedings, 1999Planarized surfaces have become key to the success of advanced semiconductor devises/circuits/chips. The planarization, achieved by the use of chemical mechanical means, has enabled the interconnection of ever increasing number of devices and also the use of lower resistivity copper as the interconnect material for such devices.
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Chemical-Mechanical Planarization of Semiconductor Materials
20041 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.
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Evolving Preston’s Equation in Chemical Mechanical Planarization
ECS Meeting AbstractsThe evolution of semiconductor devices necessitates greater control parameters for enhancing CMP process controllability. Historically, CMP engineers have sought to improve polishing process performance by real-time control of time, pressure, and velocity using Preston’s equation. However, Preston’s equation has traditionally addressed blanket-wafer
Jichul Yang +4 more
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Integrative oncology: Addressing the global challenges of cancer prevention and treatment
Ca-A Cancer Journal for Clinicians, 2022Jun J Mao,, Msce +2 more
exaly
Cobalt “Buff Step” Chemical Mechanical Planarization
ECS Journal of Solid State Science and Technology, 2018Calliandra Stuffle +5 more
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Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms
Chemical Reviews, 2009Mahadevaiyer, Krishnan +2 more
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