The Effects of Friction and Temperature in the Chemical-Mechanical Planarization Process. [PDF]
Materials (Basel), 2023 Ilie F +3 more
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Optical Characterization of Industrial Slurries
KONA Powder and Particle Journal, 2015 In this work we focus on the characterization of micro- and nano-powders typically adopted for chemical mechanical polishing, extensively used whenever the global and local planarization of surfaces is required as in nanoelectronic fabs.
Marco Potenza +2 more
doaj +1 more source
Coupling Supramolecular Assemblies and Reactive Oxygen Species (ROS) with Megasonic Action for Applications in Shallow Trench Isolation (STI) Post-Chemical Mechanical Planarization (p-CMP) Cleaning. [PDF]
ACS Omega, 2022 Wortman-Otto KM +3 more
europepmc +1 more source
Side-wall metallization process for enhanced electrical contact in SOI-based MEMS switches
Micro and Nano EngineeringMEMS inertial switches provide a zero-power alternative to conventional accelerometers by mechanically closing an electrical contact only when a specific acceleration threshold is exceeded.
Inês S. Garcia +9 more
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Yield improvement of chemical mechanical planarization processes
, 2018 Chemical mechanical polishing (CMP) is a planarization process that produces high quality surfaces both locally and globally. It is one of the key process steps during fabrication of very large scale integrated (VLSI) chips in integrated circuit (IC) manufacturing.
openaire +3 more sources
The Chemical Deformation of a Thermally Cured Polyimide Film Surface into Neutral 1,2,4,5-Benzentetracarbonyliron and 4,4'-Oxydianiline to Remarkably Enhance the Chemical-Mechanical Planarization Polishing Rate. [PDF]
Nanomaterials (Basel)Han MH +10 more
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Tribo-Electrochemical Mechanism of Material Removal Examined for Chemical Mechanical Planarization of Stainless-Steel Using Citrate Buffer as a Complexing Agent. [PDF]
Materials (Basel)Santefort DR, Gamagedara KU, Roy D.
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Novel Probability Density Function of Pad Asperity by Wear Effect over Time in Chemical Mechanical Planarization. [PDF]
Materials (Basel)Jeong S +4 more
europepmc +1 more source
A flexible nanobrush pad for the chemical mechanical planarization of Cu/ultra-low-к materials. [PDF]
Nanoscale Res Lett, 2012 Han G, Liu Y, Lu X, Luo J.
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CMOS-Compatible Fabrication Module for Sub-100 nm TiN and TaN Pillar Electrodes for Carbon Nanotube Test Structures. [PDF]
Nanomaterials (Basel)Chen G, Fujii T, Yamada T, Hata K.
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