Novel Probability Density Function of Pad Asperity by Wear Effect over Time in Chemical Mechanical Planarization. [PDF]
Jeong S +4 more
europepmc +1 more source
A flexible nanobrush pad for the chemical mechanical planarization of Cu/ultra-low-к materials. [PDF]
Han G, Liu Y, Lu X, Luo J.
europepmc +1 more source
5 x 20 Gb/s heterogeneously integrated III-V on silicon electro-absorption modulator array with arrayed waveguide grating multiplexer [PDF]
Bauwelinck, Johan +15 more
core +1 more source
YO nanosheets as slurry abrasives for chemical-mechanical planarization of copper [PDF]
core +1 more source
CMOS-Compatible Fabrication Module for Sub-100 nm TiN and TaN Pillar Electrodes for Carbon Nanotube Test Structures. [PDF]
Chen G, Fujii T, Yamada T, Hata K.
europepmc +1 more source
Flow-Induced Dynamic Dispersion in Dispersant-Free Mixed-Oxide Slurry Systems. [PDF]
Lin YA +6 more
europepmc +1 more source
Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration and Contamination. [PDF]
Lee E +7 more
europepmc +1 more source
Process Temperature Control for Low Dishing in CMP. [PDF]
Shin Y, Jeong J, Shin J, Jeong H.
europepmc +1 more source
Planarization of Twisted Push-Pull Probes by Stretching Rather than by Compression: Core-Substituted Fluorescent Flippers as Materials Mechanosensors. [PDF]
Pamungkas KKP +5 more
europepmc +1 more source

