Results 121 to 130 of about 6,682 (189)

Hydrocolloid-Based Multiwavelength Stretchable QD-OLED Patch for Simultaneous Neonatal Jaundice and Dermatitis Treatment with Biosignal Monitoring. [PDF]

Adv Healthc Mater
Kim IH, Kim YW, Jeong JY, Shin YJ, Lee C, Choi JG, Kwon OK, Kim KH, Kwon SJ, Cho ES, Jeon Y.   +10 more
europepmc   +1 more source

An Analysis of Arrays with Irregular Apertures in MEMS Smart Glasses for the Improvement of Clear View. [PDF]

Micromachines (Basel)
Donatiello R, Iskhandar MSQ, Hasan MK, Kästner P, Qasim MH, Chen J, Baby S, Elsaka B, Xu G, Hillmer H.   +9 more
europepmc   +1 more source

Tailoring luminescent oxygen sensitivity <i>via</i> structural design and its application in pressure-induced emission enhancement. [PDF]

Chem Sci
Zhang HJ, Chen ZR, Chen WT, Ye JW, Chen L.   +4 more
europepmc   +1 more source

Non-macrocyclic molecular design enables cavity-adaptive cocrystals with high elasticity and low-threshold lasing. [PDF]

Nat Commun
Feng Z, Zhu Y, Han C, Ni H, Zhang L, Wei C, Chen X, Meng Z, Zhao Y, Lei Y.   +9 more
europepmc   +1 more source

Some of the next articles are maybe not open access.

Related searches:

Colloid aspects of chemical–mechanical planarization

Journal of Colloid and Interface Science, 2008
The essential parts of interconnects for silicon based logic and memory devices consist of metal wiring (e.g. copper), a barrier metal (Ta, TaN), and of insulation (SiO2, low-k polymer). The deposition of the conducting metal cannot be confined to trenches, resulting in additional coverage of Cu and Ta/TaN on the surface of the dielectrics, yielding an
E, Matijević, S V, Babu
openaire   +2 more sources

Chemical mechanical planarization of gold

Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 2014
In this article, the authors investigate chemical mechanical planarization (CMP) of gold. Our experiments show that the oxidizer concentration, hardness of the adhesion layer, and surfactants added to stabilize the slurry are the main factors determining the outcome of the process.
Golnaz Karbasian, Patrick J. Fay, Huili Grace Xing, Alexei O. Orlov, Gregory L. Snider   +4 more
openaire   +1 more source

Advances in Chemical-Mechanical Planarization

MRS Bulletin, 2002
AbstractThe primary aim of this issue of MRS Bulletin is to present an overview of the materials issues in chemical–mechanical planarization (CMP), also known as chemical–mechanial polishing, a process that is used in the semiconductor industry to isolate and connect individual transistors on a chip.
Rajiv K. Singh, Rajeev Bajaj
openaire   +1 more source