Results 151 to 160 of about 6,682 (189)

Chemical-mechanical planarization advances with the times

IEEE Potentials, 2008
CMP has come a long way from its beginnings as just a simple method for polishing oxide materials to a smooth, finished surface. Today, chemical-mechanical planarization plays a critical role in contemporary integrated circuit processing, and it will still be needed for at least the next ten years as the scale of IC geometries continues to shrink.
Vijayakumar, Arun, Todi, Ravi M., Tianbao, Du   +2 more
openaire   +2 more sources

Optical endpoint detection for chemical mechanical planarization

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 1999
We present product wafer and laboratory test results of a production worthy, in situ, broadband optical endpoint system in the context of a simple model that describes the reflectance of semiconductor wafers during chemical mechanical planarization. Broadband and single wavelength approaches are presented.
Thomas Bibby, John A. Adams, Karey Holland   +2 more
openaire   +1 more source

Physics and tribology of chemical mechanical planarization

Journal of Physics: Condensed Matter, 2008
The physical and tribological attributes of the chemical mechanical planarization (CMP) process are reviewed. Kinematic analysis of a CMP polisher is described, which can be applied in establishing tribological models. These models elucidate the lubrication regimes at the workpiece/polishing pad interface at the macroscale in order to examine the ...
Toshi Kasai, Bharat Bhushan
openaire   +1 more source

Chemical-Mechanical Planarization of Semiconductor Materials

2004
1 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.
openaire   +1 more source

Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms

Chemical Reviews, 2009
Mahadevaiyer, Krishnan, Jakub W, Nalaskowski, Lee M, Cook   +2 more
openaire   +2 more sources

Integrative oncology: Addressing the global challenges of cancer prevention and treatment

Ca-A Cancer Journal for Clinicians, 2022
Jun J Mao,, Msce, Lorenzo Cohen, Karen M Mustian   +2 more
exaly  

Chemical-mechanical planarization

2010
David K Watts, Norio Kimura, Manabu Tsujimura   +2 more
openaire   +1 more source

Chemical – mechanical planarization

2004
David Watts, Norio Kimura, Manabu Tsujimura   +2 more
openaire   +1 more source

Contact mechanics and lubrication hydrodynamics of chemical-mechanical planarization

2001
The technology of chemical-mechanical planarization (or polishing), CMP, has recently received considerable attention in the electronics manufacturing industry of the US. It is a cost-effective process to attain a high degree of required global planarity in the production of integrated circuit components. This paper reports on a fully three-dimensional
openaire   +1 more source

Study on microcontact mechanism of chemical mechanical planarization removing

5th International Conference on Computer Information Science and Application Technology (CISAT 2022), 2022
jianchao wang, Xuejing Bai, han liu
openaire   +1 more source